Method of enhancing the stability of electroactive polymers and redox active materials
    1.
    发明授权
    Method of enhancing the stability of electroactive polymers and redox active materials 有权
    提高电活性聚合物和氧化还原活性物质稳定性的方法

    公开(公告)号:US07282261B2

    公开(公告)日:2007-10-16

    申请号:US10367180

    申请日:2003-02-13

    摘要: This invention relates to a method of enhancing the stability of electroactive polymers, redox active materials, or a composite comprising an electroactive polymer and a redox active material, which comprises depositing on the electroactive polymers, the redox active materials, or the composite, a fluoropolymer by radio frequency sputtering. The invention also relates to electroactive polymers, redox active materials, or a composite comprising an electroactive polymer and a redox active material, that bears a radio frequency sputtered fluoropolymer coating.

    摘要翻译: 本发明涉及提高电活性聚合物,氧化还原活性材料或包含电活性聚合物和氧化还原活性材料的复合物的稳定性的方法,其包括在电活性聚合物,氧化还原活性材料或复合材料上沉积氟聚合物 通过射频溅射。 本发明还涉及电活性聚合物,氧化还原活性材料或包含电活性聚合物和氧化还原活性材料的复合材料,其具有射频溅射的氟聚合物涂层。

    Soluble polymer with multi-stable electric states and products comprising such polymer
    2.
    发明授权
    Soluble polymer with multi-stable electric states and products comprising such polymer 失效
    具有多稳态电状态的可溶性聚合物和包含这种聚合物的产品

    公开(公告)号:US08758935B2

    公开(公告)日:2014-06-24

    申请号:US13148022

    申请日:2010-02-04

    摘要: A compound comprises a polymeric chain with a repeat unit repeated more than 5 times. The repeat unit comprises conjugated first and second cyclic groups and a plurality of side groups each bonded to one of the cyclic groups. A side group bonded to the first cyclic group is an electron donor and a side group bonded to the second cyclic group is an electron acceptor, such that the compound is switchable between first and second electrical conductive states by application of an electric field to the compound. At least one of the side groups is selected so that the compound is soluble in an organic solvent. The compound may be used in films, memory cells, or electronic devices. A layer of the compound may be formed on a surface by dissolving the compound in an organic solvent, applying the solution to the surface, and then removing the solvent.

    摘要翻译: 化合物包括具有重复多于5次的重复单元的聚合物链。 重复单元包括共轭的第一和第二环状基团和多个侧基,每个侧基键合到一个环状基团。 键合到第一环状基团的侧基是电子给体,并且与第二环状基团键合的侧基是电子受体,使得化合物可以通过向化合物施加电场而在第一和第二导电状态之间切换 。 选择至少一个侧基,使得该化合物可溶于有机溶剂。 该化合物可用于膜,记忆电池或电子器件中。 可以通过将化合物溶解在有机溶剂中,将溶液施加到表面,然后除去溶剂,在表面上形成一层化合物。

    Multi-functional copolymers comprising rare earth metal complexes and devices thereof
    3.
    发明授权
    Multi-functional copolymers comprising rare earth metal complexes and devices thereof 失效
    包含稀土金属络合物的多功能共聚物及其装置

    公开(公告)号:US07679082B2

    公开(公告)日:2010-03-16

    申请号:US11718976

    申请日:2005-11-10

    摘要: The invention relates to copolymer complexes of the formula (I): wherein [Ax-[B(C)]y-Dz] denotes a single unit of the copolymer complex that is repeated n times, wherein n is an integer greater than one, and wherein the single unit comprises a conjugated backbone coordinated to a complex (C) comprising rare earth metal(s); x, y and z are numbers greater than zero such that x=y+z; A is independently selected from a group consisting of: fluorene, carbazole, oxadiazole, triphenylamine or derivatives thereof; B is a functional ligand selected from the group consisting of: benzoic acid, 1,3-diphenylpropane-1,3-dione, 1,10-phenanthroline, 2,2-bipyridine, or derivatives thereof; and D is independently selected from a group consisting of: fluorene, carbazole, oxadiazole, triphenylamine or derivatives thereof.

