公开(公告)号：US11978825B2

公开(公告)日：2024-05-07

申请号：US17388949

申请日：2021-07-29

Applicant: Apple Inc.

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan ,  Daniel Arthur Haeger

IPC: H01L33/14 ,  H01L23/00 ,  H01L25/075 ,  H01L27/01 ,  H01L27/15 ,  H01L33/00 ,  H01L33/06 ,  H01L33/30 ,  H01L33/42 ,  G09G3/32 ,  H01L33/16 ,  H01L33/20

CPC classification number: H01L33/145 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/016 ,  H01L27/156 ,  H01L33/0093 ,  H01L33/06 ,  H01L33/14 ,  H01L33/30 ,  H01L33/42 ,  G09G3/32 ,  H01L33/0016 ,  H01L33/0095 ,  H01L33/16 ,  H01L33/20 ,  H01L2224/75305 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/82203 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

公开(公告)号：US11916048B2

公开(公告)日：2024-02-27

申请号：US17804707

申请日：2022-05-31

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L29/06 ,  H01L31/00 ,  H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62 ,  H01L33/06 ,  H01L33/36

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US11837593B2

公开(公告)日：2023-12-05

申请号：US17933188

申请日：2022-09-19

Applicant: Apple Inc.

Inventor： John A Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

CPC classification number: H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US11670626B2

公开(公告)日：2023-06-06

申请号：US17189636

申请日：2021-03-02

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L21/56 ,  H01L21/683 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L33/62 ,  H01L25/0753 ,  H01L2221/6834 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/2518 ,  H01L2224/25171 ,  H01L2224/73267 ,  H01L2224/821 ,  H01L2924/12041 ,  H01L2924/1426

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

公开(公告)号：US20230120136A1

公开(公告)日：2023-04-20

申请号：US18065270

申请日：2022-12-13

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L21/67 ,  B32B38/18 ,  H01L25/075 ,  H01L29/167 ,  H01L33/62

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：US11476239B2

公开(公告)日：2022-10-18

申请号：US17072240

申请日：2020-10-16

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibi ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US11373986B2

公开(公告)日：2022-06-28

申请号：US16998917

申请日：2020-08-20

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L29/06 ,  H01L31/00 ,  H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62 ,  H01L33/06 ,  H01L33/36

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US10593832B2

公开(公告)日：2020-03-17

申请号：US15223900

申请日：2016-07-29

Applicant: Apple Inc.

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan ,  Daniel Arthur Haeger

IPC: H01L33/14 ,  H01L27/01 ,  H01L33/06 ,  H01L23/00 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/30 ,  H01L33/42 ,  G09G3/32 ,  H01L33/16 ,  H01L33/20

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

公开(公告)号：US10546796B2

公开(公告)日：2020-01-28

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：US10290774B2

公开(公告)日：2019-05-14

申请号：US15299346

申请日：2016-10-20

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L33/48 ,  H01L27/15 ,  H01L33/62 ,  H01L51/00 ,  H01L25/075 ,  H01L33/44

Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 μm or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.