Abstract:
A diode for use in an under-the-hood automotive application has a TO 220 outline and consists of a diode die on a two piece lead frame which has a thick section to which the bottom of the die is soldered, and a thinner section which extends through a plastic housing as a connection tab and which has a forked end for easy connection to a node of a three phase bridge. The bottom of the thickened section is exposed through the insulation housing for easy connection to a d-c heat sink rail. The diode is particularly useful in applications greater than 2 KW.
Abstract:
An angular position sensor assembly for a vehicle generator shaft includes one magnet and three magnetic field sensors placed within a housing. The sensors are disposed on a circuit board that is parallel to the end of a generator shaft. The sensors are configured so that signals from the sensors are out-of-phase by predetermined angles. The generator shaft alternatingly forms plural slots and plural teeth. As the shaft rotates, the slots and teeth cause a change in a magnetic field around each sensor. By sensing the changes in the magnetic field, the position of the shaft can be determined from the out of phase signals received from the sensors.
Abstract:
One exemplary disclosed embodiment comprises a two-terminal stacked-die package including a diode, such as a silicon diode, stacked atop a III-nitride transistor, such that a cathode of the diode resides on and is electrically coupled to a source of the III-nitride transistor. A first terminal of the package is coupled to a drain of the III-nitride transistor, and a second terminal of the package is coupled to an anode of the diode. In this manner, devices such as cascoded rectifiers may be packaged in a stacked-die form, resulting in reduced parasitic inductance and resistance, improved thermal dissipation, smaller form factor, and lower manufacturing cost compared to conventional packages.
Abstract:
Pesticidal compounds of general formula (I) Wherein represents a double bond; A— represents ═C(R5)—C(═O)—, wherein R represents hydrogen or halogen, R1 and R2 represent, independently, hydrogen, halogen, alkoxy, substituted alkoxy or an ester group; or R1 and R2, together with the carbon atoms to which they are attached, represent an oxirane ring; or R1 and R2, taken together, represent an alkylidenedioxy or substituted alkylidenedioxy group; and R3 represents —CH2R6, wherein R6 represents an ester group, oxiranyl, or a group of formula wherein R7 represents hydrogen or alkyl, R8 represents phenylsulfanyl, phenylselenyl, phenylsulfoxy or phenylselenoxy, and R9 represents hydrogen, ethoxycarbonyl or carbamoyl and R4 represents, independently, hydrogen, alkoxy or substituted alkoxy; and methods of making the compounds of formula (I) and methods for controlling pests wherein the pest dies as a result of contact with a compound of formula (I).
Abstract:
Galvanomagnetic sensor array system and method for providing data interface to a basic sensor array are provided. The sensor system includes an array of galvanomagnetic elements, and a processor coupled to receive each output signal from the array of galvanomagnetic elements. The processor and array of galvanomagnetic elements are integrated in a single semiconductor die.
Abstract:
A diode for use in an under-the-hood automotive application has a TO 220 outline and consists of a diode die on a two piece lead frame which has a thick section to which the bottom of the die is soldered, and a thinner section which extends through a plastic housing as a connection tab and which has a forked end for easy connection to a node of a three phase bridge. The bottom of the thickened section is exposed through the insulation housing for easy connection to a d-c heat sink rail. The diode is particularly useful in applications greater than 2 KW.
Abstract:
One exemplary disclosed embodiment comprises a three-terminal stacked-die package including a field effect transistor (FET), such as a silicon FET, stacked atop a III-nitride transistor, such that a drain of the FET resides on and is electrically coupled to a source of the III-nitride transistor. A first terminal of the package is coupled to a gate of the FET, a second terminal of the package is coupled to a drain of the III-nitride transistor. A third terminal of the package is coupled to a source of the FET. In this manner, devices such as cascoded switches may be packaged in a stacked-die form, resulting in reduced parasitic inductance and resistance, improved thermal dissipation, smaller form factor, and lower manufacturing cost compared to conventional packages.
Abstract:
A sensor apparatus and method that can measure either a linear position or an angular position of a device. A linear array of galvanomagnetic sensing elements is fixedly mountable adjacent the device. A target is connectable to the device such that the target moves adjacent a surface of the linear array in response to movement of the device and is shaped so that a magnetic flux density curve resulting from excitation of the sensing elements includes a peak and/or a valley. A first circuit excites each of the sensing elements, and a second circuit measures a magnetic flux density value at each of the sensing elements. A maximum and/or a minimum of the flux density curve indicates the position of the device.
Abstract:
A very high power semiconductor device package has a heavy flat conductive terminal which carries a semiconductor die. A thin conductive tab is disposed to be continuous with but insulated from the terminal and lies in a plane above the heavy flat terminal. A top electrode of the die is connected to the tab and an insulation housing encloses portions of the adjacent ends of the tab and terminal as well as the die and its connector leads. The free end of the tab may have printed circuit connection fingers. Two notches are cut into the sides of the thin tab at a location closely spaced from the surface of the housing through which the tab extends to provide stress relief for the insulation housing through which the tab extends.