    摘要翻译: 本发明涉及式(I)的共聚物络合物:其中[Ax- [B(C)] y-Dz]表示重复n次共聚物络合物的单一单元,其中n是大于1的整数, 并且其中所述单一单元包含与包含稀土金属的络合物(C)配位的共轭骨架; x,y和z是大于零的数字,使得x = y + z; A独立地选自:芴,咔唑,恶二唑,三苯胺或其衍生物; B是选自:苯甲酸,1,3-二苯基丙烷-1,3-二酮,1,10-菲咯啉,2,2-联吡啶或其衍生物的官能配体; D独立地选自:芴,咔唑,恶二唑,三苯胺或其衍生物。

    Adhesive-free adhesion between polymer surfaces
    4.
    发明授权
    Adhesive-free adhesion between polymer surfaces 失效
    聚合物表面之间无胶粘剂

    公开(公告)号:US5755913A

    公开(公告)日:1998-05-26

    申请号:US761122

    申请日:1996-12-06

    摘要: The present invention is directed to a process for imparting adhesive-free adhesion characteristics (i) between two polymer films, (ii) between a polymer film and a polymer fiber, and (iii) between the surface of a polymer fiber or film and a polymer matrix. The adhesive-free adhesion properties of the polymer film and fiber surfaces are introduced through a method for modification of a pre-activated polymer surface via near-UV-light induced or thermally-induced surface graft copolymerization with a functional monomer. The adhesive-free adhesion may be a result of dispersive interaction, chain entanglement, electrostatic interaction, ionic interaction, acid/base interaction, H-bonding and/or covalent bonding of the resulting grafted functional polymer(s) at the interface, or of the resulting grafted functional polymer and the polymer matrix.

    摘要翻译: 本发明涉及一种赋予聚合物膜和聚合物纤维之间的两种聚合物膜之间的无粘合剂粘附特性(i)的方法,(iii)在聚合物纤维或膜的表面和 聚合物基质。 聚合物膜和纤维表面的无粘合剂粘附性通过用功能单体的近紫外光诱导或热诱导表面接枝共聚改性预活化聚合物表面的方法引入。 无粘合剂的粘附可能是由界面处的所得接枝官能聚合物的分散相互作用,链缠结,静电相互作用,离子相互作用,酸/碱相互作用,H键和/或共价键而产生的 所得到的接枝官能聚合物和聚合物基体。

    Method for low temperature lamination of metals to polyimides
    5.
    发明授权
    Method for low temperature lamination of metals to polyimides 失效
    金属与聚酰亚胺的低温层压方法

    公开(公告)号:US06537411B1

    公开(公告)日:2003-03-25

    申请号:US09604960

    申请日:2000-06-28

    IPC分类号: B32B3112

    摘要: The present invention is directed to a method for the lamination of metals, and especially copper, to the surface of polyimides and derivatives of polyimides at temperatures substantially below the curing temperature of the imide polymers. More specifically, the invention is directed to a method for surface modification of polyimides and derivatives of polyimides by thermal graft copolymerization and interfacial polymerization with concurrent lamination of the metal of interest in the presence of an appropriate functional monomer. The process can be carried out under atmospheric conditions and either in the presence or the complete absence of an added polymerization initiator. The so laminated polyimide-metal interfaces exhibit T-peel adhesion strengths in excess of 16 N/cm. The adhesion strength also exceeds the fracture strength of polyimide films with a thickness of 75 &mgr;m.

    摘要翻译: 本发明涉及一种用于在基本上低于酰亚胺聚合物的固化温度的温度下将金属,特别是铜层压到聚酰亚胺和聚酰亚胺衍生物的表面的方法。 更具体地,本发明涉及通过热接枝共聚和界面聚合以及在合适的官能单体的存在下同时层压感兴趣的金属的聚酰亚胺和聚酰亚胺衍生物进行表面改性的方法。 该方法可以在大气条件下进行,或者在存在或完全不存在加入的聚合引发剂的情况下进行。 如此层压的聚酰亚胺 - 金属界面表现出超过16N / cm的T-剥离粘合强度。 粘合强度也超过厚度为75μm的聚酰亚胺膜的断裂强度。

    SOLUBLE POLYMER WITH MULTI-STABLE ELECTRIC STATES AND PRODUCTS COMPRISING SUCH POLYMER
    6.
    发明申请
    SOLUBLE POLYMER WITH MULTI-STABLE ELECTRIC STATES AND PRODUCTS COMPRISING SUCH POLYMER 失效
    具有多个稳定电气状态的可溶性聚合物和包含这种聚合物的产品

