公开(公告)号：US06589372B1

公开(公告)日：2003-07-08

申请号：US09889806

申请日：2001-07-20

申请人： Konrad Roeingh ,  Werner Greis

发明人： Konrad Roeingh ,  Werner Greis

IPC分类号： C22C1302

CPC分类号： B32B15/01 ,  C22C13/02 ,  F16C33/121 ,  F16C2204/34 ,  F16C2322/12 ,  Y10S148/906 ,  Y10T29/49677 ,  Y10T29/49989

摘要： A plain bearing for necks of rolls of rolling mills includes a bearing bushing of metal and a plain bearing alloy introduced into the bushing. The plain bearing alloy is based on tin with antimony and copper and contains of 6.8 to 7.2 percent by weight antimony, 6.3 to 6.7 percent by weight copper, 0.5 to 0.7 percent by weight zinc, 0.05 to 0.15 percent by weight silver, and tin as the remainder, and wherein the plain bearing alloy is applied to an inner mantle of a pre-heated bearing bushing as a rough layer thickness of 4 to 5 mm by centrifugal casting.

摘要翻译： 用于轧机轧辊颈部的滑动轴承包括金属轴承衬套和引入衬套的滑动轴承合金。 滑动轴承合金基于锡与锑和铜，含有6.8〜7.2重量％的锑，6.3〜6.7重量％的铜，0.5〜0.7重量％的锌，0.05〜0.15重量％的银，锡作为 剩余部分，并且其中滑动轴承合金通过离心铸造被施加到预热轴承衬套的内套，其厚度为4至5mm。

公开(公告)号：US06488888B2

公开(公告)日：2002-12-03

申请号：US09828164

申请日：2001-04-09

申请人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

发明人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

摘要翻译： 具有相对低的熔融温度并适合用于焊接电子器件的无铅焊料合金基本上由以下组成：7至10重量％的Zn; 0.01〜1重量％的Ni，0.1〜3.5重量％的Ag和0.1〜3重量％的Cu中的至少1种; 可选地，0.2至6重量％的Bi，0.5至3重量％的In和0.001至1重量％的P中的至少一个; 和Sn的平衡。 另一种这样的无铅焊料合金主要由以下组成：2至10重量％的Zn; Bi的10〜30重量％ 0.05〜2重量％的Ag; 任选地0.001至1重量％的P，余量为Sn。 这些焊料合金具有至少5kgf / mm 2的拉伸强度和至少10％的伸长率。

公开(公告)号：US06649127B2

公开(公告)日：2003-11-18

申请号：US09813551

申请日：2001-03-21

申请人： Kazutaka Habu ,  Naoko Takeda

发明人： Kazutaka Habu ,  Naoko Takeda

IPC分类号： C22C1302

CPC分类号： B23K35/262 ,  C22C13/00

摘要： New and improved substantially lead-free solder compositions are provided exhibiting excellent wettability and mechanical properties. In an embodiment, an improved solder material is a substantially silver-free material including from about 0.5 to about 10% by weight of Zn, from about 0.5 to about 8% by weight of Bi, from about 0.005 to about 0.5% by weight of Ge, from about 0.3 to about 3% by weight of Cu and the balance to make 100% by weight of Sn. In another embodiment, an improved solder material includes from about 0.5 to 8% by weight of Bi, from about 0.5 to about 3% by weight of Ag, from about 0.01 to about 0.1% by weight of Ge, from about 0.3 to about 1% by weight of Cu, and the balance to make 100% by weight of Sn. In a further embodiment, an improved solder material includes from about 3 to about 15% by weight of Zn, from about 3 to about 10% by weight of In, from about 0.01 to about 0.3% by weight of Ge, from about 0.3 to about 3% by weight of Ag and the balance to make 100% by weight of Sn.

摘要翻译： 提供了新的和改进的基本上无铅的焊料组合物，表现出优异的润湿性和机械性能。 在一个实施方案中，改进的焊料材料是基本上不含银的材料，包括约0.5至约10重量％的Zn，约0.5至约8重量％的Bi，约0.005至约0.5重量％的 Ge，约0.3〜约3重量％的Cu，余量为100重量％的Sn。 在另一个实施方案中，改进的焊料材料包括约0.5至8重量％的Bi，约0.5至约3重量％的Ag，约0.01至约0.1重量％的Ge，约0.3至约1 重量％的Cu，余量为100重量％的Sn。 在另一个实施方案中，改进的焊料材料包括约3至约15重量％的Zn，约3至约10重量％的In，约0.01至约0.3重量％的Ge，约0.3至 约3重量％的Ag，余量为100重量％的Sn。

公开(公告)号：US06555052B2

公开(公告)日：2003-04-29

申请号：US09799486

申请日：2001-03-07

申请人： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Masato Nakamura ,  Yuji Fujita ,  Toshiharu Ishida ,  Masahide Okamoto ,  Koji Serizawa ,  Toshihiro Hachiya ,  Hideki Mukuno

发明人： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Masato Nakamura ,  Yuji Fujita ,  Toshiharu Ishida ,  Masahide Okamoto ,  Koji Serizawa ,  Toshihiro Hachiya ,  Hideki Mukuno

IPC分类号： C22C1302

CPC分类号： H01L24/32 ,  B23K35/262 ,  B23K2101/36 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20106 ,  H05K3/3463 ,  Y10T428/12528 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199

摘要： An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.

