公开(公告)号：US09099525B2

公开(公告)日：2015-08-04

申请号：US13729207

申请日：2012-12-28

Applicant: Laegu Kang ,  Vara Govindeswara Reddy Vakada ,  Michael P. Ganz ,  Yi Qi ,  Puneet Khanna ,  Sri Charan Vemula ,  Srikanth Samavedam

Inventor： Laegu Kang ,  Vara Govindeswara Reddy Vakada ,  Michael P. Ganz ,  Yi Qi ,  Puneet Khanna ,  Sri Charan Vemula ,  Srikanth Samavedam

IPC: H01L21/762 ,  H01L29/66 ,  H01L29/10 ,  H01L21/8238 ,  H01L29/165

CPC classification number: H01L29/0692 ,  H01L21/76224 ,  H01L21/823807 ,  H01L21/823878 ,  H01L21/823892 ,  H01L29/0649 ,  H01L29/1054 ,  H01L29/1095 ,  H01L29/165 ,  H01L29/167 ,  H01L29/66651

Abstract: A method of forming SSRW FETs with controlled step height between a field oxide and epitaxially grown silicon and the resulting devices are provided. Embodiments include providing a SiN layer on a substrate, forming first, second, and third spaced STI regions of field oxide through the SiN layer and into the substrate, removing a top portion of the field oxide for each STI region by a controlled deglaze, removing the SiN layer, forming an n-type region in the substrate between the first and second STI regions and a p-type region in the substrate between the second and third STI regions, and epitaxially growing a Si based layer on the substrate over the n-type and p-type regions.

Abstract translation: 提供了在场氧化物和外延生长的硅之间形成具有受控步长的SSRW FET的方法以及所得到的器件。 实施例包括在衬底上提供SiN层，通过SiN层形成第一，第二和第三间隔的场区氧化物的STI区域并进入衬底，通过受控的消光去除每个STI区域的场氧化物的顶部部分，去除 SiN层，在第一和第二STI区域之间的衬底中形成n型区域和在第二和第三STI区域之间的衬底中的p型区域，并且在衬底上在n上外延生长Si基层 型和p型区。

公开(公告)号：US08809178B2

公开(公告)日：2014-08-19

申请号：US13408139

申请日：2012-02-29

Applicant: Yanxiang Liu ,  Michael Hargrove ,  Xiaodong Yang ,  Hans van Meer ,  Laegu Kang ,  Christian Gruensfelder ,  Srikanth Samavedam

Inventor： Yanxiang Liu ,  Michael Hargrove ,  Xiaodong Yang ,  Hans van Meer ,  Laegu Kang ,  Christian Gruensfelder ,  Srikanth Samavedam

IPC: H01L21/4763

CPC classification number: H01L29/66545 ,  H01L29/66795

Abstract: One illustrative method disclosed herein includes forming a plurality of spaced-apart trenches in a semiconducting substrate to thereby define a fin structure for the device, forming a local isolation region within each of the trenches, forming a sacrificial gate structure on the fin structure, wherein the sacrificial gate structure comprises at least a sacrificial gate electrode, and forming a layer of insulating material above the fin structure and within the trench above the local isolation region. In this example, the method further includes performing at least one etching process to remove the sacrificial gate structure to thereby define a gate cavity, after removing the sacrificial gate structure, performing at least one etching process to form a recess in the local isolation region, and forming a replacement gate structure that is positioned in the recess in the local isolation region and in the gate cavity.

Abstract translation: 本文公开的一种说明性方法包括在半导体衬底中形成多个间隔开的沟槽，从而限定用于器件的鳍结构，在每个沟槽内形成局部隔离区，在翅片结构上形成牺牲栅极结构，其中 所述牺牲栅极结构至少包括牺牲栅电极，以及在所述鳍结构之上和所述局部隔离区之上的沟槽内形成绝缘材料层。 在该示例中，该方法还包括执行至少一个蚀刻工艺以去除牺牲栅极结构，从而在去除牺牲栅极结构之后，确定栅极腔，执行至少一个蚀刻工艺以在局部隔离区域中形成凹陷， 以及形成位于局部隔离区域和门腔中的凹部中的替换栅极结构。

公开(公告)号：US20120273894A1

公开(公告)日：2012-11-01

申请号：US13094873

申请日：2011-04-27

Applicant: Xiangdong Chen ,  Laegu Kang ,  Weipeng Li ,  Dae-Gyu Park ,  Melanie J. Sherony

