Metrology method and apparatus, and device manufacturing method
    1.
    发明授权
    Metrology method and apparatus, and device manufacturing method 有权
    计量方法和装置以及装置制造方法

    公开(公告)号:US08867020B2

    公开(公告)日:2014-10-21

    申请号:US13235902

    申请日:2011-09-19

    IPC分类号: G03B27/54 G03B27/42 G03F7/20

    摘要: Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process.

    摘要翻译: 公开了用于测量由基板上的光刻工艺形成的目标结构的方法。 目标内的光栅或其他结构小于测量光学系统的照明点和视场。 组件结构的图像的位置在测量之间变化,并且应用第一类型的校正以减少由与来自不同位置的光路的差异引起的对测量的强度的影响。 可以在光学系统的视野内同时成像多个结构,并且每个结构被校正为其各自的位置。 测量可以包括在不同照明和/或成像模式下的相同目标的第一和第二图像,例如在暗场测量应用中。 可以应用第二类型的校正来减少第一和第二照明模式或成像之间的不对称性的影响,例如以允许在半导体器件制造过程中更准确地过度测量。

    Metrology Method and Apparatus, and Device Manufacturing Method
    2.
    发明申请
    Metrology Method and Apparatus, and Device Manufacturing Method 有权
    计量方法与装置及装置制造方法

    公开(公告)号:US20120242970A1

    公开(公告)日:2012-09-27

    申请号:US13235902

    申请日:2011-09-19

    IPC分类号: G03B27/32 G01N21/95

    摘要: Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process.

    摘要翻译: 公开了用于测量由基板上的光刻工艺形成的目标结构的方法。 目标内的光栅或其他结构小于测量光学系统的照明点和视场。 组件结构的图像的位置在测量之间变化,并且应用第一类型的校正以减少由与来自不同位置的光路的差异引起的对测量的强度的影响。 可以在光学系统的视野内同时成像多个结构,并且每个结构被校正为其各自的位置。 测量可以包括在不同照明和/或成像模式下的相同目标的第一和第二图像,例如在暗场测量应用中。 可以应用第二类型的校正来减少第一和第二照明模式或成像之间的不对称性的影响,例如以允许在半导体器件制造过程中更准确地过度测量。

    Inspection apparatus and method for measuring a property of a substrate
    4.
    发明授权
    Inspection apparatus and method for measuring a property of a substrate 有权
    用于测量基板的性质的检查装置和方法

    公开(公告)号:US09235141B2

    公开(公告)日:2016-01-12

    申请号:US13186895

    申请日:2011-07-20

    摘要: An inspection apparatus measures a property of a substrate including a periodic structure. An illumination system provides a beam of radiation with an illumination profile including a plurality of illuminated portions. A radiation projector projects the beam of radiation onto the substrate. A detector detects radiation scattered from the periodic structure and separately detects first order diffracted radiation and at least one higher order of diffracted radiation of each of the illuminated portions. A processor determines the property of the substrate from the detected radiation. The plurality of illuminated portions are arranged such that first order diffracted radiation arising from one or more of the illuminated portions are not overlapped by zeroth order or first order diffracted radiation arising from any other of the illuminated portions. Furthermore, the plurality of illuminated portions are arranged such that first order diffracted radiation arising from the one or more of the illuminated portions are overlapped by at least one of the higher orders of diffracted radiation arising from any other of the illuminated portions.

    摘要翻译: 检查装置测量包括周期性结构的基板的性质。 照明系统提供具有包括多个照明部分的照明轮廓的辐射束。 辐射投影仪将辐射束投影到基板上。 检测器检测从周期性结构散射的辐射,并分别检测每个照明部分的一级衍射辐射和衍射辐射的至少一个高阶。 处理器根据检测到的辐射来确定衬底的性质。 多个照明部分被布置成使得从一个或多个被照射部分产生的一级衍射辐射不会被任何其他照明部分产生的零级或一级衍射辐射重叠。 此外,多个照明部分被布置成使得由一个或多个被照射部分产生的一阶衍射辐射与从任何其他照明部分产生的衍射辐射的较高阶数中的至少一个重叠。

    Metrology method and inspection apparatus, lithographic system and device manufacturing method
    7.
    发明授权
    Metrology method and inspection apparatus, lithographic system and device manufacturing method 有权
    计量方法和检验仪器,光刻系统和器件制造方法

    公开(公告)号:US09140998B2

    公开(公告)日:2015-09-22

    申请号:US13294057

    申请日:2011-11-10

    摘要: Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The optical system has a first branch leading to a pupil plane imaging sensor and a second branch leading to a substrate plane imaging sensor. A spatial light modulator is arranged in an intermediate pupil plane of the second branch of the optical system. The SLM imparts a programmable pattern of attenuation that may be used to correct for asymmetries between the first and second modes of illumination or imaging. By use of specific target designs and machine-learning processes, the attenuation patterns may also be programmed to act as filter functions, enhancing sensitivity to specific parameters of interest, such as focus.

    摘要翻译: 公开了用于测量由基板上的光刻工艺形成的目标结构的方法。 目标内的光栅结构小于测量光学系统的照明点和视场。 光学系统具有通向光瞳平面成像传感器的第一分支和通向基板平面成像传感器的第二分支。 空间光调制器被布置在光学系统的第二分支的中间光瞳平面中。 SLM赋予可编程的衰减模式,其可用于校正第一和第二照明模式或成像之间的不对称性。 通过使用特定的目标设计和机器学习过程,衰减模式也可以被编程为充当滤波器功能,增强对诸如焦点的特定参数的敏感性。

    Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
    9.
    发明授权
    Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method 失效
    检测方法和装置,光刻设备,光刻处理单元和器件制造方法

    公开(公告)号:US08223347B2

    公开(公告)日:2012-07-17

    申请号:US12822422

    申请日:2010-06-24

    IPC分类号: G01N21/47 G01B11/00

    摘要: A method of determining an overlay error between two successive layers produced by a lithographic process on a substrate, including using the lithographic process to form a calibration structure including a periodic structure of the same pitch on each of the layers, such that an overlaid pair of periodic structures is formed, the structures being parallel, but offset relative to each other by an overlay amount. A spectrum produced by directing a beam of radiation onto the calibration structure is measured and compared with one or more modeled spectra so as to determine values of the grating parameters for the calibration structure from the measured spectrum. The lithographic process is used to form further overlaid periodic structures on the same or one or more subsequent substrates, the determined grating parameter values for the calibration structure being used to determine overlay amounts for the further overlaid periodic structures.

    摘要翻译: 一种确定由光刻工艺在衬底上产生的两个连续层之间的重叠误差的方法,包括使用光刻工艺形成包括在每个层上相同间距的周期性结构的校准结构,使得重叠的一对 形成周期性结构,结构是平行的,但是相对于彼此偏移了重叠量。 测量通过将辐射束引导到校准结构上产生的光谱,并将其与一个或多个建模光谱进行比较,以便根据测量的光谱确定校准结构的光栅参数的值。 光刻工艺用于在相同或一个或多个后续衬底上形成进一步覆盖的周期性结构,所确定的校准结构的光栅参数值用于确定进一步覆盖的周期性结构的重叠量。