公开(公告)号：US09006581B2

公开(公告)日：2015-04-14

申请号：US13639640

申请日：2011-04-11

Applicant: Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga ,  Hiroyuki Yasuda

Inventor： Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga ,  Hiroyuki Yasuda

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/09 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/0234 ,  H05K1/0242 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/0715 ,  H05K2201/09736

Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.

Abstract translation: 一种印刷线路板，包括分别具有在绝缘层的至少一个表面上进行电磁波屏蔽的物体导体的印刷布线构件; 以及电磁波屏蔽构件，其在基膜的至少一个表面上具有由低电阻部分和高电阻部分构成的电磁波屏蔽层。 印刷线路构件和电磁波屏蔽构件通过插入绝缘粘合剂层而被接合在一起，并且电磁波屏蔽层的布置分开地和相对地布置，使得物体导体被覆盖。 电磁波屏蔽层和物体导体由相同类型的导电材料构成，并且电磁波屏蔽层不在印刷线路板的周向端面处露出。

公开(公告)号：US08748293B2

公开(公告)日：2014-06-10

申请号：US13406114

申请日：2012-02-27

Applicant: Masahiro Furuya ,  Hiroyuki Yasuda ,  Shohei Tagami ,  Michihiro Sugo ,  Hideto Kato

Inventor： Masahiro Furuya ,  Hiroyuki Yasuda ,  Shohei Tagami ,  Michihiro Sugo ,  Hideto Kato

IPC: H01L21/461 ,  H01L21/463 ,  C08G77/20

CPC classification number: C08G77/70 ,  C08G77/04 ,  C08G77/50 ,  C08L83/04 ,  C09J183/04 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.

Abstract translation: 本发明提供含有以下单元（I）〜（III）的非芳香族饱和烃基有机聚硅氧烷：（I）由R 1 SiO 3/2：40〜99摩尔％表示的硅氧烷单元（T单元） （II）由R2R3SiO2 / 2表示的硅氧烷单元（D单元）：59摩尔％以下; 和（III）由R4R5R6SiO1 / 2表示的硅氧烷单元（M单元）：1〜30摩尔％。 可以是有机聚硅氧烷，其可溶于非极性有机溶剂，使得有机聚硅氧烷在短时间内可以被剥离，并且难以溶于极性有机溶剂中，例如在将光致抗蚀剂涂覆在半导体侧上时被示例性地使用 从而从其上除去光致抗蚀剂，使得在将光致抗蚀剂涂覆在接合的基板的半导体侧上并从中除去光致抗蚀剂时，有机聚硅氧烷不从支撑基板剥离。

公开(公告)号：US20120184100A1

公开(公告)日：2012-07-19

申请号：US13353700

申请日：2012-01-19

Applicant: Hiroyuki Yasuda ,  Katsuya Takemura ,  Noriyuki Koike

Inventor： Hiroyuki Yasuda ,  Katsuya Takemura ,  Noriyuki Koike

IPC: H01L21/3205 ,  G03F7/20 ,  G03F7/039

CPC classification number: G03F7/0048 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0755 ,  G03F7/0757

Abstract: A chemically amplified positive resist composition comprising (A) a substantially alkali insoluble polymer having an acidic functional group protected with an acid labile group, (B) an acid generator, and (C) a perfluoroalkyl ethylene oxide adduct or a nonionic fluorinated organosiloxane compound is coated, exposed to UV radiation having a wavelength of at least 150 nm, and developed. The composition has advantages of uniformity and minimized edge crown upon coating, and no scum formation after development.

Abstract translation: 一种化学放大正性抗蚀剂组合物，其包含（A）具有由酸不稳定基团保护的酸性官能团的基本上不溶于碱的聚合物，（B）酸产生剂和（C）全氟烷基环氧乙烷加合物或非离子氟化有机硅氧烷化合物， 涂覆，暴露于具有至少150nm的波长的UV辐射，并显影。 该组合物具有均匀性和涂覆后边缘冠最小化的优点，并且在显影后没有浮渣形成。

