SPUTTER DEVICE AND METHOD FOR DEPOSITING THIN FILM USING THE SAME
    4.
    发明申请
    SPUTTER DEVICE AND METHOD FOR DEPOSITING THIN FILM USING THE SAME 审中-公开
    溅射装置和使用该薄膜沉积薄膜的方法

    公开(公告)号:US20130302535A1

    公开(公告)日:2013-11-14

    申请号:US13687183

    申请日:2012-11-28

    IPC分类号: C23C14/34

    摘要: A sputter device includes a cathode portion including a target support portion coupled to a front surface of a cathode main body, a target being mounted on the front surface of the cathode main body and being supported by the target support portion, an anode portion including an anode coupled to an anode main body, the anode main body surrounding a side and a bottom of the cathode portion, and the anode covering the target support portion and an edge of the target, an internal insulator between the cathode portion and the anode main body, an electrode insulator between the anode and each of the target support portion and the edge of the target, and a power source portion connected to the cathode portion and the anode portion.

    摘要翻译: 溅射装置包括阴极部分,其包括耦合到阴极主体的前表面的靶支撑部分,靶安装在阴极主体的前表面上并由靶支撑部分支撑,阳极部分包括 负极连接到阳极主体,阳极主体围绕阴极部分的侧面和底部,阳极覆盖目标支撑部分和靶材的边缘,阴极部分和阳极主体之间的内部绝缘体 阳极与目标支撑部分和靶的边缘之间的电极绝缘体,以及连接到阴极部分和阳极部分的电源部分。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130175534A1

    公开(公告)日:2013-07-11

    申请号:US13477802

    申请日:2012-05-22

    CPC分类号: H01L29/78603 H01L27/1218

    摘要: A semiconductor device and a method of manufacturing the same are disclosed. In one embodiment, the semiconductor device includes a substrate, a first silicon nitride layer formed over the substrate, a first silicon oxide layer formed directly on the first silicon nitride layer and having a thickness of about 1000 Å or less, and a hydrogenated polycrystalline silicon layer formed directly on the first silicon oxide layer.

    摘要翻译: 公开了一种半导体器件及其制造方法。 在一个实施例中,半导体器件包括衬底,在衬底上形成的第一氮化硅层,直接形成在第一氮化硅层上并具有约1000或更小的厚度的第一氧化硅层和氢化多晶硅 层直接形成在第一氧化硅层上。

    Method of fabricating polycrystalline silicon, TFT fabricated using the same, method of fabricating the TFT, and organic light emitting diode display device including the TFT
    8.
    发明授权
    Method of fabricating polycrystalline silicon, TFT fabricated using the same, method of fabricating the TFT, and organic light emitting diode display device including the TFT 有权
    制造多晶硅的方法,使用其制造的TFT,制造TFT的方法以及包括TFT的有机发光二极管显示装置

    公开(公告)号:US08445336B2

    公开(公告)日:2013-05-21

    申请号:US12891379

    申请日:2010-09-27

    IPC分类号: H01L21/00 H01L21/84

    摘要: A method of fabricating a polycrystalline silicon (poly-Si) layer includes providing a substrate, forming an amorphous silicon (a-Si) layer on the substrate, forming a thermal oxide layer to a thickness of about 10 Å to 50 Å on the a-Si layer, forming a metal catalyst layer on the thermal oxide layer, and annealing the substrate to crystallize the a-Si layer into the poly-Si layer using a metal catalyst of the metal catalyst layer. Thus, the a-Si layer can be crystallized into a poly-Si layer by a super grain silicon (SGS) crystallization method. Also, the thermal oxide layer may be formed during the dehydrogenation of the a-Si layer so that an additional process of forming a capping layer required for the SGS crystallization method can be omitted, thereby simplifying the fabrication process.

    摘要翻译: 一种制造多晶硅(poly-Si)层的方法包括提供衬底,在衬底上形成非晶硅(a-Si)层,形成厚度约为的厚度的氧化物层 -Si层,在所述热氧化物层上形成金属催化剂层,并且使所述金属催化剂层的金属催化剂退火所述基板以使a-Si层结晶成多晶硅层。 因此,可以通过超晶硅(SGS)结晶法将a-Si层结晶成多晶硅层。 此外,可以在a-Si层的脱氢过程中形成热氧化物层,从而可以省略形成SGS结晶方法所需的另外的形成覆盖层的工艺,从而简化了制造工艺。

    THIN FILM TRANSISTOR, MANUFACTURING METHOD OF THIN FILM TRANSISTOR, AND ORGANIC LIGHT EMITTING DIODE DISPLAY INCLUDING THE SAME
    10.
    发明申请
    THIN FILM TRANSISTOR, MANUFACTURING METHOD OF THIN FILM TRANSISTOR, AND ORGANIC LIGHT EMITTING DIODE DISPLAY INCLUDING THE SAME 有权
    薄膜晶体管,薄膜晶体管的制造方法和包括其的有机发光二极管显示器

    公开(公告)号:US20120305921A1

    公开(公告)日:2012-12-06

    申请号:US13449423

    申请日:2012-04-18

    摘要: A thin film transistor may include a substrate, a buffer layer on the substrate, a semiconductor layer formed on the buffer layer, a gate insulating pattern on the semiconductor layer, a gate electrode on the gate insulating pattern, an interlayer insulating layer covering the gate electrode and the gate insulating pattern, the interlayer insulating layer having a contact hole and an opening extending therethrough, the contact hole exposing a source area and a drain area of the semiconductor layer, and the opening exposing a channel area of the semiconductor layer, and a source electrode and a drain electrode formed on the interlayer insulating layer, the source electrode being connected with the source area and the drain electrode being connected with the drain area of the semiconductor layer.

    摘要翻译: 薄膜晶体管可以包括衬底,衬底上的缓冲层,形成在缓冲层上的半导体层,半导体层上的栅极绝缘图案,栅极绝缘图案上的栅电极,覆盖栅极的层间绝缘层 电极和栅极绝缘图案,所述层间绝缘层具有接触孔和延伸穿过其的开口,所述接触孔暴露所述半导体层的源极区域和漏极区域,并且所述开口暴露所述半导体层的沟道区域,以及 源电极和漏电极,形成在层间绝缘层上,源极与源区连接,漏电极与半导体层的漏极区连接。