公开(公告)号：US07282261B2

公开(公告)日：2007-10-16

申请号：US10367180

申请日：2003-02-13

申请人： Luping Zhao ,  Koon Gee Neoh ,  En-Tang Kang

发明人： Luping Zhao ,  Koon Gee Neoh ,  En-Tang Kang

IPC分类号： B32B27/06 ,  B32B27/16 ,  C23C14/12 ,  C23C14/34

CPC分类号： C23C14/12 ,  Y10T428/265 ,  Y10T428/3154 ,  Y10T428/31544

摘要： This invention relates to a method of enhancing the stability of electroactive polymers, redox active materials, or a composite comprising an electroactive polymer and a redox active material, which comprises depositing on the electroactive polymers, the redox active materials, or the composite, a fluoropolymer by radio frequency sputtering. The invention also relates to electroactive polymers, redox active materials, or a composite comprising an electroactive polymer and a redox active material, that bears a radio frequency sputtered fluoropolymer coating.

摘要翻译： 本发明涉及提高电活性聚合物，氧化还原活性材料或包含电活性聚合物和氧化还原活性材料的复合物的稳定性的方法，其包括在电活性聚合物，氧化还原活性材料或复合材料上沉积氟聚合物 通过射频溅射。 本发明还涉及电活性聚合物，氧化还原活性材料或包含电活性聚合物和氧化还原活性材料的复合材料，其具有射频溅射的氟聚合物涂层。

公开(公告)号：US06540866B1

公开(公告)日：2003-04-01

申请号：US09604959

申请日：2000-06-28

申请人： Junfeng Zhang ,  Cheng Qiang Cui ,  Thiam Beng Lim ,  En-Tang Kang

发明人： Junfeng Zhang ,  Cheng Qiang Cui ,  Thiam Beng Lim ,  En-Tang Kang

IPC分类号： B32B3112

CPC分类号： C08J7/18 ,  B32B7/12 ,  B32B27/06 ,  B32B38/162 ,  B32B2311/00 ,  B32B2327/12 ,  B32B2457/08 ,  C08J2327/12 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2203/095 ,  H05K2203/1168

摘要： The present invention is directed to a method for the lamination of fluoropolymers to the surfaces of metals, and especially to copper, gold, and platinum, and to printed circuit board (PCB) substrate at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of metals in the presence of a functional monomer and an adhesive such as an epoxy resin. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The laminated fluoropolymer-metal or fluoropolymer-PCB substrate interfaces exhibit T-peel strengths of no less than 8 N/cm. This invention can also be applied to substantially improve the adhesion between PCB substrates and metals.

摘要翻译： 本发明涉及一种用于将氟聚合物层压到金属表面，特别是铜，金和铂表面的方法，以及在基本上低于烧结温度或熔融温度的温度下的印刷电路板（PCB） 含氟聚合物。 更具体地，本发明涉及一种通过在功能性单体和诸如环氧树脂的粘合剂存在下金属的同时层压的热接枝共聚来进行含氟聚合物的表面改性的方法。 该方法可以在大气条件下和完全不加入聚合引发剂的情况下进行。 层压氟聚合物 - 金属或含氟聚合物 - PCB基板界面表现出不小于8N / cm的T-剥离强度。 本发明也可以应用于基本上改善PCB衬底和金属之间的粘合性。

公开(公告)号：US06334926B1

公开(公告)日：2002-01-01

申请号：US09327959

申请日：1999-06-08

申请人： En Tang Kang ,  Jian-Li Shi ,  Koon Gee Neoh ,  Kuang Lee Tan ,  Cheng Qiang Cui ,  Thiam Beng Lim

发明人： En Tang Kang ,  Jian-Li Shi ,  Koon Gee Neoh ,  Kuang Lee Tan ,  Cheng Qiang Cui ,  Thiam Beng Lim

IPC分类号： B32B3112

CPC分类号： C08J5/124 ,  B32B15/08 ,  B32B38/0008 ,  B32B2037/0092 ,  B32B2310/14 ,  B32B2311/12 ,  B32B2327/12 ,  C08J7/123 ,  C08J2327/12 ,  H01L21/32051 ,  H01L21/76826

摘要： The present invention is directed to a method for the lamination of metals, and especially copper, to the surfaces of fluoropolymers at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of a metal (e.g. copper) in the presence of a functional monomer. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The so-laminated fluoropolymer-metal interfaces exhibit T-peel strengths of no less than 8 N/cm and delaminate via cohesive failure inside the fluoropolymer.