公开(公告)号：US20120115280A1

公开(公告)日：2012-05-10

申请号：US13382654

申请日：2010-05-31

Applicant: Hiroyuki Yasuda ,  Takashi Hirano

Inventor： Hiroyuki Yasuda ,  Takashi Hirano

IPC: H01L21/56 ,  B32B3/02 ,  B32B7/02 ,  B32B7/12 ,  C09J7/02

CPC classification number: C09J163/00 ,  C08F218/08 ,  C08F2220/1825 ,  C08G18/6225 ,  C08G18/7621 ,  C08L61/04 ,  C08L63/00 ,  C08L2203/206 ,  C08L2666/14 ,  C09J7/20 ,  C09J133/08 ,  C09J175/14 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/24942 ,  Y10T428/24983 ,  Y10T428/2848 ,  C08F2220/1858 ,  C08F2222/1053 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when a chip is picked up. This film for semiconductor is characterized in that in the case where peel strength at 23° C. of the chip is defined as “F23 (cN/25 mm)” and peel strength at 60° C. of the chip is defined as “F60 (cN/25 mm)”, F23 is in the range of 10 to 80 and F60/F23 is in the range of 0.3 to 5.5. This makes it possible to improve a pickup property of the chip, to thereby prevent generation of defects in a semiconductor element.

Abstract translation: 半导体膜包括依次层叠在一起的支撑膜，第二粘合层，第一粘合层和接合层。 这种半导体膜被配置为当半导体晶片被切割时，其支撑层叠在其接合层上的半导体晶片，并且当拾取芯片时，从第一粘合剂层选择性地剥离接合层。 该半导体膜的特征在于，芯片的23℃剥离强度定义为“F23（cN / 25mm）”，将芯片的60℃剥离强度定义为“F60 （cN / 25mm）“，F23为10〜80，F60 / F23为0.3〜5.5的范围。 这使得可以提高芯片的拾取特性，从而防止半导体元件中的缺陷的产生。

公开(公告)号：US07989764B2

公开(公告)日：2011-08-02

申请号：US11889232

申请日：2007-08-10

Applicant: Hiroyuki Yasuda ,  Shinji Nagai ,  Tetsuya Nishida

Inventor： Hiroyuki Yasuda ,  Shinji Nagai ,  Tetsuya Nishida

IPC: H01J49/42 ,  H01J49/40

CPC classification number: H01J49/4265 ,  H01J49/0081

Abstract: According to an aspect of the present invention, there are provided an ion trap mass spectrometry method and an ion trap mass spectrometry device using a mass spectrometer, the mass spectrometer including: an ion source part for ionizing a sample; an ion trap part for trapping ions generated in the ion source; a main high frequency power source for applying a main high frequency voltage to the ion trap part, and an auxiliary high frequency power source for applying an auxiliary high frequency voltage thereto; and a detector for detecting the ions ejected from the ion trap. The ion trap mass spectrometry method and the ion trap mass spectrometry device includes the steps of: accumulating desired ions into the ion trap part by ejecting undesired ions while accumulating ions into the ion trap part; and ejecting undesired ions that remain in the ion trap part and leaving the desired ions in the ion trap part are repeated alternately.

Abstract translation: 根据本发明的一个方面，提供了一种离子阱质谱法和使用质谱仪的离子阱质谱仪，该质谱仪包括：用于电离样品的离子源部分; 用于捕获在离子源中产生的离子的离子阱部分; 用于向离子阱部分施加主高频电压的主高频电源和用于向其提供辅助高频电压的辅助高频电源; 以及用于检测从离子阱排出的离子的检测器。 离子阱质谱方法和离子阱质谱装置包括以下步骤：通过在将离子聚集到离子阱部分的同时喷出不期望的离子将期望的离子累积到离子阱部分中; 并且交替地重复留在离子阱部分中并留下离子阱部分中的期望离子的不需要的离子。

公开(公告)号：US20110004010A1

公开(公告)日：2011-01-06

申请号：US12865877

申请日：2008-03-05

Applicant: Shun-ya Onozawa ,  Norihisa Fukaya ,  Kaori Saitou ,  Toshiyasu Sakakura ,  Hiroyuki Yasuda ,  Yukio Takagi ,  Masae Ueda

Inventor： Shun-ya Onozawa ,  Norihisa Fukaya ,  Kaori Saitou ,  Toshiyasu Sakakura ,  Hiroyuki Yasuda ,  Yukio Takagi ,  Masae Ueda

