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1.发明申请SEMICONDUCTOR BONDING STRUCTURE BODY AND MANUFACTURING METHOD OF SEMICONDUCTOR BONDING STRUCTURE BODY 有权半导体结合体结构体的半导体结合体和半导体结合体的制造方法公开(公告)号：US20130241069A1
公开(公告)日：2013-09-19
申请号：US13823463
申请日：2011-10-17
IPC分类号： H01L23/00
CPC分类号： H01L24/30 , B22F2999/00 , B23K1/0016 , B23K35/0238 , B23K35/26 , B23K35/262 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K2101/40 , B32B15/018 , C22C1/0483 , C22C5/02 , C22C5/06 , C22C9/00 , C22C9/02 , C22C13/00 , H01L21/563 , H01L23/4827 , H01L23/562 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04026 , H01L2224/05147 , H01L2224/05639 , H01L2224/05647 , H01L2224/2733 , H01L2224/29 , H01L2224/29111 , H01L2224/29113 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/83065 , H01L2224/83439 , H01L2224/83444 , H01L2224/8381 , H01L2224/83815 , H01L2924/00015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/351 , H01L2924/3512 , H01L2924/00014 , B22F1/0003 , H01L2924/0105 , H01L2924/00 , H01L2924/00012 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01028 , H01L2224/45099
摘要： A bonding structure body in which a semiconductor element and an electrode are bonded via a solder material, wherein a part that allows bonding has a first intermetallic compound layer that has been formed on the electrode side, a second intermetallic compound layer that has been formed on the semiconductor element side, and a third layer that is constituted by a phase containing Sn and a sticks-like intermetallic compound part, which is sandwiched between the two layers of the first intermetallic compound layer and the second intermetallic compound layer, and the sticks-like intermetallic compound part is interlayer-bonded to both of the first intermetallic compound layer and the second intermetallic compound layer.
摘要翻译： 一种接合结构体，其中半导体元件和电极通过焊料材料接合，其中允许接合的部分具有形成在电极侧的第一金属间化合物层，形成在第二金属间化合物层上的第二金属间化合物层 半导体元件侧和由夹在第一金属间化合物层和第二金属间化合物层的两层之间的含有Sn和棒状金属间化合物部分的相位构成的第三层， 类似金属间化合物部分被层间接合到第一金属间化合物层和第二金属间化合物层上。
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公开(公告)号：US08421246B2
公开(公告)日：2013-04-16
申请号：US12864826
申请日：2009-05-22
IPC分类号： H01L29/43
CPC分类号： B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/264 , B23K2101/40 , C22C12/00 , C22C19/03 , H01L23/488 , H01L23/49503 , H01L23/49513 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48699 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00012
摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.
摘要翻译： 接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。 接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及 设置在镍层和焊料层之间的阻挡层。 这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。
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公开(公告)号：US20100148367A1
公开(公告)日：2010-06-17
申请号：US12711628
申请日：2010-02-24
IPC分类号： H01L23/488 , H01L21/603
CPC分类号： C22C1/002 , H01L23/49513 , H01L23/49562 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/04026 , H01L2224/05554 , H01L2224/0558 , H01L2224/05639 , H01L2224/29101 , H01L2224/29111 , H01L2224/29113 , H01L2224/32057 , H01L2224/32245 , H01L2224/45124 , H01L2224/48247 , H01L2224/48739 , H01L2224/73265 , H01L2224/743 , H01L2224/83101 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/85439 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/01022 , H01L2924/00012
摘要： A semiconductor device includes a die pad having a surface on which a first solder bonding layer is formed, and made of metal; and a semiconductor element fixed on the first solder bonding layer on the die pad by a solder material made mostly of bismuth. The first solder bonding layer is made of a softer material than the solder material, a recess is formed in a part of the first solder bonding layer by pressing the solder material against the first solder bonding layer, and the solder material partially fills the recess.
