公开(公告)号：US20240047353A1

公开(公告)日：2024-02-08

申请号：US18488561

申请日：2023-10-17

申请人： Apple Inc.

发明人： Sanjay Dabral ,  Jun Zhai ,  Jung-Cheng Yeh ,  Kunzhong Hu ,  Raymundo Camenforte ,  Thomas Hoffmann

IPC分类号： H01L23/528 ,  H01L23/538 ,  H01L23/48 ,  H01L25/065 ,  H01L23/58

CPC分类号： H01L23/528 ,  H01L23/5386 ,  H01L23/481 ,  H01L25/0655 ,  H01L25/0652 ,  H01L23/585 ,  H01L22/20

摘要： Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.

公开(公告)号：US11862557B2

公开(公告)日：2024-01-02

申请号：US17483535

申请日：2021-09-23

申请人： Apple Inc.

发明人： Sanjay Dabral ,  Jun Zhai ,  Jung-Cheng Yeh ,  Kunzhong Hu ,  Raymundo Camenforte ,  Thomas Hoffmann

IPC分类号： H01L21/00 ,  H01L23/528 ,  H01L23/538 ,  H01L23/48 ,  H01L25/065 ,  H01L23/58 ,  H01L21/66 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L23/528 ,  H01L23/481 ,  H01L23/5386 ,  H01L23/585 ,  H01L25/0652 ,  H01L25/0655 ,  H01L21/78 ,  H01L22/20 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/30181 ,  H01L2224/32145 ,  H01L2224/32225

摘要： Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.

公开(公告)号：US12087689B2

公开(公告)日：2024-09-10

申请号：US18488561

申请日：2023-10-17

申请人： Apple Inc.

发明人： Sanjay Dabral ,  Jun Zhai ,  Jung-Cheng Yeh ,  Kunzhong Hu ,  Raymundo Camenforte ,  Thomas Hoffmann

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/528 ,  H01L23/538 ,  H01L23/58 ,  H01L25/065 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00

CPC分类号： H01L23/528 ,  H01L23/481 ,  H01L23/5386 ,  H01L23/585 ,  H01L25/0652 ,  H01L25/0655 ,  H01L21/78 ,  H01L22/20 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/30181 ,  H01L2224/32145 ,  H01L2224/32225

摘要： Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.

公开(公告)号：US20230085890A1

公开(公告)日：2023-03-23

申请号：US17483535

申请日：2021-09-23

申请人： Apple Inc.

发明人： Sanjay Dabral ,  Jun Zhai ,  Jung-Cheng Yeh ,  Kunzhong Hu ,  Raymundo Camenforte ,  Thomas Hoffmann

IPC分类号： H01L23/528 ,  H01L23/58 ,  H01L23/538 ,  H01L23/48 ,  H01L25/065

摘要： Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.