公开(公告)号：US20180273752A1

公开(公告)日：2018-09-27

申请号：US15495252

申请日：2017-04-24

申请人： GRAND TEK ADVANCE MATERIAL SCIENCE CO., LTD.

发明人： Hsueh-Tso LIN ,  Zhi-Yong WANG ,  Dick ZHONG

IPC分类号： C08L71/12

CPC分类号： C08L71/126 ,  C08F212/08 ,  C08F212/12 ,  C08F212/34 ,  C08F212/36 ,  C08F226/06 ,  C08L25/08 ,  C08L25/16 ,  C08L25/18 ,  C08L71/12 ,  C08F2222/102

摘要： Polyphenylene ether resin composition includes 100 parts by weight of polyphenylene ether resin, 25 to 40 parts by weight of copolymer, and 0.01 to 0.02 parts by weight of initiator. The copolymer is (A) copolymer polymerized of (a) mono-functional monomer, (b1) bi-functional monomer, and (c) tri-functional monomer through radical polymerization, (B) copolymer polymerized of (a) mono-functional monomer and (b2) bi-functional monomer through radical polymerization, or (C) a combination thereof.

公开(公告)号：US10072149B2

公开(公告)日：2018-09-11

申请号：US15111746

申请日：2016-02-17

申请人： LG CHEM, LTD.

发明人： Nam Jib Park ,  Sang Ho Lee ,  Se Yeong Ju ,  Sung Ho Lee ,  Sung Tae Ahn

IPC分类号： C08L71/12 ,  C08L77/00 ,  C08L77/06

CPC分类号： C08L77/06 ,  C08L71/12 ,  C08L71/123 ,  C08L71/126 ,  C08L2205/035 ,  C08L2205/06 ,  C08L2207/53 ,  C08L23/00 ,  C08L25/10 ,  C08L77/00

摘要： Disclosed is a poly(arylene ether) resin composition, and more specifically, a modified poly(arylene ether) resin composition including a poly(arylene ether) resin, a poly(arylene ether) resin modified with unsaturated carboxylic acid or an anhydride thereof, a polyamide resin, a polyolefin resin, and an encapsulating agent, wherein the polyolefin resin is encapsulated by the encapsulating agent with the poly(arylene ether) resin and the poly(arylene ether) resin modified with unsaturated carboxylic acid or an anhydride thereof, and a molded article produced therefrom. The disclosed composition has an effect of providing a modified poly(arylene ether) resin composition which has less change in physical properties caused by moisture, and has low specific gravity and superior impact strength, weatherability and balance in physical properties.

公开(公告)号：US20180223454A1

公开(公告)日：2018-08-09

申请号：US15888270

申请日：2018-02-05

申请人： Earth Renewable Technologies

发明人： Emanuel Lopes Martins ,  Carmen E. Finnessy ,  Melvin Glenn Mitchell

IPC分类号： D01F8/06 ,  D01F8/14 ,  D06M10/04 ,  C08J3/20 ,  C08L1/12 ,  C08L1/14 ,  C08L23/06 ,  C08L23/12 ,  C08L25/06 ,  C08L27/06 ,  C08L27/18 ,  C08L33/24 ,  C08L55/02 ,  C08L71/12 ,  C08L79/08 ,  C08K9/12

CPC分类号： D01F8/06 ,  C08J3/20 ,  C08J5/18 ,  C08J2367/04 ,  C08K9/12 ,  C08L1/12 ,  C08L1/14 ,  C08L23/06 ,  C08L23/12 ,  C08L25/06 ,  C08L27/06 ,  C08L27/18 ,  C08L33/08 ,  C08L33/24 ,  C08L55/02 ,  C08L67/04 ,  C08L71/12 ,  C08L77/00 ,  C08L79/08 ,  C08L91/00 ,  C08L2205/16 ,  D01D5/30 ,  D01F1/02 ,  D01F8/04 ,  D01F8/14 ,  D06M10/04 ,  C08L101/00 ,  C08L67/02