Inventor： Xiangdong Chen ,  Laegu Kang ,  Weipeng Li ,  Dae-Gyu Park ,  Melanie J. Sherony

IPC: H01L27/092 ,  H01L21/8238

CPC classification number: H01L21/823807 ,  H01L21/28176 ,  H01L21/3003 ,  H01L21/8258 ,  H01L29/1054 ,  H01L29/665 ,  H01L29/7843

Abstract: An integrated circuit structure comprises at least one pair of complementary transistors on a substrate. The pair of complementary transistors includes a first transistor and a second transistor. In addition, only one stress-producing layer is on the first transistor and the second transistor and applies tensile strain force on the first transistor and the second transistor. The first transistor has a first channel region, a gate insulator on the first channel region, and a deuterium region between the first channel region and the gate insulator. The second transistor has a germanium doped channel region, as well as the same gate insulator on the germanium doped channel region, and the same deuterium region between the germanium doped channel region and the gate insulator.

Abstract translation: 集成电路结构在衬底上包括至少一对互补晶体管。 一对互补晶体管包括第一晶体管和第二晶体管。 此外，在第一晶体管和第二晶体管上只有一个应力产生层，并且在第一晶体管和第二晶体管上施加拉伸应变力。 第一晶体管具有第一沟道区，第一沟道区上的栅极绝缘体，以及第一沟道区和栅绝缘体之间的氘区。 第二晶体管具有锗掺杂沟道区以及锗掺杂沟道区上的相同栅极绝缘体以及锗掺杂沟道区和栅绝缘体之间的相同氘区。

公开(公告)号：US07528078B2

公开(公告)日：2009-05-05

申请号：US11433298

申请日：2006-05-12

Applicant: Toni D. Van Gompel ,  Kuang-Hsin Chen ,  Laegu Kang ,  Rode R. Mora ,  Michael D. Turner

Inventor： Toni D. Van Gompel ,  Kuang-Hsin Chen ,  Laegu Kang ,  Rode R. Mora ,  Michael D. Turner

IPC: H01L21/31 ,  H01L21/469

CPC classification number: H01L21/31111 ,  H01L21/3105 ,  H01L21/31116 ,  H01L21/76205

Abstract: A process of forming an electronic device can include patterning a semiconductor layer to define an opening extending to an insulating layer, wherein the insulating layer lies between a substrate and the semiconductor layer. After patterning the semiconductor layer, the opening can have a bottom, and the semiconductor layer can have a sidewall and a surface. The surface can be spaced apart from the insulating layer, and the sidewall can extend from the surface towards the insulating layer. The process can also include depositing a nitride layer within the opening, wherein depositing is performed using a PECVD technique. The process can further include densifying the nitride layer. The process can still further include removing a part of the nitride layer, wherein a remaining portion of the nitride layer can lie within the opening and be spaced apart from the surface.

Abstract translation: 形成电子器件的过程可以包括图案化半导体层以限定延伸到绝缘层的开口，其中绝缘层位于衬底和半导体层之间。 在图案化半导体层之后，开口可以具有底部，并且半导体层可以具有侧壁和表面。 表面可以与绝缘层间隔开，并且侧壁可以从表面延伸到绝缘层。 该方法还可以包括在开口内沉积氮化物层，其中使用PECVD技术进行沉积。 该方法还可以包括使氮化物层致密化。 该方法还可以进一步包括去除氮化物层的一部分，其中氮化物层的剩余部分可以位于开口内并且与表面间隔开。

公开(公告)号：US20070264839A1

公开(公告)日：2007-11-15

申请号：US11433298

申请日：2006-05-12

Applicant: Toni Van Gompel ,  Kuang-hsin Chen ,  Laegu Kang ,  Rode Mora ,  Michael Turner

Inventor： Toni Van Gompel ,  Kuang-hsin Chen ,  Laegu Kang ,  Rode Mora ,  Michael Turner

IPC: H01L21/31 ,  H01L21/469

CPC classification number: H01L21/31111 ,  H01L21/3105 ,  H01L21/31116 ,  H01L21/76205

Abstract: A process of forming an electronic device can include patterning a semiconductor layer to define an opening extending to an insulating layer, wherein the insulating layer lies between a substrate and the semiconductor layer. After patterning the semiconductor layer, the opening can have a bottom, and the semiconductor layer can have a sidewall and a surface. The surface can be spaced apart from the insulating layer, and the sidewall can extend from the surface towards the insulating layer. The process can also include depositing a nitride layer within the opening, wherein depositing is performed using a PECVD technique. The process can further include densifying the nitride layer. The process can still further include removing a part of the nitride layer, wherein a remaining portion of the nitride layer can lie within the opening and be spaced apart from the surface.