摘要翻译： 本发明涉及一种用于在基本上低于含氟聚合物的烧结温度或熔融温度的温度下将金属尤其是铜层压到含氟聚合物表面的方法。 更具体地，本发明涉及一种通过在功能性单体存在下同时层压金属（例如铜）的热接枝共聚来表面改性含氟聚合物的方法。 该方法可以在大气条件下和完全不加入聚合引发剂的情况下进行。 如此层压的含氟聚合物 - 金属界面表现出不低于8N / cm的T剥离强度，并且通过含氟聚合物内部的内聚破坏而脱层。

公开(公告)号：US08758935B2

公开(公告)日：2014-06-24

申请号：US13148022

申请日：2010-02-04

申请人： Qi-Dan Ling ,  Jian Zhu ,  Chunxiang Zhu ,  Daniel Siu-Hung Chan ,  En-Tang Kang ,  Koon-Gee Neoh

发明人： Qi-Dan Ling ,  Jian Zhu ,  Chunxiang Zhu ,  Daniel Siu-Hung Chan ,  En-Tang Kang ,  Koon-Gee Neoh

IPC分类号： H01M4/02 ,  H01M10/18 ,  H01M6/48 ,  C08G61/10

CPC分类号： H01L51/0043 ,  C08G61/02 ,  C08G2261/142 ,  C08G2261/1424 ,  C08G2261/143 ,  C08G2261/3422

摘要： A compound comprises a polymeric chain with a repeat unit repeated more than 5 times. The repeat unit comprises conjugated first and second cyclic groups and a plurality of side groups each bonded to one of the cyclic groups. A side group bonded to the first cyclic group is an electron donor and a side group bonded to the second cyclic group is an electron acceptor, such that the compound is switchable between first and second electrical conductive states by application of an electric field to the compound. At least one of the side groups is selected so that the compound is soluble in an organic solvent. The compound may be used in films, memory cells, or electronic devices. A layer of the compound may be formed on a surface by dissolving the compound in an organic solvent, applying the solution to the surface, and then removing the solvent.

摘要翻译： 化合物包括具有重复多于5次的重复单元的聚合物链。 重复单元包括共轭的第一和第二环状基团和多个侧基，每个侧基键合到一个环状基团。 键合到第一环状基团的侧基是电子给体，并且与第二环状基团键合的侧基是电子受体，使得化合物可以通过向化合物施加电场而在第一和第二导电状态之间切换 。 选择至少一个侧基，使得该化合物可溶于有机溶剂。 该化合物可用于膜，记忆电池或电子器件中。 可以通过将化合物溶解在有机溶剂中，将溶液施加到表面，然后除去溶剂，在表面上形成一层化合物。

公开(公告)号：US07473445B2

公开(公告)日：2009-01-06

申请号：US09895153

申请日：2001-07-02

申请人： Koon Gee Neoh ,  En-tang Kang ,  Sock Wee Ng ,  Jeyagowry T. Sampanthar

发明人： Koon Gee Neoh ,  En-tang Kang ,  Sock Wee Ng ,  Jeyagowry T. Sampanthar

IPC分类号： C08F2/48 ,  B05D5/12 ,  B05D1/36 ,  B05D7/00 ,  B05D3/06

CPC分类号： C08J7/18 ,  H01B1/128

摘要： An electrically conductive polymeric article exhibiting enhanced conductivity including a polymeric material capable of exhibiting electrical conductivity;the polymeric material being rendered electrically conductive by treatment with UV or near UV irradiation in the presence of a viologen salt.

公开(公告)号：US20110294976A1

公开(公告)日：2011-12-01

申请号：US13148022

申请日：2010-02-04

申请人： Qi-Dan Ling ,  Chuxiang Zhu ,  Daniel Siu-Hung Chan ,  En-Tang Kang ,  Koon-Gee Neoh

发明人： Qi-Dan Ling ,  Chuxiang Zhu ,  Daniel Siu-Hung Chan ,  En-Tang Kang ,  Koon-Gee Neoh

IPC分类号： C08G61/02 ,  H01L51/30 ,  C07C211/43

CPC分类号： H01L51/0043 ,  C08G61/02 ,  C08G2261/142 ,  C08G2261/1424 ,  C08G2261/143 ,  C08G2261/3422

摘要： A compound comprises a polymeric chain with a repeat unit repeated more than 5 times. The repeat unit comprises conjugated first and second cyclic groups and a plurality of side groups each bonded to one of the cyclic groups. A side group bonded to the first cyclic group is an electron donor and a side group bonded to the second cyclic group is an electron acceptor, such that the compound is switchable between first and second electrical conductive states by application of an electric field to the compound. At least one of the side groups is selected so that the compound is soluble in an organic solvent. The compound may be used in films, memory cells, or electronic devices. A layer of the compound may be formed on a surface by dissolving the compound in an organic solvent, applying the solution to the surface, and then removing the solvent.

