公开(公告)号：US20140001622A1

公开(公告)日：2014-01-02

申请号：US13534001

申请日：2012-06-27

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Wolfgang Schober

IPC分类号： H01L23/48 ,  H01L21/58 ,  H01L23/495

CPC分类号： H01L23/49838 ,  H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/3171 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49805 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/00014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed over and at least partially surrounding the chip; one or more electrically conductive contact regions formed over the electrically insulating material and in electrical connection with the chip; a further electrically insulating material disposed over a chip carrier bottom side; wherein an electrically conductive contact region on the chip carrier bottom side is released from the further electrically insulating material.

摘要翻译： 提供芯片封装，芯片封装包括：芯片载体; 芯片布置在芯片载体顶侧并电连接到芯片载体顶侧; 设置在芯片上并且至少部分地围绕芯片的电绝缘材料; 形成在所述电绝缘材料上并与所述芯片电连接的一个或多个导电接触区域; 设置在芯片载体底侧上的另外的电绝缘材料; 其中芯片载体底侧上的导电接触区域从另外的电绝缘材料释放。

公开(公告)号：US08017438B2

公开(公告)日：2011-09-13

申请号：US11612758

申请日：2006-12-19

申请人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

发明人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC分类号： H01L21/00

CPC分类号： H01L23/5385 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

摘要翻译： 半导体模块包括：模块封装，包括具有第一半导体器件的第一衬底和具有第二半导体器件的第二衬底。 第一外导体从模块封装延伸并连接到第一基板，第二外导体从模块封装延伸并连接到第二基板。 制造半导体模块的方法包括将引线框架的第一外导体附接到第一基板，其中第一基板包括在附接第一外导体之前或之后附接到第一基板的第一半导体器件。 提供了包括信号处理电路的第二基板，并且第二基板紧固到引线框架的第二外导体。

公开(公告)号：US08013441B2

公开(公告)日：2011-09-06

申请号：US11581678

申请日：2006-10-16

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/48 ,  H01L23/58 ,  H01L23/62 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12043 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device has a vertical current path through a power semiconductor chip. The power semiconductor chip has at least one large-area electrode on its top side and a large-area electrode on its rear side. The rear side electrode is surface-mounted on a lead frame chip island of a lead frame and the top side electrode is electrically connected to an internal lead of the lead frame via a connecting element. The connecting element has an electrically conductive film on a surface facing the top side electrode, the electrically conductive film extending from the top side electrode to the internal lead.

摘要翻译： 本发明的一个方面涉及引线框技术中的功率半导体器件及其制造方法。 功率半导体器件具有穿过功率半导体芯片的垂直电流路径。 功率半导体芯片在其顶侧具有至少一个大面积电极，在其后侧具有大面积电极。 背面电极被表面安装在引线框架的引线框架芯片岛上，并且顶侧电极经由连接元件电连接到引线框架的内部引线。 连接元件在面向顶侧电极的表面上具有导电膜，导电膜从顶侧电极延伸到内部引线。

公开(公告)号：US20100207277A1

公开(公告)日：2010-08-19

申请号：US10598143

申请日：2005-02-09

申请人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L23/538 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.

摘要翻译： 公开了一种包括半导体芯片的堆叠的半导体部件，半导体芯片一体地固定在另一个之上。 半导体芯片的接触区域被引导直到半导体芯片和导体部分的边缘至少从半导体芯片的边缘侧的上边缘延伸到下边缘，以便电连接半导体芯片的接触区域 堆叠的半导体芯片彼此。

公开(公告)号：US07768107B2

公开(公告)日：2010-08-03

申请号：US11598203

申请日：2006-11-13

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/02

CPC分类号： H01L23/4334 ,  H01L23/42 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes at least one semiconductor chip arranged on a mounting substrate and connected thereto via bonding wires. For effective dissipation of heat, a solderable interlayer is arranged on the active upper side of the semiconductor chip and a heat sink is soldered onto the solderable interlayer. A method is also described for producing a semiconductor component with a solderable interlayer disposed on an active upper side of a semiconductor chip and with a heat sink soldered to the solderable interlayer.

