Invention Application
- Patent Title: THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
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Application No.: US15495324Application Date: 2017-04-24
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Publication No.: US20170229373A1Publication Date: 2017-08-10
- Inventor: JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
- Applicant: JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
- Priority: KR10-2011-0127818 20111201
- Main IPC: H01L23/38
- IPC: H01L23/38 ; H01L25/10 ; H01L25/18 ; F25B21/02 ; H01L35/32
Abstract:
A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.
Public/Granted literature
- US10658266B2 Thermoelectric cooling packages and thermal management methods thereof Public/Granted day:2020-05-19
Information query
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