Abstract translation: 形成电子器件的过程可以包括图案化半导体层以限定延伸到绝缘层的开口，其中绝缘层位于衬底和半导体层之间。 在图案化半导体层之后，开口可以具有底部，并且半导体层可以具有侧壁和表面。 表面可以与绝缘层间隔开，并且侧壁可以从表面延伸到绝缘层。 该方法还可以包括在开口内沉积氮化物层，其中使用PECVD技术进行沉积。 该方法还可以包括使氮化物层致密化。 该方法还可以进一步包括去除氮化物层的一部分，其中氮化物层的剩余部分可以位于开口内并且与表面间隔开。

公开(公告)号：US20070224772A1

公开(公告)日：2007-09-27

申请号：US11386539

申请日：2006-03-21

Applicant: Mark Hall ,  Rode Mora ,  Michael Turner ,  Laegu Kang ,  Toni Van Gompel ,  Stanley Filipiak

Inventor： Mark Hall ,  Rode Mora ,  Michael Turner ,  Laegu Kang ,  Toni Van Gompel ,  Stanley Filipiak

IPC: H01L21/76

CPC classification number: H01L21/76283 ,  H01L21/76286 ,  H01L21/823807 ,  H01L21/823878 ,  H01L29/7846

Abstract: A method for making a semiconductor device is provided herein. In accordance with the method, a semiconductor structure is provided which comprises an active semiconductor layer (224) disposed on a buried dielectric layer (222). A trench (229) is created in the semiconductor structure which exposes a portion of the buried dielectric layer. An oxide layer (250) is formed over the surfaces of the trench, and at least one stressor structure (255) is formed over the oxide layer.

Abstract translation: 本发明提供制造半导体器件的方法。 根据该方法，提供了一种半导体结构，其包括设置在掩埋介电层（222）上的有源半导体层（224）。 在半导体结构中形成沟槽（229），其暴露了一部分埋入的介质层。 在沟槽的表面上形成氧化物层（250），在氧化物层上形成至少一个应力源结构（255）。

公开(公告)号：US20060284260A1

公开(公告)日：2006-12-21

申请号：US11158022

申请日：2005-06-21

Applicant: Byoung Min ,  Laegu Kang ,  Michael Khazhinsky

Inventor： Byoung Min ,  Laegu Kang ,  Michael Khazhinsky

IPC: H01L29/94

CPC classification number: H01L29/8611 ,  H01L27/0255 ,  H01L29/66136 ,  H01L29/868

Abstract: A method for making a semiconductor device is provided. The method comprises (a) providing a semiconductor stack comprising a semiconductor substrate (203), a first semiconductor layer (205), and a first dielectric layer (207) disposed between the substrate and the first semiconductor layer; (b) forming a first trench in the first dielectric layer which exposes a portion of the substrate; (c) forming a first doped region (209) in the exposed portion of the substrate; and (d) forming anode (211) and cathode (213) regions in the first implant region.

Abstract translation: 提供一种制造半导体器件的方法。 该方法包括（a）提供包括半导体衬底（203），第一半导体层（205）和设置在衬底和第一半导体层之间的第一电介质层（207）的半导体堆叠; （b）在所述第一电介质层中形成暴露所述衬底的一部分的第一沟槽; （c）在所述衬底的暴露部分中形成第一掺杂区域（209）; 和（d）在第一注入区域中形成阳极（211）和阴极（213）区域。

公开(公告)号：US08106462B2

公开(公告)日：2012-01-31

申请号：US12687374

申请日：2010-01-14

Applicant: Xiangdong Chen ,  Weipeng Li ,  Anda C. Mocuta ,  Dae-Gyu Park ,  Melanie J. Sherony ,  Kenneth J. Stein ,  Haizhou Yin ,  Franck Arnaud ,  Jin-Ping Han ,  Laegu Kang ,  Yong Meng Lee ,  Young Way Teh ,  Voon-Yew Thean ,  Da Zhang

