公开(公告)号：US08390792B2

公开(公告)日：2013-03-05

申请号：US12649539

申请日：2009-12-30

申请人： Bi-Jung Rung ,  Yi-Chih Yeh ,  Li-Lu Chen ,  Yung-Shen Lee

发明人： Bi-Jung Rung ,  Yi-Chih Yeh ,  Li-Lu Chen ,  Yung-Shen Lee

IPC分类号： G01C3/08

CPC分类号： G01S7/4817 ,  G01S7/4972

摘要： A distance measuring device is provided. The distance measuring device includes: a distance sensing unit, for sensing a distance value of a target object; a drive unit, for driving the distance sensing unit to rotate according to a rotation angle; and a compensation unit, for providing a compensation value according to the rotation angle and obtaining an actual distance according to the compensation value and the distance value.

摘要翻译： 提供测距装置。 距离测量装置包括：距离感测单元，用于感测目标物体的距离值; 驱动单元，用于驱动距离感测单元根据旋转角度旋转; 以及补偿单元，用于根据旋转角度提供补偿值，并根据补偿值和距离值获得实际距离。

公开(公告)号：US20120273717A1

公开(公告)日：2012-11-01

申请号：US13518885

申请日：2011-01-10

申请人： Li Lu ,  Pengfei Xiao ,  Man On Lai ,  Jiangfeng Ni

发明人： Li Lu ,  Pengfei Xiao ,  Man On Lai ,  Jiangfeng Ni

IPC分类号： H01M4/58 ,  C01B25/45

CPC分类号： H01M4/5825 ,  C01B25/45 ,  H01M10/052

摘要： A LiMPO4-based composition of matter suitable for use to form cathodes to form high-performance Li-based batteries is disclosed. The composition of matter is defined by the formula LiMPO4, where M is at least one transition metal, and wherein the composition of matter has a general lattice structure. The composition of matter includes Ru ions that substitute for at least one of Li ions and at least one of the ions of the at least one transition metal M. Methods of forming the composition of matter are also disclosed.

摘要翻译： 公开了一种适合用于形成阴极以形成高性能Li基电池的基于LiMPO4的物质组合物。 物质的组成由式LiMPO 4定义，其中M是至少一种过渡金属，并且其中物质的组成具有通常的晶格结构。 物质的组成包括代替Li离子和至少一种过渡金属M的至少一种离子中的至少一种的Ru离子。还公开了形成物质组合物的方法。

公开(公告)号：US20120151709A1

公开(公告)日：2012-06-21

申请号：US13085541

申请日：2011-04-13

申请人： Ya-Lun Tang ,  Li-Lu Chen ,  Hsin-Yi Pai

发明人： Ya-Lun Tang ,  Li-Lu Chen ,  Hsin-Yi Pai

IPC分类号： A47L9/10

CPC分类号： A47L9/1409 ,  A47L9/10

摘要： A dust collection container, capable of being installed in a vacuum cleaner, includes a case body and a blocking member. The blocking member is disposed in the case body to separate the case body into a dust chamber and a diversion chamber, a suction inlet corresponding to the dust chamber and an exhaust opening corresponding to the diversion chamber are disposed in the case body, and a barrier piece is disposed at the blocking member opposite to the suction inlet, so as to form a slow flow area between the barrier piece and the suction inlet to effectively disperse dirt.

摘要翻译： 能够安装在真空吸尘器中的集尘容器包括壳体和阻挡构件。 阻挡构件设置在壳体中，以将壳体分离成灰尘室，分流室，对应于灰尘室的吸入口和对应于分流室的排气口设置在壳体中，并且屏障 所述阻挡件与所述吸入口相对设置，以在所述阻挡件和所述吸入口之间形成缓慢的流动区域，以有效地分散污物。

公开(公告)号：US20110229763A1

公开(公告)日：2011-09-22

申请号：US13130857

申请日：2009-11-23

申请人： Li Lu ,  Man On lai ,  Hailong Wang ,  Hui Xia

发明人： Li Lu ,  Man On lai ,  Hailong Wang ,  Hui Xia

IPC分类号： H01M4/525 ,  H01M4/505 ,  H01M4/88

CPC分类号： H01M4/505 ,  H01M10/0525 ,  Y02E60/122

摘要： A material for use in the cathode terminal of a battery that is made from a lithiated manganese oxide which is doped with ruthenium and optionally with a transition material and a method for the synthesis of the same. The material exhibits improved conductivity and cyclic performance at high current density (current density of 1470 mA/g and higher) and can be used in hybrid vehicles and other electronic devices due to its good cyclic performance at high current density and its relatively large capacity.

