公开(公告)号：US08269342B2

公开(公告)日：2012-09-18

申请号：US12801274

申请日：2010-06-01

Applicant: Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

Inventor： Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

IPC: H01L23/34

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.

Abstract translation: 半导体封装可以包括安装在基板上的至少一个半导体芯片，适于模制至少一个半导体芯片的模制层，在模制层上的具有其中在导体之间提供电介质的结构的热块，以及 通过将热块电连接到基底的通孔。

公开(公告)号：US20100304530A1

公开(公告)日：2010-12-02

申请号：US12788956

申请日：2010-05-27

Applicant: Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

Inventor： Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

IPC: H01L21/56

CPC classification number: H01L23/04 ,  H01L23/3128 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2224/0401

Abstract: Provided is a method of forming a semiconductor package. In the method, a first package including a first chip on a first substrate is formed, a second package including a second chip on a second substrate is formed, a moulding cap provided with a via hole and a recess structure configured to receive the first chip is formed, and the second package is provided on the first package with the moulding cap being therebetween such that the recess receives the first chip. The via hole and the recess structure are simultaneously foamed.

Abstract translation: 提供一种形成半导体封装的方法。 在该方法中，形成包括在第一基板上的第一芯片的第一封装，在第二基板上形成包括第二芯片的第二封装，设置有通孔和凹陷结构的成型盖， 并且所述第二包装设置在所述第一包装上，所述模制帽在其间，使得所述凹部接收所述第一芯片。 通孔和凹槽结构同时发泡。

公开(公告)号：US08569114B2

公开(公告)日：2013-10-29

申请号：US12788956

申请日：2010-05-27

Applicant: Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

Inventor： Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

IPC: H01L21/00

CPC classification number: H01L23/04 ,  H01L23/3128 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2224/0401

Abstract: Provided is a method of forming a semiconductor package. In the method, a first package including a first chip on a first substrate is formed, a second package including a second chip on a second substrate is formed, a molding cap provided with a via hole and a recess structure configured to receive the first chip is formed, and the second package is provided on the first package with the molding cap being therebetween such that the recess receives the first chip. The via hole and the recess structure are simultaneously formed.

Abstract translation: 提供一种形成半导体封装的方法。 在该方法中，形成包括在第一基板上的第一芯片的第一封装，在第二基板上形成包括第二芯片的第二封装，设置有通孔和凹陷结构的成型盖， 并且所述第二包装设置在所述第一包装上，所述模制帽在其间，使得所述凹部接收所述第一芯片。 通孔和凹槽结构同时形成。

公开(公告)号：US20110018119A1

公开(公告)日：2011-01-27

申请号：US12801274

申请日：2010-06-01

Applicant: Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

Inventor： Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

IPC: H01L23/34 ,  H01L23/488

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.

Abstract translation: 半导体封装可以包括安装在基板上的至少一个半导体芯片，适于模制至少一个半导体芯片的模制层，在模制层上的具有其中在导体之间提供电介质的结构的热块，以及 通过将热块电连接到基底的通孔。