公开(公告)号：US12112738B2

公开(公告)日：2024-10-08

申请号：US18450942

申请日：2023-08-16

申请人： Apple Inc.

发明人： Hanchi Chen ,  Sarthak Khanal ,  Yang Lu ,  Vladan Bajic ,  Esge B. Andersen

IPC分类号： G10K11/178 ,  H04R3/00

CPC分类号： G10K11/17881 ,  G10K11/17854 ,  H04R3/005 ,  G10K2210/3028 ,  H04R2201/10

摘要： An ear cup housing has several reference microphones, an error microphone and a speaker. A processor drives the speaker for acoustic noise cancellation and transparency, by processing the microphone signals, and performs an oversight process by adjusting the reference microphone signals in response to detecting wind noise events and scratch events. In another aspect, the ear cup housing has an outside face that is joined to an inside face by a perimeter and the reference microphones are on the perimeter. Other aspects are also described and claimed.

公开(公告)号：US12106641B2

公开(公告)日：2024-10-01

申请号：US17669279

申请日：2022-02-10

申请人： Apple Inc.

发明人： Michael Ignazio Ingrassia, Jr. ,  Nathaniel P. Hramits

IPC分类号： G08B13/14 ,  G08B21/24 ,  G08B21/02

CPC分类号： G08B13/1427 ,  G08B21/24 ,  G08B21/0247 ,  G08B21/0277

摘要： Devices and methods for locating accessories of an electronic device are provided. In one example, a method may include detecting parameters associated with disconnecting an accessory from the electronic device. The electronic device, or an associated device, may store the detected parameters so that the detected parameters are accessible if the accessory becomes lost. The electronic device may receive a request from a user of the electronic device for assistance in locating the accessory. In response to the request for assistance in locating the accessory, the electronic device may provide the stored parameters to the user of the electronic device to aid them in searching for their lost accessory.

公开(公告)号：US12094457B2

公开(公告)日：2024-09-17

申请号：US17992785

申请日：2022-11-22

申请人： Apple Inc.

发明人： Daniel C. Klingler ,  Carlos M. Avendano ,  Hyung-Suk Kim ,  Miquel Espi Marques

IPC分类号： G10L15/16 ,  G06N3/08 ,  G06N20/00 ,  G10L25/51

CPC分类号： G10L15/16 ,  G06N3/08 ,  G06N20/00 ,  G10L25/51

摘要： An electronic device has one or more microphones that pick up a sound. At least one feature extractor processes the audio signals from the microphones, that contain the picked up the sound, to determine several features for the sound. The electronic device also includes a classifier that has a machine learning model which is configured to determine a sound classification, such as artificial versus natural for the sound, based upon at least one of the determined features. Other aspects are also described and claimed.

公开(公告)号：US12087689B2

公开(公告)日：2024-09-10

申请号：US18488561

申请日：2023-10-17

申请人： Apple Inc.

发明人： Sanjay Dabral ,  Jun Zhai ,  Jung-Cheng Yeh ,  Kunzhong Hu ,  Raymundo Camenforte ,  Thomas Hoffmann

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/528 ,  H01L23/538 ,  H01L23/58 ,  H01L25/065 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00

CPC分类号： H01L23/528 ,  H01L23/481 ,  H01L23/5386 ,  H01L23/585 ,  H01L25/0652 ,  H01L25/0655 ,  H01L21/78 ,  H01L22/20 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/30181 ,  H01L2224/32145 ,  H01L2224/32225

摘要： Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.

公开(公告)号：US12081934B2

公开(公告)日：2024-09-03

申请号：US17879417

申请日：2022-08-02

申请人： Apple Inc.

发明人： Gokhan Hatipoglu ,  Peter C. Hrudey ,  Scott C. Grinker ,  Ankur Jain ,  Patrick B. Wright

IPC分类号： H04R1/28 ,  H04R1/10

CPC分类号： H04R1/1058

摘要： A portable electronic device comprising: an enclosure having an enclosure wall that forms an interior chamber and an opening to an environment surrounding the enclosure wall; and a valve comprising a number of sliding actuators operable to open and close the opening to the environment surrounding the enclosure wall.