IPC: C07F7/18 ,  C07C69/78 ,  C07C229/36 ,  B01J31/02

CPC classification number: C07F17/02 ,  B01J31/1633 ,  B01J31/1815 ,  B01J31/189 ,  B01J31/2404 ,  B01J31/2409 ,  C01B33/00 ,  C01P2006/12 ,  C01P2006/16 ,  C07F7/081 ,  C07F7/1804 ,  C07F9/5009 ,  C07F9/5022 ,  C07F9/5027 ,  C07F9/572 ,  Y02P20/588 ,  Y10T428/31663

Abstract: The invention has an object to obtain an organic inorganic composite material having high activity and high selectivity, and suitable as a catalyst material having small elution of an active metal from a carrier, and further to obtain an organosilicon compound suitable for the preparation of the composite material. The composite material is an organic inorganic composite material comprising an organosilicon compound having at least two groups containing reactive silicon at a molecular end, bonded to one silicon atom constituting the organosilicon compound, and an inorganic oxide material, the organosilicon compound and the inorganic oxide material being bonded to each other through a plurality of groups containing reactive silicon of the organosilicon compound. The organosilicon compound is represented by the following general formula (1) or (2). Formula (1) wherein symbols are the same as defined in claim 17. Formula (2) wherein symbols are the same as defined in claim 18.

Abstract translation: 本发明的目的是获得具有高活性和高选择性的有机无机复合材料，并且适合作为活性金属从载体洗脱少的催化剂材料，并且还可获得适于制备复合材料的有机硅化合物 材料。 复合材料是包含具有至少两个含有分子末端的反应性硅的基团的有机硅化合物的有机无机复合材料，与构成有机硅化合物的一个硅原子键合，无机氧化物材料，有机硅化合物和无机氧化物材料 通过含有机硅化合物的反应性硅的多个基团彼此键合。 有机硅化合物由以下通式（1）或（2）表示。 式（1）其中符号与权利要求17中定义的相同。式（2）其中符号与权利要求18中定义的相同。

公开(公告)号：US20090230568A1

公开(公告)日：2009-09-17

申请号：US11886463

申请日：2007-04-10

Applicant: Hiroyuki Yasuda ,  Masato Yoshida

Inventor： Hiroyuki Yasuda ,  Masato Yoshida

IPC: C09J163/00 ,  C09J133/02 ,  H01L23/12

CPC classification number: C09J163/00 ,  C08L33/066 ,  C08L63/00 ,  C08L2666/04 ,  C08L2666/22 ,  C09J7/10 ,  C09J11/08 ,  C09J133/066 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

Abstract: There is provided an adhesive film for a semiconductor, comprising a thermoplastic resin (A), an epoxy resin (B) and a curing agent (C), wherein a minimum melt viscosity of said adhesive film for a semiconductor is 0.1 Pa·s to 500 Pa·s both inclusive in a temperature range of 50° C. to 180° C. both inclusive at a temperature-rise rate of 10° C./min from room temperature and a content of volatile component is 5.0% or less.

Abstract translation: 提供一种用于半导体的粘合膜，其包含热塑性树脂（A），环氧树脂（B）和固化剂（C），其中所述半导体粘合剂膜的最小熔融粘度为0.1Pa.s至 在50℃〜180℃的温度范围内，以室温为10℃/分钟的升温速度，挥发成分的含量为5.0％以下，均为500Pa.s。

公开(公告)号：US20090179148A1

公开(公告)日：2009-07-16

申请号：US12350328

申请日：2009-01-08

Applicant: Hiroyuki Yasuda ,  Yasushi Terui ,  Shinji Nagai ,  Tetsuya Nishida

Inventor： Hiroyuki Yasuda ,  Yasushi Terui ,  Shinji Nagai ,  Tetsuya Nishida

IPC: B01D59/44 ,  H01J49/00

CPC classification number: H01J49/004 ,  H01J49/063

Abstract: Performing an MS3 with a tandem mass spectrometer causes problems of increase in size of the device and of increase in cost. Likewise, a plural number of times MS/MS analyses are even more difficult. An electrode to create a harmonic potential is disposed in a collision cell, and fragment ions produced by the first-time collision induced dissociation are accumulated in the harmonic potential. Target ions of the subsequent stage are let out, by means of an axial resonance excitation, selectively from the accumulated ions. The ions are excited in the axial direction to have a potential exceeding the harmonic potential. Thereby, the second-time collision induced dissociation is performed by means of a potential difference provided at the subsequent stage. In addition, an operation to return the ions back to the harmonic potential enables a plural number of times MS/MS analyses to be performed.

