公开(公告)号：US5607744A

公开(公告)日：1997-03-04

申请号：US272658

申请日：1994-07-11

Applicant: Carl E. Diener ,  Ashit A. Mehta ,  Ralph S. Paonessa ,  Eugene R. Skarvinko ,  David W. Wang

Inventor： Carl E. Diener ,  Ashit A. Mehta ,  Ralph S. Paonessa ,  Eugene R. Skarvinko ,  David W. Wang

IPC: C01B33/18 ,  B32B15/08 ,  C08K3/34 ,  C08K9/00 ,  C08K9/06 ,  C08L27/12 ,  C08L87/00 ,  C09C1/30 ,  C09C3/12 ,  C09D127/12 ,  H05K1/03 ,  B32B3/10 ,  B32B27/30

CPC classification number: H05K1/0373 ,  C08K9/06 ,  C09C1/3081 ,  C09C3/12 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/80 ,  C01P2006/40 ,  C01P2006/80 ,  C01P2006/90 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.

Abstract translation: 提供了涂有氟硅烷涂层的填料，以及含有涂层填料的组合物。 组合物特别适用于印刷电路板和卡片的基材。

公开(公告)号：US5591285A

公开(公告)日：1997-01-07

申请号：US475670

申请日：1995-07-24

Applicant: Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

Inventor： Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

IPC: C08J7/00 ,  C08K3/04 ,  C08K9/02 ,  H01B3/30 ,  H01L21/312 ,  H05K1/03 ,  H05K3/10 ,  B32B31/28 ,  B32B27/16

CPC classification number: H05K1/0373 ,  C08K3/04 ,  C08K9/02 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0239 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/105 ,  Y10T428/31544

Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

Abstract translation: 公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构，氟化碳的存在量足以降低组合物的介电常数，该结构还包括电导体图案。 可以通过用UV准分子激光器照射该复合材料来导电。

公开(公告)号：US5397863A

公开(公告)日：1995-03-14

申请号：US929313

申请日：1992-08-13

Applicant: Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

Inventor： Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

IPC: C08J7/00 ,  C08K3/04 ,  C08K9/02 ,  H01B3/30 ,  H01L21/312 ,  H05K1/03 ,  H05K3/10

CPC classification number: H05K1/0373 ,  C08K3/04 ,  C08K9/02 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0239 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/105 ,  Y10T428/31544

Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

Abstract translation: 公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构，氟化碳的存在量足以降低组合物的介电常数，该结构还包括电导体图案。 可以通过用UV准分子激光器照射该复合材料来导电。

公开(公告)号：US5319244A

公开(公告)日：1994-06-07

申请号：US806410

申请日：1991-12-13

Applicant: Konstantinos I. Papathomas ,  David W. Wang ,  William J. Summa ,  Ashit A. Mehta

Inventor： Konstantinos I. Papathomas ,  David W. Wang ,  William J. Summa ,  Ashit A. Mehta

IPC: H01L23/12 ,  B32B7/12 ,  C09D179/04 ,  H01B3/30 ,  H01L23/14 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

CPC classification number: H01B3/303 ,  B32B7/12 ,  C09D179/04 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

Abstract translation: 公开了有机载体上的薄膜三嗪粘合剂，其制备方法和结合它们的微电子电路封装。 电路封装具有由有机，电介质，聚合物片构成的衬底。 至少一对聚合物片彼此面对并通过三嗪聚合物粘合在一起。

公开(公告)号：US5250347A

公开(公告)日：1993-10-05

申请号：US848772

申请日：1992-03-10

Applicant: Ashit A. Mehta ,  Tyan M. Niu ,  Lee P. Springer ,  William J. Summa ,  Lee P. Wilding

Inventor： Ashit A. Mehta ,  Tyan M. Niu ,  Lee P. Springer ,  William J. Summa ,  Lee P. Wilding

IPC: C08L27/12 ,  C08L79/04 ,  H01L21/48 ,  H01L23/14 ,  H05K1/03 ,  B32B3/00

CPC classification number: H01L21/4803 ,  H01L23/145 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0212 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31504

Abstract: Disclosed are filled poly(triazine) resin dielectrics and microelectronic circuit packages incorporating them. In the filled poly (triazine) dielectric composites, dispersed thermoplastic polymeric fillers are used to reduce the brittleness and increase the ductility of the triazine polymer, while preserving the low dielectric constant of the triazine host matrix-based composite.

公开(公告)号：US5206074A

公开(公告)日：1993-04-27

申请号：US657795

申请日：1991-02-20

Applicant: Charles R. Davis ,  Ashit A. Mehta ,  Konstantinos Papathomas ,  Lee P. Springer ,  William J. Summa ,  David W. Wang

Inventor： Charles R. Davis ,  Ashit A. Mehta ,  Konstantinos Papathomas ,  Lee P. Springer ,  William J. Summa ,  David W. Wang

IPC: C07D303/12 ,  C09J4/00 ,  H05K1/03

CPC classification number: C08G59/4014 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/34 ,  B32B7/12 ,  C08L63/00 ,  C08L79/08 ,  H05K1/034 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.