Inventor： Xiangdong Chen ,  Weipeng Li ,  Anda C. Mocuta ,  Dae-Gyu Park ,  Melanie J. Sherony ,  Kenneth J. Stein ,  Haizhou Yin ,  Franck Arnaud ,  Jin-Ping Han ,  Laegu Kang ,  Yong Meng Lee ,  Young Way Teh ,  Voon-Yew Thean ,  Da Zhang

IPC: H01L27/092

CPC classification number: H01L21/823807 ,  H01L29/7843

Abstract: An integrated circuit structure includes a substrate and at least one pair of complementary transistors on or in the substrate. The pair of complementary transistors comprises a first transistor and a second transistor. The structure also includes a first stress-producing layer on the first transistor and the second transistor, and a second stress-producing layer on the first stress-producing layer over the first transistor and the second transistor. The first stress-producing layer applies tensile strain force on the first transistor and the second transistor. The second stress-producing layer applies compressive strain force on the first stress-producing layer, the first transistor, and the second transistor.

Abstract translation: 集成电路结构包括衬底和衬底上或衬底中的至少一对互补晶体管。 该对互补晶体管包括第一晶体管和第二晶体管。 该结构还包括第一晶体管和第二晶体管上的第一应力产生层，以及在第一晶体管和第二晶体管上的第一应力产生层上的第二应力产生层。 第一应力产生层在第一晶体管和第二晶体管上施加拉伸应变力。 第二应力产生层对第一应力产生层，第一晶体管和第二晶体管施加压缩应变力。

公开(公告)号：US07795089B2

公开(公告)日：2010-09-14

申请号：US11680219

申请日：2007-02-28

Applicant: Laegu Kang ,  Vishal P. Trivedi ,  Da Zhang

Inventor： Laegu Kang ,  Vishal P. Trivedi ,  Da Zhang

IPC: H01L21/8238

CPC classification number: H01L29/7843 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823878 ,  H01L21/84 ,  H01L29/165 ,  H01L29/665 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/66772

Abstract: A semiconductor device structure is made on a semiconductor substrate having a semiconductor layer having isolation regions. A first gate structure is formed over a first region of the semiconductor layer, and a second gate structure is over a second region of the semiconductor layer. A first insulating layer is formed over the first and second regions. The first insulating layer can function as a mask during an etch of the semiconductor layer and can be removed selective to the isolation regions and the sidewall spacers. The first insulating layer is removed from over the first region to leave a remaining portion of the first insulating layer over the second region. The semiconductor layer is recessed in the first region adjacent to the first gate to form recesses. A semiconductor material is epitaxially grown in the recesses. The remaining portion of the first insulating layer is removed.

Abstract translation: 在具有具有隔离区域的半导体层的半导体衬底上制造半导体器件结构。 第一栅极结构形成在半导体层的第一区域上，第二栅极结构在半导体层的第二区域之上。 在第一和第二区域上形成第一绝缘层。 第一绝缘层可以在半导体层的蚀刻期间用作掩模，并且可以选择性地去除隔离区域和侧壁间隔物。 从第一区域上去除第一绝缘层，以在第二区域上留下第一绝缘层的剩余部分。 半导体层凹入与第一栅极相邻的第一区域中以形成凹陷。 在凹部中外延生长半导体材料。 去除第一绝缘层的剩余部分。

公开(公告)号：US07517742B2

公开(公告)日：2009-04-14

申请号：US11158021

申请日：2005-06-21

Applicant: Byoung W. Min ,  Laegu Kang ,  Michael Khazhinsky

Inventor： Byoung W. Min ,  Laegu Kang ,  Michael Khazhinsky

IPC: H01L21/20

CPC classification number: H01L21/84 ,  H01L27/0255 ,  H01L27/1203

Abstract: A method for making a semiconductor device is provided herein. In accordance with the method, a semiconductor stack is provided which includes a semiconductor substrate, a first semiconductor layer, and a first dielectric layer disposed between the substrate and the first semiconductor layer. A first trench is formed in the first dielectric layer which exposes a portion of the substrate, and a first implant region is formed in the first trench. Cathode and anode regions are formed in the first implant region.

Abstract translation: 本发明提供制造半导体器件的方法。 根据该方法，提供一种半导体堆叠，其包括半导体衬底，第一半导体层和设置在衬底和第一半导体层之间的第一电介质层。 在第一电介质层中形成第一沟槽，其暴露衬底的一部分，并且在第一沟槽中形成第一注入区域。 阴极和阳极区域形成在第一植入区域中。