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公开(公告)号:US20190006329A1
公开(公告)日:2019-01-03
申请号:US16067865
申请日:2017-01-11
Applicant: Apple Inc.
Inventor: Imran Hashim , Vaibhav D. Patel , Hsin-Hua Hu , Kapil V. Sakariya , Ralph E. Kauffman
IPC: H01L25/075 , H01L33/62 , H01L33/44
Abstract: Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.
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公开(公告)号:US20240105525A1
公开(公告)日:2024-03-28
申请号:US18358559
申请日:2023-07-25
Applicant: Apple Inc.
Inventor: Imran Hashim , Xiang Lu , Stanley B. Wang , Xuchun Liu , Mahdi Farrokh Baroughi , Yongjie Jiang , Hopil Bae , Hasan Akyol , Baris Posat , John T. Wetherell , Lei Wu
IPC: G09G3/32 , H01L25/075 , H01L33/62
CPC classification number: G09G3/32 , H01L25/0753 , H01L33/62 , H01L2933/0066
Abstract: Test structures and methods of testing pixel driver chip donor wafers are described. In an embodiment, a redistribution layer is formed over a pixel driver chip donor wafer and probed to determine known good dies, followed by removal of the RDL. In other embodiments, test routing is formed in the pixel driver chip using a polycide material or doped region in the semiconductor wafer.
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公开(公告)号:US10923023B1
公开(公告)日:2021-02-16
申请号:US15380860
申请日:2016-12-15
Applicant: Apple Inc.
Inventor: Andreas Bibl , Xia Li , John A. Higginson , Vaibhav D. Patel , Kapil V. Sakariya , Imran Hashim , Tore Nauta , Thomas Charisoulis
Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.
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