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公开(公告)号:US20050224989A1
公开(公告)日:2005-10-13
申请号:US10815464
申请日:2004-03-31
申请人: Todd Myers , Nicholas Watts , Eric Palmer , Jui Lim
发明人: Todd Myers , Nicholas Watts , Eric Palmer , Jui Lim
CPC分类号: H01L21/76897 , H01L21/486 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/64 , H01L23/66 , H01L2223/6616 , H01L2924/0002 , H01L2924/15311 , H01L2924/1902 , H05K1/115 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/06 , H05K3/4053 , H05K3/421 , H05K2201/086 , H05K2201/09509 , H05K2201/09563 , H05K2201/0959 , H05K2201/09645 , H05K2201/09663 , H05K2201/09763 , H05K2201/09809 , H05K2201/09827 , H05K2201/09981 , Y10S257/916 , Y10T29/435 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49147 , Y10T29/49165 , H01L2924/00
摘要: A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
摘要翻译: 形成与通孔相关的器件的方法包括形成开口或通孔,并在通孔内形成至少一对导电通路。 还公开了一种在其中具有一对导电路径的通孔。
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公开(公告)号:US20050133918A1
公开(公告)日:2005-06-23
申请号:US10740957
申请日:2003-12-17
申请人: Todd Myers , Nicholas Watts , Eric Palmer , Renee Defeo , Jui Lim
发明人: Todd Myers , Nicholas Watts , Eric Palmer , Renee Defeo , Jui Lim
CPC分类号: H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/064 , H05K3/403 , H05K3/4644 , H05K2201/09645 , H05K2201/09827 , H01L2924/00
摘要: A system includes a device having at least one integrated circuit. The integrated circuit further includes a first layer of conductive material, a second layer of conductive material, and a via having multiple electrical paths for interconnecting the first layer of conductive material and the second layer of conductive material. A method for forming a via includes drilling an opening to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.
摘要翻译: 一种系统包括具有至少一个集成电路的装置。 集成电路还包括第一导电材料层,第二导电材料层,以及具有用于互连导电材料的第一层和第二导电材料层的多条电路的通路。 用于形成通孔的方法包括将开口钻出一定深度以露出第一垫和第二垫,用导电材料衬套开口,并将开口中的衬里的第一部分与衬里的第二部分绝缘 所述开口形成接触所述第一焊盘的第一电路径和与所述第二焊盘接触的第二电路径。
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3.
公开(公告)号:US20050121769A1
公开(公告)日:2005-06-09
申请号:US10729544
申请日:2003-12-05
申请人: Nicholas Watts , Eric Palmer , Jui Lim , Todd Myers , Boonsri Wangmaneerat
发明人: Nicholas Watts , Eric Palmer , Jui Lim , Todd Myers , Boonsri Wangmaneerat
IPC分类号: H01L21/44 , H01L21/98 , H01L23/04 , H01L23/498 , H01L25/10
CPC分类号: H01L25/50 , H01L23/4985 , H01L25/105 , H01L2224/16 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331
摘要: In some embodiments, a method includes providing a substrate, providing a coverlay blank, laminating the coverlay blank to the substrate, and forming at least one opening in the coverlay blank by photolithography.
摘要翻译: 在一些实施例中,一种方法包括提供衬底,提供覆盖层坯料,将覆盖层坯料层压到衬底上,以及通过光刻法在覆盖层坯料中形成至少一个开口。
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公开(公告)号:US20130023769A1
公开(公告)日:2013-01-24
申请号:US13574853
申请日:2011-01-25
申请人: Ming Lin Julius Tsai , Chuen Neng Lee , Jui Lim
发明人: Ming Lin Julius Tsai , Chuen Neng Lee , Jui Lim
IPC分类号: A61B8/00
CPC分类号: A61B8/12 , A61B5/6848 , A61B8/00 , A61B8/42 , A61B8/445 , A61B8/4455 , A61B2090/3782
摘要: Embodiments provide a device for penetrating a tissue of a subject. The device comprises a tissue penetrating portion having a tissue penetrating end. The device further comprises an ultrasonic scanner coupled to the tissue penetrating portion. The ultrasonic scanner comprises an ultrasound transduction circuit being configured to generate and transmit ultrasound waves to the subject and to receive returned sound waves echoed from the subject. The ultrasonic scanner further comprises a pulse generating circuit being configured to generate an electrical pulse so that the ultrasound transduction circuit is triggered to generate and transmit ultrasound waves.
摘要翻译: 实施例提供了用于穿透受试者的组织的装置。 该装置包括具有组织穿透端的组织穿透部分。 该装置还包括耦合到组织穿透部分的超声波扫描仪。 超声波扫描仪包括超声换能电路,其被配置为产生并向对象发射超声波并接收从受检者回波的返回声波。 超声波扫描仪还包括脉冲发生电路,其被配置为产生电脉冲,使得超声波转导电路被触发以产生和发射超声波。
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公开(公告)号:US20070257410A1
公开(公告)日:2007-11-08
申请号:US11418444
申请日:2006-05-04
申请人: Michael Toh , Jui Lim , ChoonKiat Lim , Xiong Liu
发明人: Michael Toh , Jui Lim , ChoonKiat Lim , Xiong Liu
IPC分类号: F16F1/36
CPC分类号: F16F1/3605
摘要: Embodiments of the invention are directed to an external shock absorber for an electronic device such as a disc drive. The external shock absorber is made from an elastomeric material with an arrangement of foam-like internal and external cavities. The external shock absorber may be placed adjacent to a housing of an electronic device to provide shock absorption, may cover a portion of the electronic device housing, or may be shaped to cover a portion of the electronic device housing.
摘要翻译: 本发明的实施例涉及一种用于诸如盘驱动器的电子设备的外部减震器。 外部减震器由具有泡沫状内部和外部空腔的布置的弹性体材料制成。 外部减震器可以邻近电子设备的壳体放置以提供减震,可以覆盖电子设备壳体的一部分,或者可以被成形为覆盖电子设备壳体的一部分。
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公开(公告)号:US20070117339A1
公开(公告)日:2007-05-24
申请号:US11626606
申请日:2007-01-24
申请人: Todd Myers , Nicholas Watts , Eric Palmer , Renee Defeo , Jui Lim
发明人: Todd Myers , Nicholas Watts , Eric Palmer , Renee Defeo , Jui Lim
CPC分类号: H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/064 , H05K3/403 , H05K3/4644 , H05K2201/09645 , H05K2201/09827 , H01L2924/00
摘要: A method for forming an plurality of paths on a substrate includes drilling an opening for a via to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.
摘要翻译: 一种用于在基板上形成多个路径的方法包括:将用于通孔的开口钻出一定深度,以暴露第一垫和第二垫,用导电材料衬套开口,并将开口的第一部分在开口 从开口中的衬里的第二部分形成接触第一焊盘的第一电路径和接触第二焊盘的第二电路径。
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