摘要翻译： 半导体器件包括具有表面的芯片焊盘，其上形成有第一焊料接合层，并由金属制成; 以及半导体元件，其通过主要由铋制成的焊料固定在芯片焊盘上的第一焊料接合层上。 第一焊料接合层由比焊料材料更软的材料制成，通过将焊料材料压靠在第一焊料接合层上而在第一焊料接合层的一部分中形成凹部，并且焊料材料部分地填充凹部。
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4.发明授权Solder, electronic component mounted by soldering, and electronic circuit board 失效焊接，通过焊接安装的电子部件和电子电路板
公开(公告)号：US5962133A
公开(公告)日：1999-10-05
申请号：US981565
申请日：1997-12-19
CPC分类号： H05K3/244 , B23K35/0227 , B23K35/0244 , B23K35/26 , H01L23/49582 , H05K3/3463 , H05K3/3484 , B23K35/025 , H01L2924/0002 , H05K2201/0218 , H05K2201/10636 , H05K2203/0425 , H05K3/3421 , Y02P70/611 , Y10T428/24917 , Y10T428/2938 , Y10T428/294 , Y10T428/2951 , Y10T428/2991
摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
摘要翻译： PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。 出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。 提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。 焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。
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5.发明申请公开(公告)号：US20110108996A1
公开(公告)日：2011-05-12
申请号：US13003024
申请日：2010-06-17
CPC分类号： C22C12/00 , B23K1/0016 , B23K1/20 , B23K35/264 , B23K35/362 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29144 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83439 , H01L2224/838 , H01L2224/83805 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/01014 , H01L2924/00012 , H01L2924/01007 , H01L2924/01031 , H01L2924/01049 , H01L2924/01016 , H01L2924/01083 , H01L2924/01034 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a semiconductor component having a joint structure including a semiconductor device, an electrode disposed opposite the semiconductor device, and a joining material which contains Bi as main component and connects the semiconductor device to the electrode. Since the joining material contains a carbon compound, joint failure due to the difference in linear expansion coefficient between the semiconductor device and the electrode can be reduced compared with conventional materials. The joining material which contains Bi as main component enables provision of a joint structure in which a semiconductor device and an electrode are joined by a joint more reliable than a conventional joint.
摘要翻译： 本发明提供一种具有接合结构的半导体部件，该接合结构包括半导体器件，与半导体器件相对设置的电极，以及包含Bi作为主要部件并将半导体器件连接到电极的接合材料。 由于接合材料含有碳化合物，与常规材料相比，可以减少由于半导体器件和电极之间的线性膨胀系数的差异引起的接合故障。 含有Bi作为主要成分的接合材料能够提供通过比常规接头更可靠的接头将半导体器件和电极接合的接合结构。
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公开(公告)号：US20100301481A1
公开(公告)日：2010-12-02
申请号：US12864826
申请日：2009-05-22
IPC分类号： H01L23/532
CPC分类号： B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/264 , B23K2101/40 , C22C12/00 , C22C19/03 , H01L23/488 , H01L23/49503 , H01L23/49513 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48699 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00012
摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.
摘要翻译： 接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。 接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及 设置在镍层和焊料层之间的阻挡层。 这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。
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公开(公告)号：US07176402B2
公开(公告)日：2007-02-13
申请号：US10969274
申请日：2004-10-21
IPC分类号： B23K10/00
CPC分类号： H05K3/3489 , H05K3/288 , H05K3/3447 , H05K2201/10287 , H05K2203/095
摘要： An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section. The method includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.
摘要翻译： 一种用于剥离具有端子部分的电子部件的树脂涂层的电子部件处理方法。 该方法包括以等离子体照射具有铜作为主要成分的涂覆线和涂覆有树脂的表面的步骤。
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公开(公告)号：US06428745B2
公开(公告)日：2002-08-06
申请号：US09818905
申请日：2001-03-28
IPC分类号： C22C1302
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译： 公开了用于将电子部件焊接到电路板的焊料和焊膏。 该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。 或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。
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公开(公告)号：US06267823B1
公开(公告)日：2001-07-31
申请号：US09125013
申请日：1998-11-12
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译： 公开了用于将电子部件焊接到电路板的焊料和焊膏。 该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。 或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。
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公开(公告)号：US09386699B2
公开(公告)日：2016-07-05
申请号：US13995208
申请日：2011-12-21
申请人： Kiyohiro Hine , Akio Furusawa , Masato Mori
发明人： Kiyohiro Hine , Akio Furusawa , Masato Mori
CPC分类号： H05K1/181 , B23K1/19 , B23K35/0261 , B23K35/24 , B23K35/262 , C22C13/00 , H05K3/3442 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K13/0465 , H05K2201/0989 , H05K2201/099 , H05K2201/10636 , H05K2203/1476 , Y02P70/611 , Y02P70/613
摘要： The present invention has an aspect to provide a mounted structure of which heat-resistant fatigue characteristic is improved. A mounted structure is provided with a substrate having a substrate electrode, an electronic component having a component electrode, and a bonding part bonding the substrate electrode and the component electrode, wherein the bonding part is constituted by a solder reinforcing part and a solder bonding part, the solder reinforcing part is a side vicinity part of the bonding part, and is constituted by In of 3 wt % or more and 8 wt % or less and Sn of 88 wt % or more, and the solder bonding part is constituted by a Sn—Bi system solder material and In of 0 wt % or more and less than 3 wt %.
摘要翻译： 本发明的一个方面是提供一种提高耐热疲劳特性的安装结构。 安装结构设置有具有基板电极的基板，具有部件电极的电子部件和接合基板电极和部件电极的接合部，其中，接合部由焊料增强部和焊接部 焊料加强部是接合部的侧部附近，由3重量％以上且8重量％以下的Sn和88重量％以上的Sn构成，焊接部由 Sn-Bi系焊料和0重量％以上且小于3重量％的In。
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