Method for low temperature lamination of metals to fluoropolymers
    1.
    发明授权
    Method for low temperature lamination of metals to fluoropolymers 失效
    金属与含氟聚合物的低温层压方法

    公开(公告)号:US06334926B1

    公开(公告)日:2002-01-01

    申请号:US09327959

    申请日:1999-06-08

    IPC分类号: B32B3112

    摘要: The present invention is directed to a method for the lamination of metals, and especially copper, to the surfaces of fluoropolymers at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of a metal (e.g. copper) in the presence of a functional monomer. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The so-laminated fluoropolymer-metal interfaces exhibit T-peel strengths of no less than 8 N/cm and delaminate via cohesive failure inside the fluoropolymer.

    摘要翻译: 本发明涉及一种用于在基本上低于含氟聚合物的烧结温度或熔融温度的温度下将金属尤其是铜层压到含氟聚合物表面的方法。 更具体地,本发明涉及一种通过在功能性单体存在下同时层压金属(例如铜)的热接枝共聚来表面改性含氟聚合物的方法。 该方法可以在大气条件下和完全不加入聚合引发剂的情况下进行。 如此层压的含氟聚合物 - 金属界面表现出不低于8N / cm的T剥离强度,并且通过含氟聚合物内部的内聚破坏而脱层。