Sputtering system using cylindrical rotating magnetron electrically
powered using alternating current
    1.
    发明授权
    Sputtering system using cylindrical rotating magnetron electrically powered using alternating current 失效
    使用圆柱形旋转磁控管的溅射系统使用交流电

    公开(公告)号:US5814195A

    公开(公告)日:1998-09-29

    申请号:US736978

    申请日:1996-10-25

    IPC分类号: C23C14/34 C23C14/35 H01J37/34

    摘要: A sputtering system using an AC power supply in the range of 10 kHz to 100 kHz uses two rotatable cylindrical magnetrons. The rotatable cylindrical magnetrons, when used for depositing a dielectric layer onto a substrate, clean off dielectric material that is deposited onto the target. This prevents a dielectric layer on the target from acting like a capacitor and may help avoid arcing. Additionally, an impedance-limiting capacitor can be placed in series in the electrical path between the targets through the transformer so as to reduce arcing. This impedance-limiting capacitor has a value much larger than the capacitors used to couple the power supply to a target in radio frequency sputtering systems.

    摘要翻译: 使用10kHz至100kHz范围内的交流电源的溅射系统使用两个可旋转的圆柱形磁控管。 可旋转的圆柱形磁控管当用于将介电层沉积到基底上时,清除沉积在靶上的介电材料。 这样可防止目标上的电介质层像电容器那样起作用,并且有助于避免电弧。 此外,阻抗限制电容器可以通过变压器串联放置在目标之间的电气路径中,以减少电弧。 该阻抗限制电容器具有比用于将电源耦合到射频溅射系统中的目标的电容器的值大得多的值。