    公开(公告)号:US20110294976A1

    公开(公告)日:2011-12-01

    申请号:US13148022

    申请日:2010-02-04

    摘要: A compound comprises a polymeric chain with a repeat unit repeated more than 5 times. The repeat unit comprises conjugated first and second cyclic groups and a plurality of side groups each bonded to one of the cyclic groups. A side group bonded to the first cyclic group is an electron donor and a side group bonded to the second cyclic group is an electron acceptor, such that the compound is switchable between first and second electrical conductive states by application of an electric field to the compound. At least one of the side groups is selected so that the compound is soluble in an organic solvent. The compound may be used in films, memory cells, or electronic devices. A layer of the compound may be formed on a surface by dissolving the compound in an organic solvent, applying the solution to the surface, and then removing the solvent.

    摘要翻译: 化合物包括具有重复多于5次的重复单元的聚合物链。 重复单元包括共轭的第一和第二环状基团和多个侧基,每个侧基键合到一个环状基团。 键合到第一环状基团的侧基是电子给体,并且与第二环状基团键合的侧基是电子受体,使得化合物可以通过向化合物施加电场而在第一和第二导电状态之间切换 。 选择至少一个侧基,使得该化合物可溶于有机溶剂。 该化合物可用于膜,记忆电池或电子器件中。 可以通过将化合物溶解在有机溶剂中,将溶液施加到表面,然后除去溶剂,在表面上形成一层化合物。

    Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate
    7.
    发明授权
    Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate 失效
    含氟聚合物层压到金属和印刷电路板(PCB)基板的方法

    公开(公告)号:US06540866B1

    公开(公告)日:2003-04-01

    申请号:US09604959

    申请日:2000-06-28

    IPC分类号: B32B3112

    摘要: The present invention is directed to a method for the lamination of fluoropolymers to the surfaces of metals, and especially to copper, gold, and platinum, and to printed circuit board (PCB) substrate at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of metals in the presence of a functional monomer and an adhesive such as an epoxy resin. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The laminated fluoropolymer-metal or fluoropolymer-PCB substrate interfaces exhibit T-peel strengths of no less than 8 N/cm. This invention can also be applied to substantially improve the adhesion between PCB substrates and metals.

    摘要翻译: 本发明涉及一种用于将氟聚合物层压到金属表面,特别是铜,金和铂表面的方法,以及在基本上低于烧结温度或熔融温度的温度下的印刷电路板(PCB) 含氟聚合物。 更具体地,本发明涉及一种通过在功能性单体和诸如环氧树脂的粘合剂存在下金属的同时层压的热接枝共聚来进行含氟聚合物的表面改性的方法。 该方法可以在大气条件下和完全不加入聚合引发剂的情况下进行。 层压氟聚合物 - 金属或含氟聚合物 - PCB基板界面表现出不小于8N / cm的T-剥离强度。 本发明也可以应用于基本上改善PCB衬底和金属之间的粘合性。

    Chemical synthesis of stable and electroactive polypyrrole and related
polyheterocyclic compounds
    10.
    发明授权
    Chemical synthesis of stable and electroactive polypyrrole and related polyheterocyclic compounds 失效
    稳定和电活性聚吡咯及相关多环化合物的化学合成

    公开(公告)号:US4956444A

    公开(公告)日:1990-09-11

    申请号:US36497

    申请日:1987-04-09

    IPC分类号: C08G61/12

    CPC分类号: C08G61/123

    摘要: A simple chemical process for the simultaneous polymerization and oxidation of pyrrole, N-substituted pyrroles, and other heterocycles having five or six member rings by halogenic or organic electron acceptors. The polypyrrole-acceptor charge transfer complexes so produced are of high purity and are stable in the atmosphere, in the presence of moisture and at elevated temperatures. The conductivities of the complexes are controllable between 30 ohm.sup.-1 cm.sup.-1 and 10.sup.-3 ohm-1 cm-1, depending on the type of acceptor used and the process conditions.

    摘要翻译: 用于通过卤素或有机电子受体同时聚合和氧化吡咯,N-取代的吡咯和具有五个或六个成员环的其它杂环的简单化学方法。 如此生产的聚吡咯 - 受体电荷转移络合物具有高纯度,并且在大气中,在水分和高温下都是稳定的。 取决于所使用的受体的类型和工艺条件,络合物的电导率可在30 ohm-1 cm-1和10-3 ohm-1 cm-1之间控制。