摘要翻译： 化合物包括具有重复多于5次的重复单元的聚合物链。 重复单元包括共轭的第一和第二环状基团和多个侧基，每个侧基键合到一个环状基团。 键合到第一环状基团的侧基是电子给体，并且与第二环状基团键合的侧基是电子受体，使得化合物可以通过向化合物施加电场而在第一和第二导电状态之间切换 。 选择至少一个侧基，使得该化合物可溶于有机溶剂。 该化合物可用于膜，记忆电池或电子器件中。 可以通过将化合物溶解在有机溶剂中，将溶液施加到表面，然后除去溶剂，在表面上形成一层化合物。

公开(公告)号：US20070290199A1

公开(公告)日：2007-12-20

申请号：US11718976

申请日：2005-11-10

申请人： Qidan Ling ,  Wei Huang ,  En-Tang Kang ,  Koon Neoh

发明人： Qidan Ling ,  Wei Huang ,  En-Tang Kang ,  Koon Neoh

IPC分类号： H01L51/30 ,  C07D221/00 ,  C07F9/28 ,  C08G61/12 ,  C09K11/06 ,  H01S3/067 ,  G02F1/061 ,  H01L21/335 ,  H01L33/00

CPC分类号： H05B33/14 ,  C07F5/003 ,  C08G61/02 ,  C08G61/12 ,  C08G61/123 ,  C08G61/124 ,  C08G73/026 ,  C09K11/06 ,  C09K2211/1416 ,  C09K2211/182 ,  H01L51/0043 ,  H01L51/0089 ,  H01L51/5012

摘要： The invention relates to copolymer complexes of the formula (I): wherein [Ax-[B(C)]y-Dz] denotes a single unit of the copolymer complex that is repeated n times, wherein n is an integer greater than one, and wherein the single unit comprises a conjugated backbone coordinated to a complex (C) comprising rare earth metal(s); x, y and z are numbers greater than zero such that x=y+z; A is independently selected from a group consisting of: fluorene, carbazole, oxadiazole, triphenylamine or derivatives thereof; B is a functional ligand selected from the group consisting of: benzoic acid, 1,3-diphenylpropane-1,3-dione, 1,10-phenanthroline, 2,2-bipyridine, or derivatives thereof; and D is independently selected from a group consisting of: fluorene, carbazole, oxadiazole, triphenylamine or derivatives thereof.

摘要翻译： 本发明涉及式（I）的共聚物络合物：其中[A x X - - [B（C）] - N - 表示重复n次的共聚物复合物的单一单位，其中n是大于1的整数，并且其中单个单元包含与包含稀土金属的络合物（C）配位的共轭骨架; x，y和z是大于零的数字，使得x = y + z; A独立地选自：芴，咔唑，恶二唑，三苯胺或其衍生物; B是选自：苯甲酸，1,3-二苯基丙烷-1,3-二酮，1,10-菲咯啉，2,2-联吡啶或其衍生物的官能配体; D独立地选自：芴，咔唑，恶二唑，三苯胺或其衍生物。

公开(公告)号：US06652797B1

公开(公告)日：2003-11-25

申请号：US09700012

申请日：2001-05-30

申请人： Ying Kit Chew ,  Yoke San Wong ,  Ying His Jerry Fuh ,  Han Tong Loh ,  Yeh Ching Andrew Nee ,  Yoo Sang Choo ,  Li Lu ,  Kah Bin Lim ,  Chee Leong Teo ,  En Tang Kang ,  Tetsuo Miyazawa

发明人： Ying Kit Chew ,  Yoke San Wong ,  Ying His Jerry Fuh ,  Han Tong Loh ,  Yeh Ching Andrew Nee ,  Yoo Sang Choo ,  Li Lu ,  Kah Bin Lim ,  Chee Leong Teo ,  En Tang Kang ,  Tetsuo Miyazawa

IPC分类号： B29C3508

CPC分类号： B29C64/135 ,  B33Y40/00 ,  B33Y50/00

摘要： A method for determining the areas of resin to be cured in an optical stereolithography process for rapid prototyping using sequential laser curing of layers of a resin having a selected thickness to produce a desired shape of cured resin. The method includes the steps of generating a computer model of desired shape and dividing the model into layers of thickness equal to the thickness of the layers each defining an area of resin to be cured. A set of layers including and sequentially adjacent an intermediate layer is selected and the areas in the intermediate layer of resin which would be oversized by laser curing of layers later in the curing sequence is determined. The 2-D layer data used to build a 3-D model is modified to compensate for the oversizing and the steps repeated by sequentially selecting sets of layers to include substantially all of the layers as the intermediate layer. The sets are sequentially selected with each subsequent set having the intermediate layer being the layer adjacent the intermediate layer of the previously selected set. The first selected set includes the first layer to be cured and the sequential subsequent sets respectively include as the intermediate layer the subsequently cured adjacent layer.

