Invention Grant
- Patent Title: Surface temperature management method of mobile device and memory thermal management method of multichip package
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Application No.: US13617619Application Date: 2012-09-14
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Publication No.: US09606591B2Publication Date: 2017-03-28
- Inventor: Heungkyu Kwon , Jae Choon Kim , Eunseok Cho , Jichul Kim
- Applicant: Heungkyu Kwon , Jae Choon Kim , Eunseok Cho , Jichul Kim
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0102804 20111010
- Main IPC: G06F1/20
- IPC: G06F1/20
Abstract:
A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.
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