Abstract translation: 公开了二缩水甘油基双酚对二烷基苯和二氰基二苯基六氟异丙烷的聚合物。 还公开了分散在二缩水甘油基双酚对二烷基苯和二氰基二苯基六氟异丙苯的有机聚合物粘合反应产物中的有机聚合物膜作为聚酰亚胺膜的有机聚合物电介质复合材料。 还公开了一种电子电路封装，其适于接收至少一个微电子电路芯片，其中至少一层具有有机聚合物膜的有机聚合物电介质复合材料的基底和二缩水甘油基双酚对苯二甲酸的有机聚合物粘合反应产物， 二苯基苯和二氰基二苯基六氟异丙苯。

公开(公告)号：US5571852A

公开(公告)日：1996-11-05

申请号：US472120

申请日：1995-06-07

Applicant: Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

Inventor： Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

IPC: C08J7/00 ,  C08K3/04 ,  C08K9/02 ,  H01B3/30 ,  H01L21/312 ,  H05K1/03 ,  H05K3/10 ,  C08J3/28

CPC classification number: H05K1/0373 ,  C08K3/04 ,  C08K9/02 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0239 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/105 ,  Y10T428/31544

Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

公开(公告)号：US5153986A

公开(公告)日：1992-10-13

申请号：US731598

申请日：1991-07-17

Applicant: John M. Brauer ,  Frederick R. Christie ,  William H. Lawrence ,  Ashit A. Mehta ,  Jonathan D. Reid ,  William J. Summa

Inventor： John M. Brauer ,  Frederick R. Christie ,  William H. Lawrence ,  Ashit A. Mehta ,  Jonathan D. Reid ,  William J. Summa

IPC: C08G61/02 ,  C23C14/12 ,  H01L23/14 ,  H05K1/05 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44

CPC classification number: H05K3/445 ,  H01L23/142 ,  H05K1/056 ,  H01L2924/0002 ,  H05K2201/0179 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2203/135 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4076 ,  H05K3/426 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed is a method of fabricating a multilayer electronic circuit package. The multilayer circuit package has at least one layer that is a circuitized, polymer encapsulated metal core. According to the method of the invention a metal foil is provided for the metal core of the layer. This metal core foil may be provided as a single unit or in a continuous, roll to roll, process. The vias and through holes are drilled, etched, or punched through the metal foil. An adhesion promoter is then applied to the perforate metal foil for subsequent adhesion of polymer to the foil. The dielectric polymer is then applied to the perforate metal foil core by vapor depositing, chemical vapor depositing, spraying or electrophoretically depositing, a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the through holes and vias. The dielectric polymer or precursor thereof is then thermally processed to form a conformal dielectric, polymeric coating on surfaces of the perforate metal foil, including the interior surfaces of the vias and through holes. This dielectric, polymeric coating may then be circuitized, and coated with an adhesive for lamination to the next adjacent layer. After lamination, one or more chips are attached to the completed package.

公开(公告)号：US5614250A

公开(公告)日：1997-03-25

申请号：US468143

申请日：1995-06-06

Applicant: Carl E. Diener ,  Ashit A. Mehta ,  Ralph S. Paonessa ,  Eugene R. Skarvinko ,  David W. Wang

Inventor： Carl E. Diener ,  Ashit A. Mehta ,  Ralph S. Paonessa ,  Eugene R. Skarvinko ,  David W. Wang

IPC: C01B33/18 ,  B32B15/08 ,  C08K3/34 ,  C08K9/00 ,  C08K9/06 ,  C08L27/12 ,  C08L87/00 ,  C09C1/30 ,  C09C3/12 ,  C09D127/12 ,  H05K1/03 ,  B05D3/02 ,  B05D5/12

CPC classification number: H05K1/0373 ,  C08K9/06 ,  C09C1/3081 ,  C09C3/12 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/80 ,  C01P2006/40 ,  C01P2006/80 ,  C01P2006/90 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.

公开(公告)号：US5556899A

公开(公告)日：1996-09-17

申请号：US346766

申请日：1994-11-30

Applicant: Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

Inventor： Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

IPC: C08J7/00 ,  C08K3/04 ,  C08K9/02 ,  H01B3/30 ,  H01L21/312 ,  H05K1/03 ,  H05K3/10 ,  C08J5/18

CPC classification number: H05K1/0373 ,  C08K3/04 ,  C08K9/02 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0239 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/105 ,  Y10T428/31544

Abstract: Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.

Abstract translation: 公开了通过基于2-60重量份的分散体形成复合材料来实现聚酰亚胺材料的介电常数和热膨胀系数的变化的方法。 ％的氟化颗粒碳材料和聚酰亚胺或聚酰亚胺前体，并将分散体在65℃-200℃/秒加热至约400℃。