摘要翻译： 一种用于通过使用具有所选厚度的树脂的层的顺序激光固化来快速成型的光学立体光刻工艺中的待固化树脂的面积以产生所需形状的固化树脂的方法。 该方法包括以下步骤：产生所需形状的计算机模型，并将模型划分成等于每个限定要固化的树脂区域的层的厚度的厚度的层。 选择包括中间层并且顺序地邻近中间层的一组层，并且确定在固化顺序中稍后通过激光固化的层中的树脂中间层中的区域。 用于构建3-D模型的2-D层数据被修改，以通过依次选择层数来包括基本上所有的层作为中间层来补偿过大和重复的步骤。 顺序地选择这些组，每个随后的集合具有中间层，其是与先前选择的集合的中间层相邻的层。 第一选定组包括待固化的第一层，并且顺序后续组分别包括随后固化的相邻层作为中间层。

公开(公告)号：US4956444A

公开(公告)日：1990-09-11

申请号：US36497

申请日：1987-04-09

申请人： En-Tang Kang ,  Thiam C. Tan ,  Koon G. Neoh

发明人： En-Tang Kang ,  Thiam C. Tan ,  Koon G. Neoh

IPC分类号： C08G61/12

CPC分类号： C08G61/123

摘要： A simple chemical process for the simultaneous polymerization and oxidation of pyrrole, N-substituted pyrroles, and other heterocycles having five or six member rings by halogenic or organic electron acceptors. The polypyrrole-acceptor charge transfer complexes so produced are of high purity and are stable in the atmosphere, in the presence of moisture and at elevated temperatures. The conductivities of the complexes are controllable between 30 ohm.sup.-1 cm.sup.-1 and 10.sup.-3 ohm-1 cm-1, depending on the type of acceptor used and the process conditions.

摘要翻译： 用于通过卤素或有机电子受体同时聚合和氧化吡咯，N-取代的吡咯和具有五个或六个成员环的其它杂环的简单化学方法。 如此生产的聚吡咯 - 受体电荷转移络合物具有高纯度，并且在大气中，在水分和高温下都是稳定的。 取决于所使用的受体的类型和工艺条件，络合物的电导率可在30 ohm-1 cm-1和10-3 ohm-1 cm-1之间控制。

公开(公告)号：US06537411B1

公开(公告)日：2003-03-25

申请号：US09604960

申请日：2000-06-28

申请人： En-Tang Kang ,  Arthur Khoon Siah Ang ,  Koon Gee Neoh ,  Cheng Qiang Cui ,  Thiam Beng Lim

发明人： En-Tang Kang ,  Arthur Khoon Siah Ang ,  Koon Gee Neoh ,  Cheng Qiang Cui ,  Thiam Beng Lim

IPC分类号： B32B3112

CPC分类号： C08J7/16 ,  B32B15/08 ,  B32B38/0008 ,  B32B2310/0481 ,  B32B2310/0887 ,  B32B2310/14 ,  B32B2311/12 ,  B32B2379/08 ,  C08J5/124 ,  C08J2379/08 ,  H05K1/0346 ,  H05K3/38 ,  H05K3/381 ,  H05K3/386 ,  H05K2203/1168

摘要： The present invention is directed to a method for the lamination of metals, and especially copper, to the surface of polyimides and derivatives of polyimides at temperatures substantially below the curing temperature of the imide polymers. More specifically, the invention is directed to a method for surface modification of polyimides and derivatives of polyimides by thermal graft copolymerization and interfacial polymerization with concurrent lamination of the metal of interest in the presence of an appropriate functional monomer. The process can be carried out under atmospheric conditions and either in the presence or the complete absence of an added polymerization initiator. The so laminated polyimide-metal interfaces exhibit T-peel adhesion strengths in excess of 16 N/cm. The adhesion strength also exceeds the fracture strength of polyimide films with a thickness of 75 &mgr;m.

摘要翻译： 本发明涉及一种用于在基本上低于酰亚胺聚合物的固化温度的温度下将金属，特别是铜层压到聚酰亚胺和聚酰亚胺衍生物的表面的方法。 更具体地，本发明涉及通过热接枝共聚和界面聚合以及在合适的官能单体的存在下同时层压感兴趣的金属的聚酰亚胺和聚酰亚胺衍生物进行表面改性的方法。 该方法可以在大气条件下进行，或者在存在或完全不存在加入的聚合引发剂的情况下进行。 如此层压的聚酰亚胺 - 金属界面表现出超过16N / cm的T-剥离粘合强度。 粘合强度也超过厚度为75μm的聚酰亚胺膜的断裂强度。