摘要:
An OR gate circuit includes double-gated four terminal transistor with independent gate control. First and second inputs are independently coupled to the top and bottom gates of the transistor. The drain is coupled to an output and precharged to a low voltage. An input to either the top or bottom gates results in a high voltage to the drain and an output value of 1.
摘要:
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
摘要:
A device for measuring optical power simultaneously for two or more spectral regions. Two or more photodetectors, such as photodiodes, measure the pulse energy and/or power emitted by a laser having output in two or more spectral regions. The laser radiation is transmitted through a diffuser or beamsplitter, then filtered and/or attenuated so that light from each respective spectral region is incident on the active region of a photodiode. The device also includes electronic circuitry with one or more operational amplifiers for each photodiode, integrators and analog-to-digital converters. In a preferred embodiment, the device also includes a microprocessor to provide noise reduction and calibration functions for each photodiode output, and to drive a display or readout.
摘要:
An image sensor includes a unit cell having a plurality of pixels; the unit cell comprising an amplifier input transistor that is shared by the plurality of pixels; a plurality of floating diffusions that are joined by a floating diffusion interconnect layer and are connected to the amplifier input transistor; and an interconnect layer which forms an output signal wire which shields the floating diffusion interconnect layer.
摘要:
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要:
A programmable resistance memory element comprising an adhesion layer between the programmable resistance material and at least one of the electrodes. Preferably, the adhesion layer is a titanium rich titanium nitride composition.
摘要:
Mechanical stress control may be achieved using materials having selected elastic moduli. These materials may be selectively formed by implantation, may be provided as a plurality of buried layers interposed between the substrate and the active area, and may be formed by replacing selected portions of one or more buried layers. Any one or more of these methods may be used in combination. Mechanical stress control may be useful in the channel region of a semiconductor device to maximize its performance. In addition, these same techniques and structures may be used for other purposes besides mechanical stress control.
摘要:
A semiconductor device has a semiconductor base, an anode electrode, and a cathode electrode. The semiconductor base includes a P type semiconductor substrate, an insulating film, an N− type semiconductor region formed on the insulating film, an N+ type semiconductor region, and a P+ type semiconductor region facing the N+ type semiconductor region via the N− type semiconductor region. The semiconductor device further has an N type diffusion layer which is formed, in the N− type semiconductor region at the interface between the insulating film and the N− type semiconductor region, so as to have a concentration gradient such that the N type impurity concentration increases from the side of the anode electrode to the side of the cathode electrode.
摘要:
A semiconductor apparatus includes a substrate, a buffer layer made of a monocrystal semiconductor material and formed on the substrate, a strained-Si layer formed on the buffer layer and having a lattice constant different from that of the buffer layer, a monocrystal insulating film formed on the strained-Si layer and made of a material having a rare earth structure with a lattice constant different from that of Si, and an electrode formed on the insulating film.
摘要:
An imaging system, capable of reducing blooming in a solid-state imaging device and improving image sensitivity, comprises an imaging section which has at least three transfer electrodes and is continuously arranged with pixels for producing information charges in response to the light from the outside, wherein the information charges are stored and transferred using potential wells formed by potentials applied to the transfer electrodes and, during image capture, one of the transfer electrodes is maintained in an ON state and at least another one of the transfer electrodes is alternately switched between an ON state and an OFF state. It is more preferable to average the amount of generated dark current under the transfer electrodes by switching the transfer electrodes between an ON state and an OFF state for image capture. This provides restraint of a difference in the amount of generated dark current between pixels, thus reducing image graininess.