Invention Grant
- Patent Title: Semiconductor module with at least two substrates
- Patent Title (中): 具有至少两个基板的半导体模块
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Application No.: US11612758Application Date: 2006-12-19
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Publication No.: US08017438B2Publication Date: 2011-09-13
- Inventor: Michael Bauer , Angela Kessler , Wolfgang Schober , Alfred Haimerl , Joachim Mahler
- Applicant: Michael Bauer , Angela Kessler , Wolfgang Schober , Alfred Haimerl , Joachim Mahler
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102006056363 20061129
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.
Public/Granted literature
- US20080122075A1 SEMICONDUCTOR MODULE WITH AT LEAST TWO SUBSTRATES Public/Granted day:2008-05-29
Information query
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