公开(公告)号：US20170229373A1

公开(公告)日：2017-08-10

申请号：US15495324

申请日：2017-04-24

Applicant: JAE CHOON KIM ,  JICHUL KIM ,  Jin-Kwon BAE ,  EUNSEOK CHO

Inventor： JAE CHOON KIM ,  JICHUL KIM ,  Jin-Kwon BAE ,  EUNSEOK CHO

IPC: H01L23/38 ,  H01L25/10 ,  H01L25/18 ,  F25B21/02 ,  H01L35/32

CPC classification number: H01L23/38 ,  F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/18 ,  H01L35/32 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

公开(公告)号：US08692349B2

公开(公告)日：2014-04-08

申请号：US13240574

申请日：2011-09-22

Applicant: Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

Inventor： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

IPC: H01L31/058

CPC classification number: G05F1/463 ,  H01L23/34 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

Abstract translation: 示例性实施例涉及一种包括半导体封装的半导体器件，其中半导体芯片安装在封装衬底上。 半导体封装可以包括温度测量装置和温度控制电路。 温度测量装置可以测量半导体封装的温度。 温度控制电路可以基于由温度测量装置测量的半导体封装的温度来改变半导体封装的操作速度。

公开(公告)号：US20110018119A1

公开(公告)日：2011-01-27

申请号：US12801274

申请日：2010-06-01

Applicant: Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

Inventor： Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

IPC: H01L23/34 ,  H01L23/488

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.

Abstract translation: 半导体封装可以包括安装在基板上的至少一个半导体芯片，适于模制至少一个半导体芯片的模制层，在模制层上的具有其中在导体之间提供电介质的结构的热块，以及 通过将热块电连接到基底的通孔。

公开(公告)号：US09228763B2

公开(公告)日：2016-01-05

申请号：US13692394

申请日：2012-12-03

Applicant: Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

Inventor： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC: H01L35/32 ,  F25B21/02

CPC classification number: F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L35/32 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.

Abstract translation: 提供热电冷却封装及其热管理方法。 该方法可以包括测量包括半导体芯片和热电冷却器的热电冷却封装的温度，将热电冷却封装的温度与目标温度进行比较，当热电冷却封装的温度高于 目标温度，并且当热电冷却封装的温度变得低于目标温度时，停止热电冷却器的操作。

公开(公告)号：US20140327129A1

公开(公告)日：2014-11-06

申请号：US14226981

申请日：2014-03-27

Applicant: Eunseok CHO ,  Heejung HWANG

Inventor： Eunseok CHO ,  Heejung HWANG

IPC: H01L23/34 ,  H01L25/18

CPC classification number: H01L23/3675 ,  H01L23/42 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00011

Abstract: Provided is a package on package (PoP) device and a method of manufacturing the same. In the PoP device, a thermal interface material layer is interposed between a lower semiconductor chip and an upper package substrate, and a heat sink is disposed on an upper semiconductor package substrate. This maximizes heat release. Accordingly, an operation speed can be improved and malfunction limitation can be solved.

Abstract translation: 提供了一种封装（PoP）装置及其制造方法。 在PoP装置中，在下部半导体芯片和上部封装基板之间插入热界面材料层，在上部半导体封装基板上设置散热器。 这最大限度地发挥热量。 因此，可以提高操作速度并且可以解决故障限制。

公开(公告)号：US09606591B2

公开(公告)日：2017-03-28

申请号：US13617619

申请日：2012-09-14

Applicant: Heungkyu Kwon ,  Jae Choon Kim ,  Eunseok Cho ,  Jichul Kim

Inventor： Heungkyu Kwon ,  Jae Choon Kim ,  Eunseok Cho ,  Jichul Kim

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G01J5/10 ,  G05B15/02

Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

公开(公告)号：US20130166093A1

公开(公告)日：2013-06-27

申请号：US13617262

申请日：2012-09-14

Applicant: Jae Choon Kim ,  Jichul Kim ,  Hyunggil Baek ,  Eunseok Cho

Inventor： Jae Choon Kim ,  Jichul Kim ,  Hyunggil Baek ,  Eunseok Cho

IPC: G05D23/00

CPC classification number: H01L23/34 ,  G06F1/203 ,  G06F1/206 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device may be operated in any of a plurality of heat-dissipation modes to accommodate temperature rises, including rapid temperature rises, while allowing an electronic device to continue operating. A parameter such as clock frequency, a supply voltage, current consumption, the number of applications running, or other operating parameter, may be manipulated to control internal heat dissipation and thereby accommodate factors, such as external temperature rises. One operation mode may be a maximum operation mode in which clock(s) operate at their highest frequencies and power is supplied at its highest level. A shut-down operation mode, in which a processor cuts power to electronic components, may be entered when a temperature of interest exceeds a predetermined threshold.