摘要翻译： 半导体部件包括布置在安装基板上并通过接合线与其连接的至少一个半导体芯片。 为了有效散热，在半导体芯片的有源上侧设置可焊接中间层，将散热器焊接到可焊接中间层上。 还描述了一种用于制造具有可焊接中间层的半导体部件的方法，其设置在半导体芯片的有源上侧上并且将散热器焊接到可焊接中间层。

公开(公告)号：US20090039484A1

公开(公告)日：2009-02-12

申请号：US11834262

申请日：2007-08-06

申请人： Joachim Mahler ,  Alfred Haimerl ,  Angela Kessler ,  Michael Bauer ,  Wolfgang Schober

发明人： Joachim Mahler ,  Alfred Haimerl ,  Angela Kessler ,  Michael Bauer ,  Wolfgang Schober

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/50 ,  H01L24/83 ,  H01L24/84 ,  H01L24/86 ,  H01L2224/06181 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/37647 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/48 ,  H01L2924/00012

摘要： A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.

摘要翻译： 半导体芯片在其顶侧具有至少一个第一接触和一个第二触点，并具有连接在结构元件上的连接元件，并且将半导体芯片的顶侧的第一触点和第二触点连接到外部 联系人

公开(公告)号：US20080303172A1

公开(公告)日：2008-12-11

申请号：US11760949

申请日：2007-06-11

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/83141 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/0401

摘要： Apparatus for packaging two chips includes, in some embodiments, a first chip having at least one elevation and at least one cutout on a bottom thereof. It also includes a second chip having at least one elevation and at least one cutout on a top thereof. In some embodiments disclosed, the elevations and cutouts of the first chip and the second chip are configured to allow the elevations to be intermeshed with the cutouts when the chips are stacked with the bottom of the first chip engaging the top of the second chip.

摘要翻译： 在一些实施例中，用于包装两个芯片的装置包括具有至少一个高度的第一芯片和其底部上的至少一个切口。 它还包括在其顶部具有至少一个仰角和至少一个切口的第二芯片。 在公开的一些实施例中，第一芯片和第二芯片的高度和切口被配置为当芯片堆叠时第一芯片的底部与第二芯片的顶部接合时允许高度与切口相互啮合。

公开(公告)号：US07462940B2

公开(公告)日：2008-12-09

申请号：US11620784

申请日：2007-01-08

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/50 ,  H01L23/48 ,  H01L23/498 ,  H01L21/00

CPC分类号： H01L23/3192 ,  H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one dielectric insulation layer made of a low-k material with a relative permittivity εr lower than the relative permittivity of a silicon dioxide. The flip-chip contacts are arranged on contact areas of an upper metallization layer and have a polymer core surrounded by a lead-free solder sheath.

摘要翻译： 半导体元件包括布置在半导体芯片的布线结构上的倒装芯片触点。 所述布线结构包括至少一个金属化层和至少一个介电绝缘层，所述介电绝缘层由相对介电常数ε低于二氧化硅的相对介电常数ε的低k材料制成。 倒装芯片触点布置在上金属化层的接触区域上，并且具有由无铅焊接护套包围的聚合物芯。

公开(公告)号：US20080122075A1

公开(公告)日：2008-05-29

申请号：US11612758

申请日：2006-12-19

申请人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

发明人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC分类号： H01L21/00 ,  H01L23/34

CPC分类号： H01L23/5385 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors, A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

摘要翻译： 半导体模块包括：模块封装，包括具有第一半导体器件的第一衬底和具有第二半导体器件的第二衬底。 第一外导体从模块封装延伸并连接到第一基板，第二外导体从模块封装延伸并连接到第二基板。 一种半导体模块的制造方法，其特征在于，将引线框架的第一外导体附接到第一基板，第一基板包括在安装第一外导体之前或之后附接到第一基板的第一半导体装置，第二基板 提供包括信号处理电路，并且第二基板紧固到引线框架的第二外导体。

公开(公告)号：US20070205518A1

公开(公告)日：2007-09-06

申请号：US11692322

申请日：2007-03-28

申请人： Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/52

CPC分类号： H01L23/3142 ,  B82Y10/00 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S977/742 ,  Y10S977/785 ,  Y10S977/831 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.

摘要翻译： 一层改善了半导体器件中不同部件的界面之间的粘附。 第一部件的界面包括电路载体的表面，第二部件的界面包括塑料封装模塑料的接触表面。 粘附改善层包括聚合链分子和碳纳米管的混合物。