公开(公告)号：US08461679B2

公开(公告)日：2013-06-11

申请号：US13108743

申请日：2011-05-16

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L21/00

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电柱和焊帽。 导电柱形成在硅芯片的接合焊盘上，并且焊接帽附接到导电柱的上端。 焊锡帽的熔点低于导电柱。 焊帽可以被配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 导电材料沉积到开口中以形成导电柱，最后在每个导电柱的末端附着焊帽。

公开(公告)号：US20070166993A1

公开(公告)日：2007-07-19

申请号：US11685216

申请日：2007-03-13

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L21/44

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电柱和焊帽。 导电柱形成在硅芯片的接合焊盘上，并且焊接帽附接到导电柱的上端。 焊锡帽的熔点低于导电柱。 焊帽可以被配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 导电材料沉积到开口中以形成导电柱，最后在每个导电柱的末端附着焊帽。

公开(公告)号：US06784087B2

公开(公告)日：2004-08-31

申请号：US10174357

申请日：2002-06-17

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L2144

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电圆柱体和焊料块。 导电圆柱体形成在硅芯片的接合焊盘上，并且焊接块附接到导电圆柱体的上端。 焊料块的熔点低于导电圆柱体。 焊料块可以配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 将导电材料沉积到开口中以形成导电圆柱体，最后在每个导电圆柱体的末端附着焊块。

公开(公告)号：US6032704A

公开(公告)日：2000-03-07

申请号：US70395

申请日：1998-04-30

Applicant: Hsin-Chieh Huang ,  Yeh-Jye Wann ,  Hsi-Shan Kuo

Inventor： Hsin-Chieh Huang ,  Yeh-Jye Wann ,  Hsi-Shan Kuo

IPC: H01L21/00 ,  H01L21/673 ,  B65B1/04

CPC classification number: H01L21/67379 ,  H01L21/67017 ,  H01L21/67393 ,  Y10S414/135

Abstract: A method and apparatus for storing wafers without the moisture absorption problem by providing a wafer storage container that has a cavity therein and an inert gas supply line into the cavity for flowing an inert gas at a substantially constant flow rate into the cavity while allowing a portion of the inert gas to escape into surrounding environment outside the cavity such that there is always a positive pressure differential maintained between the cavity and the outside environment to keep out moisture.

Abstract translation: 一种方法和装置，用于通过提供在其中具有空腔的晶片储存容器和惰性气体供应管线来存储晶片而没有吸湿问题，用于使惰性气体以基本恒定的流速流入空腔，同时允许一部分 的惰性气体逸出到空腔外面的周围环境中，使得在空腔和外部环境之间总是保持正压差以防止湿气。

公开(公告)号：US07960270B2

公开(公告)日：2011-06-14

申请号：US11685216

申请日：2007-03-13

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L21/00

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电柱和焊帽。 导电柱形成在硅芯片的接合焊盘上，并且焊接帽附接到导电柱的上端。 焊锡帽的熔点低于导电柱。 焊帽可以被配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 导电材料沉积到开口中以形成导电柱，最后在每个导电柱的末端附着焊帽。

公开(公告)号：US07208834B2

公开(公告)日：2007-04-24

申请号：US10874704

申请日：2004-06-22

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电柱和焊帽。 导电柱形成在硅芯片的接合焊盘上，并且焊接帽附接到导电柱的上端。 焊锡帽的熔点低于导电柱。 焊帽可以被配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 导电材料沉积到开口中以形成导电柱，最后在每个导电柱的末端附着焊帽。

公开(公告)号：US20050026413A1

公开(公告)日：2005-02-03

申请号：US10874704

申请日：2004-06-22

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/485 ,  H01L25/065 ,  H01L21/44

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电柱和焊帽。 导电柱形成在硅芯片的接合焊盘上，并且焊接帽附接到导电柱的上端。 焊锡帽的熔点低于导电柱。 焊帽可以被配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 导电材料沉积到开口中以形成导电柱，最后在每个导电柱的末端附着焊帽。

公开(公告)号：US20080296761A1

公开(公告)日：2008-12-04

申请号：US12132628

申请日：2008-06-04

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电圆柱体和焊料块。 导电圆柱体形成在硅芯片的接合焊盘上，并且焊接块附接到导电圆柱体的上端。 焊料块的熔点低于导电圆柱体。 焊料块可以配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 将导电材料沉积到开口中以形成导电圆柱体，最后在每个导电圆柱体的末端附着焊块。

公开(公告)号：US08890336B2

公开(公告)日：2014-11-18

申请号：US12132628

申请日：2008-06-04

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L23/48 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电圆柱体和焊料块。 导电圆柱体形成在硅芯片的接合焊盘上，并且焊接块附接到导电圆柱体的上端。 焊料块的熔点低于导电圆柱体。 焊料块可以配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 将导电材料沉积到开口中以形成导电圆柱体，最后在每个导电圆柱体的末端附着焊块。

公开(公告)号：US20110215476A1

公开(公告)日：2011-09-08

申请号：US13108743

申请日：2011-05-16

Applicant: Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

Inventor： Jin-Yuan Lee ,  Chien-Kang Chou ,  Shih-Hsiung Lin ,  Hsi-Shan Kuo

IPC: H01L23/488

CPC classification number: H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11906 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.

Abstract translation: 圆柱形粘结结构及其制造方法。 在硅芯片的接合焊盘上形成圆柱形接合结构，并且在形成倒装芯片封装的过程中将芯片翻转以与衬底板连接。 圆柱形接合结构主要包括导电柱和焊帽。 导电柱形成在硅芯片的接合焊盘上，并且焊接帽附接到导电柱的上端。 焊锡帽的熔点低于导电柱。 焊帽可以被配置成圆柱形，球形或半球形。 为了制造圆柱形接合结构，在硅晶片上形成具有与位于晶片上的接合焊盘相对应的多个开口的图案化掩模层。 导电材料沉积到开口中以形成导电柱，最后在每个导电柱的末端附着焊帽。