Abstract translation: 电子设备可以以多种散热模式中的任何一种操作，以适应包括快速升温的温度上升，同时允许电子设备继续操作。 可以操纵诸如时钟频率，电源电压，电流消耗，运行数量或其他操作参数的参数以控制内部散热，从而适应诸如外部温度升高的因素。 一个操作模式可以是其中时钟以其最高频率操作并且在其最高电平提供功率的最大操作模式。 当感兴趣的温度超过预定阈值时，可以进入处理器切断电子部件的电源的关闭操作模式。

公开(公告)号：US20120133427A1

公开(公告)日：2012-05-31

申请号：US13240574

申请日：2011-09-22

Applicant: Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

Inventor： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

IPC: H01L27/00

CPC classification number: G05F1/463 ,  H01L23/34 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

Abstract translation: 示例性实施例涉及一种包括半导体封装的半导体器件，其中半导体芯片安装在封装衬底上。 半导体封装可以包括温度测量装置和温度控制电路。 温度测量装置可以测量半导体封装的温度。 温度控制电路可以基于由温度测量装置测量的半导体封装的温度来改变半导体封装的操作速度。

公开(公告)号：US09030826B2

公开(公告)日：2015-05-12

申请号：US13535967

申请日：2012-06-28

Applicant: Jichul Kim ,  Jae Choon Kim ,  Young-deuk Kim ,  Eunseok Cho

Inventor： Jichul Kim ,  Jae Choon Kim ,  Young-deuk Kim ,  Eunseok Cho

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/498 ,  H01L23/36 ,  H01L23/373

CPC classification number: H01L23/4985 ,  H01L23/36 ,  H01L23/3736 ,  H01L2224/16225

Abstract: Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.

Abstract translation: 提供片上胶卷包装。 片上胶片包装包括具有彼此相对的第一表面和第二表面的膜基材，第一表面上的半导体芯片和与第二表面相邻的热变形部件。 热变形构件具有使其形状根据温度变形的结构。 还提供了相关的设备和设备组件。

公开(公告)号：US20150084170A1

公开(公告)日：2015-03-26

申请号：US14493379

申请日：2014-09-23

Applicant: Hohyeuk IM ,  JONGKOOK KIM ,  Gowoon SEONG ,  SeokWon LEE ,  BYOUNGWOOK JANG ,  EUNSEOK CHO

Inventor： Hohyeuk IM ,  JONGKOOK KIM ,  Gowoon SEONG ,  SeokWon LEE ,  BYOUNGWOOK JANG ,  EUNSEOK CHO

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1438 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

Abstract: Provided is a semiconductor package including a lower package, an interposer on the lower package, and an upper package on the interposer. The lower package may include a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower heat-transfer layer on the lower semiconductor chip. The interposer may include an interposer substrate, first and second heat-transfer openings defined by recessed bottom and top surfaces, respectively, of the interposer substrate, an upper interposer heat-transfer pad disposed in the second heat-transfer opening, and an upper heat-transfer layer disposed on the upper interposer heat-transfer pad. The upper package may include an upper package substrate, an upper package heat-transfer pad, which may be disposed in a third heat-transfer opening defined by a recessed bottom surface of the upper package substrate, and an upper semiconductor chip disposed on the upper package substrate.

Abstract translation: 提供了一种半导体封装，其包括下封装，下封装上的插入件和插入件上的上封装。 下封装可以包括下封装衬底，下封装衬底上的下半导体芯片和下半导体芯片上的下传热层。 插入器可以包括插入器基板，分别由插入器基板的凹入的底部和顶部表面限定的第一和第二传热开口，设置在第二传热开口中的上插入件传热垫，以及上部热 - 转移层，设置在上部插入件传热垫上。 上封装可以包括上封装衬底，上封装传热垫，其可以设置在由上封装衬底的凹陷底表面限定的第三传热开口中，以及设置在上封装衬底上的上半导体芯片 封装衬底。