公开(公告)号：US06365097B1

公开(公告)日：2002-04-02

申请号：US09492219

申请日：2000-01-27

申请人： Mitsuo Yamashita ,  Shinji Tada ,  Kunio Shiokawa

发明人： Mitsuo Yamashita ,  Shinji Tada ,  Kunio Shiokawa

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A novel lead-free Sn—Bi based alloy having an improved wettability in comparison to conventional Sn—Bi based alloys, a melting point lower than 221° C., the eutectic point of an Sn—Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn—Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.

摘要翻译： 与传统的Sn-Bi基合金相比，具有改进的润湿性，熔点低于221℃，Sn-Ag合金的共晶点以及适当的粘合和耐热性的新型无铅Sn-Bi基合金， 提供了耐受性。 该合金是以锡为主成分，21重量％以下的铋，4重量％以下的银，2重量％以下的铜（包括零）和0.2重量％的Sn-Bi系合金。 ％以下的镍。

公开(公告)号：US06241942B1

公开(公告)日：2001-06-05

申请号：US09050078

申请日：1998-03-30

申请人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

发明人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

摘要翻译： 具有相对低的熔融温度并适合用于焊接电子器件的无铅焊料合金基本上由以下组成：7至10重量％的Zn; 0.01〜1重量％的Ni，0.1〜3.5重量％的Ag和0.1〜3重量％的Cu中的至少1种; 可选地，0.2至6重量％的Bi，0.5至3重量％的In和0.001至1重量％的P中的至少一个; 和Sn的平衡。 另一种这样的无铅焊料合金主要由以下组成：2至10重量％的Zn; Bi的10〜30重量％ 0.05〜2重量％的Ag; 任选地0.001至1重量％的P，余量为Sn。 这些焊料合金具有至少5kgf / mm 2的拉伸强度和至少10％的伸长率。

公开(公告)号：US06521176B2

公开(公告)日：2003-02-18

申请号：US09728120

申请日：2000-12-04

申请人： Masayuki Kitajima ,  Masakazu Takesue ,  Yasuo Moriya ,  Yoshinori Nemoto ,  Yumiko Fukushima

发明人： Masayuki Kitajima ,  Masakazu Takesue ,  Yasuo Moriya ,  Yoshinori Nemoto ,  Yumiko Fukushima

IPC分类号： C22C1302

CPC分类号： B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3616 ,  B23K35/3618 ,  H05K3/3463

摘要： A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

摘要翻译： 含有Sn，Ag和Bi的无铅焊料合金组合物，各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。

公开(公告)号：US06428745B2

公开(公告)日：2002-08-06

申请号：US09818905

申请日：2001-03-28

申请人： Atsushi Yamaguchi ,  Tetsuo Fukushima ,  Kenichiro Suetsugu ,  Akio Furusawa

发明人： Atsushi Yamaguchi ,  Tetsuo Fukushima ,  Kenichiro Suetsugu ,  Akio Furusawa

IPC分类号： C22C1302

CPC分类号： B23K35/262 ,  B23K35/025

摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

摘要翻译： 公开了用于将电子部件焊接到电路板的焊料和焊膏。 该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。 或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

公开(公告)号：US06228322B1

公开(公告)日：2001-05-08

申请号：US09398754

申请日：1999-09-17

申请人： Naoko Takeda ,  Kazutaka Habu ,  Kazushi Yamauchi

发明人： Naoko Takeda ,  Kazutaka Habu ,  Kazushi Yamauchi

IPC分类号： C22C1302

CPC分类号： B23K35/262 ,  C22C13/00

摘要： A lead-free solder composition having superior mechanical strength is produced by adding a rare earth element to a Sn—Ag alloy or a Sn—Ag—Bi—Cu alloy. The rare earth element is Sm, Gd, or a mixture of these elements with other rare earth elements.

摘要翻译： 通过向Sn-Ag合金或Sn-Ag-Bi-Cu合金中添加稀土元素来制造具有优异机械强度的无铅焊料组合物。 稀土元素是Sm，Gd，或这些元素与其它稀土元素的混合物。

公开(公告)号：US06197253B1

公开(公告)日：2001-03-06

申请号：US09217848

申请日：1998-12-21

申请人： Allen Broomfield ,  Everett George Morrissey

发明人： Allen Broomfield ,  Everett George Morrissey

IPC分类号： C22C1302

CPC分类号： C22C13/02 ,  C22C13/00

摘要： An alloy comprising tin, antimony, bismuth and indium and a method for making the same is disclosed. The alloy is used in the hardware, jewelry, statuary, filigree, or other ornament casting art. A preferred embodiment of the alloy comprises 97% by weight tin, 1% by weight antimony, 1% by weight bismuth, and 1% by weight indium.

摘要翻译： 公开了包含锡，锑，铋和铟的合金及其制造方法。 该合金用于五金，珠宝，雕像，花丝或其他装饰品铸造艺术品中。 合金的优选实施方案包括97重量％的锡，1重量％的锑，1重量％的铋和1重量％的铟。