摘要： The biocomponent fiber functions as a carrier or vehicle for delivering additives to a polymer composition. The bicomponent fiber may be “splittable segmented pie” or “island-in-the-sea” construction with the sea being the low melt temperature component and the island being the high melt temperature component. The low melt temperature polymer may be selected from the group consisting of low density polyethylene (LDPE), high density polyethylene (HDPE), polylactic acid (PLA), polyhydroxyalkenoate (PHA), polypropylene (PP), polystyrene (PS), polyvinylidene fluoride, polybutylene succinate (PBS), low melt temperature polyethylene terephthalate, polytrimethylene terephthalate (PTT) and low melt temperature nylons. The high melt temperature component polymer is selected from the group consisting of polyethylene terephthalate (PET), co-polyester, polybutylene terephthalate (PBT), poly (methyl methacrylate) (PMMA), polytetrafluoroethylene (PTFE), polyether ether ketones (PEEK), polyphenylene sulfides (PPS), high melt temperature nylon, polylactic acid (PLA), including stereocomplex PLA, namely 100% PDLA, 100% PLLA or a 50/50 blend of 100% PDLA and 100% PLLA.

公开(公告)号：US10000606B2

公开(公告)日：2018-06-19

申请号：US14819392

申请日：2015-08-05

申请人： Seeo, Inc.

发明人： Jin Yang ,  Hany Basam Eitouni ,  Mohit Singh

IPC分类号： C08G65/48 ,  C08G81/02 ,  C08L71/02 ,  C08L71/12 ,  C08G77/42 ,  C08G77/46

CPC分类号： C08G65/485 ,  C08G77/42 ,  C08G77/46 ,  C08G81/024 ,  C08G81/025 ,  C08G2261/126 ,  C08L71/02 ,  C08L71/12 ,  C08L2205/05

摘要： New polymer compositions based on poly(2,6-dimethyl-1,4-phenylene oxide) and other high-softening-temperature polymers are disclosed. These materials have a microphase domain structure that has an ionically-conductive phase and a phase with good mechanical strength and a high softening temperature. In one arrangement, the structural block has a softening temperature of about 210° C. These materials can be made with either homopolymers or with block copolymers.

公开(公告)号：US09994704B2

公开(公告)日：2018-06-12

申请号：US14364607

申请日：2012-12-14

申请人： Lotte Advanced Materials Co., Ltd.

发明人： Jung Wook Kim ,  Do Hoon Chang ,  Chang Min Hong

IPC分类号： C08L53/02 ,  C08L23/02 ,  C08K3/26 ,  C08K3/34 ,  C08K3/36 ,  C08L71/12 ,  D06F37/26

CPC分类号： C08L53/02 ,  C08L71/12 ,  D06F37/266 ,  C08L91/00 ,  C08L23/02

摘要： A thermoplastic elastomer composition of the present invention comprises (A) 30 to 40% by weight of a block terpolymer of an aromatic vinyl compound and alkene or a conjugated diene-based compound; (B) 25 to 50% by weight of a paraffin oil; (C) 1 to 5% by weight of a polyolefin-based resin; (D) 5 to 20% by weight of an inorganic additive; and (E) 5 to 15% by weight of a polyphenylene ether-based resin. The thermoplastic elastomer composition, which has a surface hardness of 0.1 to 40 A (shore A), shows excellent low hardness and has improved physical properties at high temperature, particularly, flexibility, restoring force at high temperatures, and the like.

公开(公告)号：US20180154315A1

公开(公告)日：2018-06-07

申请号：US15568677

申请日：2016-04-22

申请人： SABIC GLOBAL TECHNOLOGIES B.V.

发明人： Albin Peter Berzinis ,  Pooja Bajaj ,  Rachel Elizabeth Halbfinger

IPC分类号： B01D67/00 ,  B01D71/52 ,  B01D71/76 ,  C08L71/12

摘要： An method of making a porous asymmetric membrane involves dissolving a poly(phenylene ether), poly(phenylene ether) copolymer, polyethersulfone, polysulfone, polyphenylsulfone, polyimide, polyetherimide, polyvinylidene fluoride, or a combination thereof in a water-miscible polar aprotic solvent to provide a membrane-forming composition; and phase-inverting the membrane-forming composition in a first non-solvent composition composed of water, a water-miscible polar aprotic solvent, or a mixture thereof, and a polymer additive dissolved in the first non-solvent composition. The method can be a method of making a hollow fiber by coextrusion through a spinneret having an annulus and a bore, including coextruding the membrane-forming composition through the annulus, and the first non-solvent composition through the bore, into a second non-solvent composition composed of water, a water-miscible polar aprotic solvent, or a mixture thereof to form the hollow fiber.

