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公开(公告)号：US07681777B2
公开(公告)日：2010-03-23
申请号：US10547539
申请日：2004-03-31
IPC分类号： B23K35/14
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/262 , H05K3/3463 , H05K2201/0272
摘要： In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
摘要翻译： 在通过混合合金粉末和焊剂形成的焊膏中，合金粉末是通过混合至少一种Sn-Zn基合金粉末和至少一种Sn-Ag基合金粉末形成的粉末混合物。 将合金粉末混合，使粉末混合物的组成为Zn的5-10质量％ Ag：0.005〜1.5质量％ 可任意选择Cu：0.002〜1.0质量％，Bi：0.005〜15质量％，In：0.005〜15质量％，Sb：0.005〜1.0质量％ 和Sn的剩余部分。
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公开(公告)号：US06241942B1
公开(公告)日：2001-06-05
申请号：US09050078
申请日：1998-03-30
申请人： Toshikazu Murata , Hiroji Noguchi , Sadao Kishida , Toshihiko Taguchi , Shozo Asano , Ryo Oishi , Takashi Hori
发明人： Toshikazu Murata , Hiroji Noguchi , Sadao Kishida , Toshihiko Taguchi , Shozo Asano , Ryo Oishi , Takashi Hori
IPC分类号： C22C1302
CPC分类号： B23K35/262
摘要： A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.
摘要翻译： 具有相对低的熔融温度并适合用于焊接电子器件的无铅焊料合金基本上由以下组成：7至10重量％的Zn; 0.01〜1重量％的Ni，0.1〜3.5重量％的Ag和0.1〜3重量％的Cu中的至少1种; 可选地，0.2至6重量％的Bi，0.5至3重量％的In和0.001至1重量％的P中的至少一个; 和Sn的平衡。 另一种这样的无铅焊料合金主要由以下组成：2至10重量％的Zn; Bi的10〜30重量％ 0.05〜2重量％的Ag; 任选地0.001至1重量％的P，余量为Sn。 这些焊料合金具有至少5kgf / mm 2的拉伸强度和至少10％的伸长率。
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公开(公告)号：US20110089224A1
公开(公告)日：2011-04-21
申请号：US12736624
申请日：2009-04-21
申请人： Tsukasa Ohnishi , Toshihiko Taguchi
发明人： Tsukasa Ohnishi , Toshihiko Taguchi
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02 , H05K3/3463
摘要： An inexpensive lead-free solder which prevents the occurrence of tin pest at extremely low temperatures and which has good wettability and impact resistance has a composition consisting essentially of, in mass %, Cu: 0.5-0.8%, Bi: at least 0.1% and less than 1%, Ni: 0.02-0.04%, and a remainder of Sn.
摘要翻译： 防止在极低温下发生锡害虫并且具有良好的润湿性和耐冲击性的廉价的无铅焊料具有以质量％计以Cu：0.5-0.8％，Bi：至少0.1％和 小于1％，Ni：0.02-0.04％，余量为Sn。
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公开(公告)号：US20060261131A1
公开(公告)日：2006-11-23
申请号：US10547539
申请日：2004-03-31
IPC分类号： A47J36/02
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/262 , H05K3/3463 , H05K2201/0272
摘要： In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
摘要翻译： 在通过混合合金粉末和焊剂形成的焊膏中，合金粉末是通过混合至少一种Sn-Zn基合金粉末和至少一种Sn-Ag基合金粉末形成的粉末混合物。 将合金粉末混合，使粉末混合物的组成为Zn的5-10质量％ Ag：0.005〜1.5质量％ 可任意选择Cu：0.002〜1.0质量％，Bi：0.005〜15质量％，In：0.005〜15质量％，Sb：0.005〜1.0质量％ 和Sn的剩余部分。
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公开(公告)号：US5176759A
公开(公告)日：1993-01-05
申请号：US806395
申请日：1991-12-13
申请人： Toshihiko Taguchi
发明人： Toshihiko Taguchi
IPC分类号： B23K35/22 , B23K35/36 , B23K35/363 , B23K101/42 , H05K3/34
CPC分类号： B23K35/3612 , B23K35/36 , H01L2224/81907
摘要： A paste solder with minimized flux residue remaining after soldering comprises a powdered solder and a flux in admixture. The flux comprises from about 5% to about 40% by weight of carrier components which comprise a rosin or a rosin derivative, an activating agent, and a thixotropic agent and from about 60% to about 95% by weight of a solvent which predominantly comprises a 2-alkyl-1,3-hexanediol having 1 to 4 carbon atoms in the alkyl group.
摘要翻译： 在焊接后残留的焊剂剩余量最小的糊状焊料包括粉末焊料和助熔剂。 助熔剂包含约5％至约40％重量的包含松香或松香衍生物，活化剂和触变剂的载体组分和约60重量％至约95重量％的主要包含 在烷基中具有1至4个碳原子的2-烷基-1,3-己二醇。
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公开(公告)号：US4097266A
公开(公告)日：1978-06-27
申请号：US645395
申请日：1975-12-30
CPC分类号： B22F1/025 , B23K35/0244 , H05K3/3436 , H05K2201/10234 , H05K2201/10992 , H05K2203/0338 , H05K2203/041 , Y02P70/613 , Y10T428/12181
摘要： A microsphere of solder having a metallic core, in which the thickness of the solder coating of the microsphere is more than 20 microns, can be produced by a process comprising preparing a sheet having a plurality of hollows provided all over the sheet, placing a spherical grain of a metal together with at least one grain of solder in each of said hollows, the metallic grain having wettability for solder, then heating the grains in the hollow in the presence of a flux to coat the metallic grain with the solder, and recovering a spherical solder bead having a metallic core.