公开(公告)号：US12080696B2

公开(公告)日：2024-09-03

申请号：US18494109

申请日：2023-10-25

申请人： Apple Inc.

发明人： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC分类号： H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56

CPC分类号： H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US12074077B2

公开(公告)日：2024-08-27

申请号：US16952567

申请日：2020-11-19

申请人： Apple Inc.

发明人： Karthik Shanmugam ,  Flynn P. Carson ,  Jun Zhai ,  Raymundo M. Camenforte ,  Menglu Li

IPC分类号： H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/02 ,  H01L23/48

CPC分类号： H01L23/3121 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/31 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/4985 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/24 ,  H01L25/0655 ,  H01L25/105 ,  H05K1/0278 ,  H01L23/481 ,  H01L23/5384 ,  H01L2224/24137 ,  H01L2225/06548 ,  H01L2924/18162

摘要： Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.

公开(公告)号：US12057331B2

公开(公告)日：2024-08-06

申请号：US17345258

申请日：2021-06-11

申请人： Apple Inc.

发明人： Hyeun-Su Kim ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Kevin T. Huang ,  Eric B. Newton

IPC分类号： H01L21/00 ,  B65G47/90 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B41F16/00

CPC分类号： H01L21/67144 ,  B65G47/90 ,  H01L25/0753 ,  H01L33/62 ,  B41F16/00 ,  H01L2933/0066

摘要： Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

公开(公告)号：US12028732B2

公开(公告)日：2024-07-02

申请号：US16964727

申请日：2019-01-24

申请人： SPATIALBUZZ LIMITED

发明人： Simon Timothy Gerard Wootton ,  Ryan Dominic Shaw ,  Andrew Robert Blake

IPC分类号： H04W24/10 ,  H04L43/0864 ,  H04L43/50 ,  H04L61/4511 ,  H04L67/02 ,  H04W24/06

CPC分类号： H04W24/10 ,  H04L43/0864 ,  H04L43/50 ,  H04L61/4511 ,  H04L67/02 ,  H04W24/06

摘要： A method of assessing latency in a communications network comprising attempting to contact from a UE in a cellular network a specific internet resource with a HTTP request addressed to the resource, and capturing data specifying the period between making the attempt and receiving at the UE from the resource a response to the request. Thus data can be obtained from which can be made an end-to-end measurement of the latency affecting a user of a UE. Such measurements can be used by the operator of the communications network to, amongst other things, assess whether the network is performing satisfactorily, to advise users about the performance of the network and to determine that hardware or software within the network needs repair, upgrade or augmentation.

公开(公告)号：US12010496B2

公开(公告)日：2024-06-11

申请号：US17471011

申请日：2021-09-09

申请人： Apple Inc.

发明人： Aarti Kumar ,  Shehryar Lasi ,  Baptiste P. Paquier ,  Brian Clark

IPC分类号： H04R5/033 ,  G10L19/002 ,  H04L65/70 ,  H04L65/75 ,  H04R3/04 ,  H04R5/04 ,  H04W4/80

CPC分类号： H04R5/04 ,  G10L19/002 ,  H04L65/70 ,  H04L65/75 ,  H04R3/04 ,  H04R5/033 ,  H04W4/80 ,  H04R2420/07 ,  H04R2430/01

摘要： A method performed by an audio source device. The method receives a first audio signal and a second, different audio signal and encodes the first audio signal and the second audio signal, wherein the first audio signal is encoded differently than the second audio signal. The method generates a first data packet that comprises the first encoded audio signal and a first volume level and a second data packet that comprises the second encoded audio signal and a second volume level, wherein the first volume level is lower than the second volume level and transmits, over a wireless connection, the first and second data packets as a dual audio stream to an audio output device.