公开(公告)号：US12131922B1

公开(公告)日：2024-10-29

申请号：US17089585

申请日：2020-11-04

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Patrick J. Czarnota ,  Paul A. Parks ,  Nile A. Light

IPC: H01L21/68 ,  B65G47/90 ,  H01L21/67 ,  H01L21/683 ,  B25J7/00 ,  B25J9/00 ,  B25J15/00

CPC classification number: H01L21/67144 ,  B65G47/90 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6831 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0085

Abstract: A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

公开(公告)号：US20240234399A9

公开(公告)日：2024-07-11

申请号：US18494109

申请日：2023-10-25

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US10510736B2

公开(公告)日：2019-12-17

申请号：US16219896

申请日：2018-12-13

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L23/31 ,  H01L25/16 ,  H01L33/44 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US10424493B2

公开(公告)日：2019-09-24

申请号：US15445476

申请日：2017-02-28

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson

IPC: H01L33/48 ,  H01L33/62 ,  H01L21/52 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L33/40

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US10183401B2

公开(公告)日：2019-01-22

申请号：US15282225

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC: B25J15/00 ,  B81C99/00 ,  H01L23/00 ,  H02N13/00 ,  H01L21/67

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

公开(公告)号：US20170018613A1

公开(公告)日：2017-01-19

申请号：US15282200

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L29/167 ,  H01L25/075 ,  H01L21/67 ,  H01L33/62

CPC classification number: H01L29/167 ,  B32B38/18 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2933/0066 ,  Y10T156/1153 ,  Y10T156/17 ,  Y10T156/1705 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  Y10T156/1911 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Abstract translation: 公开了一种传送微型装置和微型装置阵列的方法。 承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。 当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。 施加到转印头的电压产生从载体衬底拾取微器件的夹持力。

公开(公告)号：US20160257131A1

公开(公告)日：2016-09-08

申请号：US15157247

申请日：2016-05-17

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: B41J2/39

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：US20230120136A1

公开(公告)日：2023-04-20

申请号：US18065270

申请日：2022-12-13

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L21/67 ,  B32B38/18 ,  H01L25/075 ,  H01L29/167 ,  H01L33/62

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：US11476239B2

公开(公告)日：2022-10-18

申请号：US17072240

申请日：2020-10-16

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibi ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US10923023B1

公开(公告)日：2021-02-16

申请号：US15380860

申请日：2016-12-15

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Xia Li ,  John A. Higginson ,  Vaibhav D. Patel ,  Kapil V. Sakariya ,  Imran Hashim ,  Tore Nauta ,  Thomas Charisoulis

IPC: G09G3/32 ,  H01L27/32

Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.