摘要翻译： 用于由掺杂有钌并且任选地具有过渡材料的锂化锰氧化物制成的电池的阴极端子的材料及其合成方法。 该材料在高电流密度（电流密度为1470mA / g以上）下表现出改进的导电性和循环性能，并且由于其在高电流密度和相对大的容量下具有良好的循环性能，可用于混合动力车辆和其他电子设备。

公开(公告)号：US07589408B2

公开(公告)日：2009-09-15

申请号：US11636993

申请日：2006-12-12

申请人： Gwo-Liang Weng ,  Yung-Li Lu ,  Cheng-Yin Lee

发明人： Gwo-Liang Weng ,  Yung-Li Lu ,  Cheng-Yin Lee

IPC分类号： H01L23/02

CPC分类号： H01L25/162 ,  H01L23/3135 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable semiconductor package includes first and second substrates, a semiconductor device, first wires, a supporting element, and a first molding compound. The semiconductor device is disposed on the first substrate. The second substrate is disposed above the semiconductor device, and the area of the second substrate is larger than that of the semiconductor device. The first wires electrically connect the first and second substrates. The supporting element is disposed between the first and second substrates, and supports the second substrate. Some pads of the second substrate are exposed outside the first molding compound. Therefore, the overhang portion of the second substrate will not shake or sway during wire bonding, and the area of the second substrate can be increased to have more devices thereon. Also, the thickness of the second substrate can be reduced, to reduce the overall thickness of the stackable semiconductor package.

摘要翻译： 可堆叠半导体封装包括第一和第二衬底，半导体器件，第一电线，支撑元件和第一模塑料。 半导体器件设置在第一衬底上。 第二基板设置在半导体器件的上方，第二基板的面积大于半导体器件的面积。 第一导线电连接第一和第二基板。 支撑元件设置在第一和第二基板之间，并且支撑第二基板。 第二基板的一些焊盘暴露在第一模塑料的外部。 因此，在引线接合期间，第二基板的突出部分不会摇动或摆动，并且可以增加第二基板的面积以在其上具有更多的装置。 此外，可以减小第二基板的厚度，以减小可堆叠半导体封装的整体厚度。

公开(公告)号：US20080225840A1

公开(公告)日：2008-09-18

申请号：US11724203

申请日：2007-03-15

申请人： Bor-Wen Yang ,  Tan-Chun Lu ,  Li-lu Chen

发明人： Bor-Wen Yang ,  Tan-Chun Lu ,  Li-lu Chen

IPC分类号： H04L12/28

CPC分类号： H04L65/1036

摘要： A Voice over Internet Protocol (VOIP) system cooperates with a phone and an access point storing default connecting information. The VOIP system includes a transmitting module, a receiving module, a decoding module and a comparing module. The transmitting module is disposed in the phone and transmits numeral information. The receiving module is disposed in the access point and receives the numeral information. The decoding module is disposed in the access point and is electrically connected with the receiving module for converting the numeral information into character information. The comparing module is disposed in the access point and is electrically connected with the decoding module for comparing the character information and the default connecting information so as to determine whether the access point proceeds to connect with the phone or not.

摘要翻译： 互联网语音协议（VOIP）系统与电话和存储默认连接信息的接入点配合。 VOIP系统包括发送模块，接收模块，解码模块和比较模块。 发送模块设置在电话中并发送数字信息。 接收模块设置在接入点并接收数字信息。 解码模块设置在接入点中，并与接收模块电连接，用于将数字信息转换为字符信息。 比较模块设置在接入点中，并且与解码模块电连接，用于比较字符信息和默认连接信息，以便确定接入点是否继续与电话连接。

公开(公告)号：US20070222041A1

公开(公告)日：2007-09-27

申请号：US11642682

申请日：2006-12-21

申请人： Gwo-Liang Weng ,  Yung-Li Lu

发明人： Gwo-Liang Weng ,  Yung-Li Lu

IPC分类号： H01L23/495

CPC分类号： H01L27/14618 ,  H01L21/568 ,  H01L23/3157 ,  H01L24/48 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package including a package substrate, a chip, several bonding wires, a flash-resisting ring and a molding compound. The package substrate includes a carrying surface and several contacts disposed on the carrying surface. The chip is disposed on the carrying surface. A surface of the chip away from the package substrate includes an active region and several bonding pads. The bonding pads are located outside the active region. The bonding wires connect the bonding pads and the contacts. The flash-resisting ring disposed on the chip is located between the bonding pads and the active region. The flash-resisting ring surrounding the active region includes at least one buffer groove. The buffer groove surrounds the active region. The molding compound disposed on the package substrate and the chip encapsulates at least the bonding pads, the contacts and the bonding wires. The molding compound exposes the active region.