Abstract translation: 使用串联质谱仪进行MS3会导致设备尺寸增加和成本增加的问题。 同样，多次MS / MS分析更加困难。 用于产生谐波电位的电极设置在碰撞室中，并且由第一次碰撞引起的解离产生的碎片离子累积在谐波电位中。 选择性地从累积的离子中排出后续阶段的目标离子，借助于轴向共振激发。 离子在轴向上被激发以具有超过谐波电位的电位。 因此，通过在后续阶段提供的电位差来执行第二次碰撞诱导解离。 此外，使离子返回到谐波电位的操作能够进行多次MS / MS分析。

公开(公告)号：US20090012324A1

公开(公告)日：2009-01-08

申请号：US12279116

申请日：2007-02-07

Applicant: Jun-Chul Choi ,  Kazufumi Kohno ,  Hiroyuki Yasuda ,  Toshiyasu Sakakura

Inventor： Jun-Chul Choi ,  Kazufumi Kohno ,  Hiroyuki Yasuda ,  Toshiyasu Sakakura

IPC: C07C69/78 ,  C07C41/06

CPC classification number: C07C41/06 ,  B01J31/0227 ,  B01J31/20 ,  B01J31/2234 ,  B01J31/2295 ,  B01J31/30 ,  B01J2231/30 ,  B01J2531/842 ,  B01J2531/845 ,  B01J2531/847 ,  C07C67/04 ,  C07C2601/14 ,  C07C2602/42 ,  C07C69/14 ,  C07C69/24 ,  C07C69/54 ,  C07C69/92 ,  C07C69/78 ,  C07C43/235 ,  C07C43/18 ,  C07C43/188 ,  C07C43/243 ,  C07C43/215

Abstract: Disclosed is a process for production of a carboxylic acid ester from a carboxylic acid and an olefin or production of an ether compound from an alcohol and an olefin at low cost and with high yield in an industrially advantageous manner. The process comprises the step of reacting a carboxylic acid with an olefin to yield a corresponding carboxylic acid ester or reacting an alcohol with an olefin to yield a corresponding ether compound. In the process, a catalyst comprising a combination of (i) at least one metal compound selected from an iron compound, a cobalt compound and a nickel compound and (ii) an acidic compound is used.

Abstract translation: 公开了一种由羧酸和烯烃生产羧酸酯的方法，或者以低成本，高产率地以低成本和高产率从工业上有利地从醇和烯烃生产醚化合物的方法。 该方法包括使羧酸与烯烃反应以产生相应的羧酸酯或使醇与烯烃反应以产生相应的醚化合物的步骤。 在该方法中，使用包含（i）至少一种选自铁化合物，钴化合物和镍化合物的金属化合物和（ii）酸性化合物的组合的催化剂。

公开(公告)号：US20050214574A1

公开(公告)日：2005-09-29

申请号：US11088853

申请日：2005-03-25

Applicant: Hiroyuki Yasuda ,  Hyun-Shik Oh ,  Shinji Shiraki

Inventor： Hiroyuki Yasuda ,  Hyun-Shik Oh ,  Shinji Shiraki

IPC: H01L51/50 ,  C08G73/02 ,  C09K11/06 ,  H05B33/14

CPC classification number: C08G73/024

Abstract: Disclosed is a polymer comprising a repeating unit represented by the following structural formula (1): wherein R1, R2 and R3 are each a monovalent organic group, l is an integer of 0 to 4, m is an integer of 0 to 4, and n is an integer of 0 to 4. A composition comprising the polymer and a triplet luminescent metal complex compound, and an organic EL device having a luminescent layer formed from the composition are also disclosed. The polymer is capable of forming an organic EL layer having high luminance by a wet process. The organic EL device has a luminescent layer having high luminance.

Abstract translation: 公开了包含由以下结构式（1）表示的重复单元的聚合物：其中R 1，R 2和R 3各自为 1价有机基团，l为0〜4的整数，m为0〜4的整数，n为0〜4的整数。包含该聚合物和三重态发光金属络合物的组合物和有机EL 还公开了具有由该组合物形成的发光层的器件。 聚合物能够通过湿法形成具有高亮度的有机EL层。 有机EL器件具有高亮度的发光层。