摘要:
A high frequency semiconductor module, includes: a semiconductor chip having top and bottom surfaces; a semiconductor element merged in the semiconductor chip; a ground pad of the semiconductor element disposed on the top surface; a metal layer configured to connect to the ground pad and extend to sidewalls of the semiconductor chip; a ground metal arranged on a surface of a mounting substrate; and a conductive material formed on the ground, configured to connect the metal layer and the ground metal.
摘要:
On an n-type semiconductor substrate 41 doped in high density, a p-type semiconductor layer 2, an n-type semiconductor layer 4 doped in high density, which is a collector, a p-type semiconductor layer 6 doped in high density, which is a base, and the n-type semiconductor layer 7, which is an emitter, are sequentially stacked. To the collector layer, a collector electrode 12 is electrically connected, and to the base layer, a base electrode 11 is electrically connected, and to the emitter layer, an emitter electrode 9 is electrically connected, and thus a bipolar transistor is structured. On the bipolar transistor, an insulated isolation area 55 is formed with an opening therein, whose depth reaches the surface of the substrate, and a substrate electrode 48 is formed thereon. On the bipolar transistor and the insulated isolation area 55, an inter-layer dielectric layer 54 is formed having contact holes formed to upper parts of the emitter electrode 49 and to the substrate electrode 48. The emitter electrode 49 and the substrate electrode 48 are connected to each other by ground wiring.
摘要:
A method of manufacturing semiconductor devices by ion implantation, comprising the steps of, i) implanting P ions and ions selected from Si or Group II elements to the same region of GaAs or AlGaAs material, ii) performing a heat treatment to said ion implanted region for activation. Also disclosed are semiconductor devices manufactured according to this method.
摘要:
A multi-layered structure in which a p-3C-SiC layer 102 is formed above a p-Si substrate 101 is formed, above which an I-GaN layer (channel layer) 103, an n-AlGaN layer (barrier layer) 104 are formed. A source electrode 201, a drain electrode 202, and a gate electrode 203 are formed above the n-AlGaN layer 104. The source electrode 201 and the drain electrode 202 form an ohmic contact with the n-AlGaN layer 104. The gate electrode 203 forms a Schottky junction with the n-AlGaN layer 104.
摘要:
A high frequency semiconductor module, includes: a semiconductor chip having top and bottom surfaces; a semiconductor element merged in the semiconductor chip; a ground pad of the semiconductor element disposed on the top surface; a metal layer configured to connect to the ground pad and extend to sidewalls of the semiconductor chip; a ground metal arranged on a surface of a mounting substrate; and a conductive material formed on the ground, configured to connect the metal layer and the ground metal.
摘要:
According to the present invention, there is a provided a semiconductor device having, a collector contact layer made of an n-type GaAs layer; a first collector layer formed on the collector contact layer and made of an n-type GaAs layer; a second collector layer formed on the first collector layer and made of a p-type GaAs layer; a third collector layer formed on the second collector layer and made of an n-type InGaP layer; a fourth collector layer formed on the third collector layer and made of an n-type InGaP layer having an impurity concentration higher than that of the third collector layer; a fifth collector layer formed on the fourth collector layer and made of an n-type GaAs layer; a base layer formed on the fifth collector layer and made of a p-type GaAs layer; and an emitter layer formed on the base layer and made of an n-type InGaP layer.
摘要:
A bipolar transistor is formed on a silicon substrate having a silicon oxide film. An n-silicon layer having a top surface of a (100) plane is formed on the silicon oxide film and is used as a collector layer. An end face constituted by a (111) plane is formed on the end portion of the collector layer by etching, using an aqueous KOH solution. A B-doped p-silicon layer is formed on the end face by epitaxial growth and is used as a base layer. Furthermore, an As-doped n-silicon layer is formed on the base layer and is used as an emitter layer. Electrodes are respectively connected to the collector, base, and emitter layers.
摘要:
According to the present invention, there is a provided a semiconductor device having, a collector contact layer made of an n-type GaAs layer; a first collector layer formed on the collector contact layer and made of an n-type GaAs layer; a second collector layer formed on the first collector layer and made of a p-type GaAs layer; a third collector layer formed on the second collector layer and made of an n-type InGaP layer; a fourth collector layer formed on the third collector layer and made of an n-type InGaP layer having an impurity concentration higher than that of the third collector layer; a fifth collector layer formed on the fourth collector layer and made of an n-type GaAs layer; a base layer formed on the fifth collector layer and made of a p-type GaAs layer; and an emitter layer formed on the base layer and made of an n-type InGaP layer.
摘要:
A high frequency semiconductor module, includes: a semiconductor chip having top and bottom surfaces; a semiconductor element merged in the semiconductor chip; a ground pad of the semiconductor element disposed on the top surface; a metal layer configured to connect to the ground pad and extend to sidewalls of the semiconductor chip; a ground metal arranged on a surface of a mounting substrate; and a conductive material formed on the ground, configured to connect the metal layer and the ground metal.
摘要:
The object of the present invention is to provide a bipolar transistor which is excellent in uniformity of current distribution in spite of a small ballast resistance, and can constitute an amplifier showing high efficiency and low distortion with little deterioration of distortion even when a digital modulation wave is input thereto. A high frequency power amplifier of the present invention comprises a plurality of transistor blocks having a bipolar transistor, wherein each of the transistor blocks includes a resistance connected to an emitter of the bipolar transistor, a reference voltage generation circuit for generating a reference voltage as a base bias of the bipolar transistor, and a bias generation circuit connected to a base of the bipolar transistor, the bias generation circuit generating a base bias voltage by converting the reference voltage.