摘要翻译： 一种芯片封装，其包括封装基板，芯片，若干接合线，耐闪光环和模塑料。 封装基板包括承载表面和设置在承载表面上的若干触点。 芯片设置在承载表面上。 远离封装衬底的芯片的表面包括有源区和多个焊盘。 接合焊盘位于有源区域之外。 接合线连接接合焊盘和触点。 布置在芯片上的防闪烁环位于接合焊盘和有源区域之间。 围绕有源区的闪光环包括至少一个缓冲槽。 缓冲槽围绕有源区域。 配置在封装基板和芯片上的模塑料至少封装了焊盘，触点和接合线。 模塑料暴露活性区域。

公开(公告)号：US06652797B1

公开(公告)日：2003-11-25

申请号：US09700012

申请日：2001-05-30

申请人： Ying Kit Chew ,  Yoke San Wong ,  Ying His Jerry Fuh ,  Han Tong Loh ,  Yeh Ching Andrew Nee ,  Yoo Sang Choo ,  Li Lu ,  Kah Bin Lim ,  Chee Leong Teo ,  En Tang Kang ,  Tetsuo Miyazawa

发明人： Ying Kit Chew ,  Yoke San Wong ,  Ying His Jerry Fuh ,  Han Tong Loh ,  Yeh Ching Andrew Nee ,  Yoo Sang Choo ,  Li Lu ,  Kah Bin Lim ,  Chee Leong Teo ,  En Tang Kang ,  Tetsuo Miyazawa

IPC分类号： B29C3508

CPC分类号： B29C64/135 ,  B33Y40/00 ,  B33Y50/00

摘要： A method for determining the areas of resin to be cured in an optical stereolithography process for rapid prototyping using sequential laser curing of layers of a resin having a selected thickness to produce a desired shape of cured resin. The method includes the steps of generating a computer model of desired shape and dividing the model into layers of thickness equal to the thickness of the layers each defining an area of resin to be cured. A set of layers including and sequentially adjacent an intermediate layer is selected and the areas in the intermediate layer of resin which would be oversized by laser curing of layers later in the curing sequence is determined. The 2-D layer data used to build a 3-D model is modified to compensate for the oversizing and the steps repeated by sequentially selecting sets of layers to include substantially all of the layers as the intermediate layer. The sets are sequentially selected with each subsequent set having the intermediate layer being the layer adjacent the intermediate layer of the previously selected set. The first selected set includes the first layer to be cured and the sequential subsequent sets respectively include as the intermediate layer the subsequently cured adjacent layer.

摘要翻译： 一种用于通过使用具有所选厚度的树脂的层的顺序激光固化来快速成型的光学立体光刻工艺中的待固化树脂的面积以产生所需形状的固化树脂的方法。 该方法包括以下步骤：产生所需形状的计算机模型，并将模型划分成等于每个限定要固化的树脂区域的层的厚度的厚度的层。 选择包括中间层并且顺序地邻近中间层的一组层，并且确定在固化顺序中稍后通过激光固化的层中的树脂中间层中的区域。 用于构建3-D模型的2-D层数据被修改，以通过依次选择层数来包括基本上所有的层作为中间层来补偿过大和重复的步骤。 顺序地选择这些组，每个随后的集合具有中间层，其是与先前选择的集合的中间层相邻的层。 第一选定组包括待固化的第一层，并且顺序后续组分别包括随后固化的相邻层作为中间层。

公开(公告)号：USD390452S

公开(公告)日：1998-02-10

申请号：US63272

申请日：1996-12-03

申请人： Chiang-Li Lu

设计人： Chiang-Li Lu

公开(公告)号：US5715531A

公开(公告)日：1998-02-03

申请号：US560901

申请日：1995-11-20

申请人： Hai-Shen Liu ,  Tzu-Li Lu ,  Ren-Yuh Liang

发明人： Hai-Shen Liu ,  Tzu-Li Lu ,  Ren-Yuh Liang

IPC分类号： H03H7/01 ,  H04B1/18 ,  H04B1/10

CPC分类号： H03H7/175 ,  H03H7/0115 ,  H03H7/1758 ,  H03H7/1775 ,  H04B1/18

摘要： A synchronous tracking filter circuit for use in a broadcast satellite tuner that comprises four varactors and a strip-shaped inductor plate or pcb-printed strip line which produces a resonant frequency. The circuit is used in a doubly tuned resonant circuit to incorporate the tracking with the frequency changes of a voltage controlled oscillator (VCO) synchronously. The circuit can also control the image interference. This type of design is applicable in the tuner of an indoor broadcast satellite receiver unit to act as the synchronous tracking filter of input frequencies.

摘要翻译： 一种在广播卫星调谐器中使用的同步跟踪滤波器电路，其包括四个变容二极管和产生谐振频率的带状电感器板或PCB印刷带状线。 该电路用于双调谐谐振电路中，同步地将跟踪与压控振荡器（VCO）的频率变化相结合。 该电路还可以控制图像干扰。 这种类型的设计适用于室内广播卫星接收机单元的调谐器，用作输入频率的同步跟踪滤波器。