发明申请
- 专利标题: Solder paste and printed board
- 专利标题(中): 焊膏和印刷板
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申请号: US10547539申请日: 2004-03-31
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公开(公告)号: US20060261131A1公开(公告)日: 2006-11-23
- 发明人: Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
- 申请人: Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
- 优先权: JP2003-098405 20030401
- 国际申请: PCT/JP04/04653 WO 20040331
- 主分类号: A47J36/02
- IPC分类号: A47J36/02
摘要:
In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
公开/授权文献
- US07681777B2 Solder paste and printed circuit board 公开/授权日:2010-03-23
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