摘要翻译： 具有金属芯的焊料微球，其中微球的焊料涂层的厚度大于20微米，可以通过以下方法制备，该方法包括制备具有遍及片材的多个中空部分的片材，放置球形 金属颗粒与每个所述凹槽中的至少一个焊料晶粒一起，金属颗粒具有用于焊料的润湿性，然后在焊剂存在下加热中空部分中的晶粒以用焊料涂覆金属颗粒，并回收 具有金属芯的球形焊料珠。
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公开(公告)号：US3963162A
公开(公告)日：1976-06-15
申请号：US488663
申请日：1974-07-15
申请人： Toshihiko Taguchi , Takehiko Ito
发明人： Toshihiko Taguchi , Takehiko Ito
CPC分类号： B23K1/18 , B23K1/19 , B23K35/262 , B23K35/3611
摘要： A method of soldering stainless steel pipes by using soft solders, which comprises the steps of preparing a pipe joint having a diametral clearance of from 0.05 to 1.00 mm, filling said clearance with paste solder, heating said pipe joint to melt said paste solder, and feeding additional soft solder into said clearance immediately after said paste solder is molten by said heating. Particularly, the paste solder comprises from 20 to 80% by weight of powder solder and from 20 to 80% by weight of a flux composition comprising a mixture of from 5 to 50% by weight of phosphoric acid (H.sub.3 PO.sub.4) and from 95 to 50% by weight of ammonium dihydrogenphosphate (NH.sub.4 H.sub.2 PO.sub.4) dissolved or suspended in a vehicle.
摘要翻译： 一种通过使用软质焊料焊接不锈钢管的方法，其特征在于包括以下步骤：制备直径为0.05至1.00mm的管接头，用糊焊料填充所述间隙，加热所述管接头以熔化所述焊膏，以及 在通过所述加热熔化所述焊膏之后，立即将附加的软焊料进料到所述间隙中。 特别地，糊状焊料包含20至80重量％的粉末焊料和20至80重量％的焊剂组合物，其包含5至50重量％的磷酸（H 3 PO 4）和95至50的混合物 溶解或悬浮在载体中的磷酸二氢铵（NH 4 H 2 PO 4）的重量％。
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公开(公告)号：US20060102690A1
公开(公告)日：2006-05-18
申请号：US10533288
申请日：2003-10-31
申请人： Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima , Toshihiko Taguchi , Yoshitaka Toyoda , Tsukasa Ohnishi
发明人： Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima , Toshihiko Taguchi , Yoshitaka Toyoda , Tsukasa Ohnishi
IPC分类号： B23K35/14
CPC分类号： B23K35/262 , H05K3/3463
摘要： The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.
摘要翻译： 本发明提供一种Sn-Zn基无铅焊料，即使在焊接了由Cu制成的部分焊接之后的长时间内，也可以防止焊料从焊接部分剥离。 根据本发明的Sn-Zn基无铅焊料包含5-10质量％的Zn，总共0.005-1.0质量％的至少一种选自Au，Pt，Pd，Fe， 和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。 可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。
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公开(公告)号：US06736907B2
公开(公告)日：2004-05-18
申请号：US10308167
申请日：2002-12-03
IPC分类号： B23K35363
CPC分类号： B23K35/3618 , B23K35/025 , B23K35/262 , H05K3/3484
摘要： A lead-free solder paste comprises an Sn—Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).
摘要翻译： 无铅焊膏包含与焊剂混合的Sn-Zn基无铅焊料粉末。 助熔剂含有至少一种芳族羟基羧酸，其选自间位具有一个羟基的芳族羧酸（如3-羟基-2-甲基苯甲酸）和具有至少两个羟基的芳族羧酸（如 作为二羟基萘甲酸或二羟基苯甲酸），为0.1-10.0质量％。 助熔剂还可以含有0.5〜20质量％的脂肪族羟基羧酸（如羟基油酸）。
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公开(公告)号：US6159304A
公开(公告)日：2000-12-12
申请号：US260604
申请日：1999-03-02
CPC分类号： B23K35/262 , B23K35/025 , B23K35/3615
摘要： In order to prevent aging of an Sn--Zn system alloy solder paste, 0.5-5% by weight of a compound obtained by adding an ethylene oxide to cyclohexylamine, preferably together with 0.5-5% by weight of a polyoxyethylene alkylamine is added to a flux of said solder paste.
摘要翻译： 为了防止Sn-Zn系合金焊膏的老化，将0.5-5重量％的通过将环氧乙烷加成到环己胺得到的化合物，优选与0.5-5重量％的聚氧乙烯烷基胺一起加入到 所述焊膏的焊剂。
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