公开(公告)号：US07681777B2

公开(公告)日：2010-03-23

申请号：US10547539

申请日：2004-03-31

申请人： Masahiko Hirata ,  Toshihiko Taguchi ,  Masanobu Okuyama ,  Yoshitaka Toyoda

发明人： Masahiko Hirata ,  Toshihiko Taguchi ,  Masanobu Okuyama ,  Yoshitaka Toyoda

IPC分类号： B23K35/14

CPC分类号： H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K2201/0272

摘要： In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.

摘要翻译： 在通过混合合金粉末和焊剂形成的焊膏中，合金粉末是通过混合至少一种Sn-Zn基合金粉末和至少一种Sn-Ag基合金粉末形成的粉末混合物。 将合金粉末混合，使粉末混合物的组成为Zn的5-10质量％ Ag：0.005〜1.5质量％ 可任意选择Cu：0.002〜1.0质量％，Bi：0.005〜15质量％，In：0.005〜15质量％，Sb：0.005〜1.0质量％ 和Sn的剩余部分。

公开(公告)号：US20060261131A1

公开(公告)日：2006-11-23

申请号：US10547539

申请日：2004-03-31

申请人： Masahiko Hirata ,  Toshihiko Taguchi ,  Masanobu Okuyama ,  Yoshitaka Toyoda

发明人： Masahiko Hirata ,  Toshihiko Taguchi ,  Masanobu Okuyama ,  Yoshitaka Toyoda

IPC分类号： A47J36/02

CPC分类号： H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K2201/0272

摘要： In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.

摘要翻译： 在通过混合合金粉末和焊剂形成的焊膏中，合金粉末是通过混合至少一种Sn-Zn基合金粉末和至少一种Sn-Ag基合金粉末形成的粉末混合物。 将合金粉末混合，使粉末混合物的组成为Zn的5-10质量％ Ag：0.005〜1.5质量％ 可任意选择Cu：0.002〜1.0质量％，Bi：0.005〜15质量％，In：0.005〜15质量％，Sb：0.005〜1.0质量％ 和Sn的剩余部分。