公开(公告)号：US09991622B2

公开(公告)日：2018-06-05

申请号：US14901215

申请日：2014-06-30

申请人： ASAHI KASEI CHEMICALS CORPORATION

发明人： Hiroyuki Kono ,  Kazuyuki Ogata ,  Tadayuki Ishii

IPC分类号： C08K5/51 ,  H01R13/405 ,  C08L71/12 ,  H01B3/42 ,  H01B3/44 ,  C08L53/02 ,  H01R13/52 ,  H01R13/527 ,  C08L25/06

CPC分类号： H01R13/405 ,  C08K3/22 ,  C08K5/521 ,  C08L25/06 ,  C08L53/025 ,  C08L71/12 ,  C08L71/123 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/206 ,  C08L2205/03 ,  C08L2207/04 ,  H01B3/427 ,  H01B3/441 ,  H01R13/5216 ,  H01R13/527

摘要： Provided is an electric component equipped with a live electrical part and an insulating resin molded article that is molded from a thermoplastic resin composition and is in contact with the live electrical part, wherein: the thermoplastic resin composition includes (A) 60 to 80 parts by mass of a polyphenylene ether resin or a mixture of a polyphenylene ether resin and a styrene resin, (B) 60 to 80 parts by mass of a hydrogenated block copolymer, (C) 5 to 30 parts by mass of a flame retardant, and (D) 0.1 to 3 parts by mass of titanium oxide (in an amount corresponding to 100 parts by mass of the total of (A) to (C)).

公开(公告)号：US20180142098A1

公开(公告)日：2018-05-24

申请号：US15819112

申请日：2017-11-21

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Minoru SAKATA

IPC分类号： C08L71/12 ,  C08L53/02 ,  C08L25/06

CPC分类号： C08L71/123 ,  C08L25/06 ,  C08L53/025 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L51/04

摘要： Provided is a resin composition having an excellent balance of high impact resistance and fluidity, and excellent ductile fracture properties. The resin composition contains: a polyphenylene ether resin (a); and a hydrogenated block copolymer (b) including a hydrogenated block copolymer component (b-1) that includes two polymer blocks A of mainly a vinyl aromatic compound and two polymer blocks B of mainly a conjugated diene compound, and a hydrogenated block copolymer component (b-2) that includes two polymer blocks A of mainly a vinyl aromatic compound and one polymer block B of mainly a conjugated diene compound, with a mass ratio of the hydrogenated block copolymer component (b-1) relative to the hydrogenated block copolymer component (b-2) (hydrogenated block copolymer component (b-1)/hydrogenated block copolymer component (b-2)) of 5/95 to 95/5. Polypropylene content in the resin composition is less than 5 mass % when all resin components are taken to be 100 mass %, in total.

公开(公告)号：US20180127547A1

公开(公告)日：2018-05-10

申请号：US15570174

申请日：2016-04-28

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Takao TANIGAWA ,  Yasuyuki MIZUNO ,  Tomio FUKUDA ,  Yuki NAGAI ,  Hikari MURAI

IPC分类号： C08G73/10 ,  C08G65/333 ,  C08J5/24 ,  C08K5/51 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04

摘要： Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

公开(公告)号：US20180126631A1

公开(公告)日：2018-05-10

申请号：US15568979

申请日：2015-07-23

申请人： Hewlett-Packard Development Company, L.P.

发明人： Krzysztof Nauka ,  Howard S. Tom ,  Kristopher J. Erickson ,  Lihua Zhao ,  Sivapackia Ganapathiappan

IPC分类号： B29C64/153 ,  B33Y70/00 ,  C08K3/22 ,  C08K5/00 ,  C08L101/12 ,  C08L77/02 ,  C08L71/12

CPC分类号： B29C64/153 ,  B33Y70/00 ,  C08K3/20 ,  C08K3/22 ,  C08K3/30 ,  C08K3/32 ,  C08K5/00 ,  C08K5/0091 ,  C08K2003/2248 ,  C08K2201/005 ,  C08L71/12 ,  C08L77/02 ,  C08L101/00 ,  C08L101/12

摘要： A three-dimensional printing build material composition includes a polymer particle, and a radiation absorbing additive mixed with the polymer particle. The radiation absorbing additive has a particle size ranging from about 1 μm to about 100 μm, and the radiation absorbing additive is to absorb incident radiation having wavelengths ranging from 700 nm to 10 μm.