公开(公告)号：US20050102831A1

公开(公告)日：2005-05-19

申请号：US10989516

申请日：2004-11-17

Applicant: Hajime Saiki ,  Atsuhiko Sugimoto

Inventor： Hajime Saiki ,  Atsuhiko Sugimoto

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/02 ,  C25F3/00

CPC classification number: H05K3/4661 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2203/0796 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A process for manufacturing a wiring substrate, comprising a roughening step of roughening surfaces of insulating resin layers, at least one of the insulating resin layers containing an epoxy resin which contains 30 to 50 wt. % of an inorganic filler of SiO2 having an average grain diameter of 1.0 to 10.0 μm, wherein the roughening step includes a roughening step of dipping in a solution of permanganic acid at 70 to 85° C. for 20 minutes or longer.

Abstract translation: 一种制造布线基板的方法，包括使绝缘树脂层的表面粗糙化的粗糙化步骤，至少一个含有环氧树脂的绝缘树脂层，其含有30〜50重量％ ％的平均粒径为1.0〜10.0μm的SiO 2的无机填料，其中，所述粗糙化工序包括将高锰酸溶液在70〜85℃下浸渍的粗糙化工序， 20分钟以上

公开(公告)号：US06818142B2

公开(公告)日：2004-11-16

申请号：US10404200

申请日：2003-03-31

Applicant: Thomas Peter Tufano ,  Michael Brian Coxey

Inventor： Thomas Peter Tufano ,  Michael Brian Coxey

IPC: C01B1508

CPC classification number: C01B15/08 ,  C23F1/18 ,  H01L21/3212 ,  H05K3/383 ,  H05K2203/0796

Abstract: A solution comprising potassium hydrogen peroxymonosulfate containing an elevated level of KHSO5 and having a weight ratio of SO5 to SO4 of greater than 1.0:1, and its use in microetching metal substrates is disclosed.

公开(公告)号：US06716281B2

公开(公告)日：2004-04-06

申请号：US10143389

申请日：2002-05-10

Applicant: Roger F. Bernards ,  Joseph Stanton Bowers, Jr. ,  Benjamin T. Carroll ,  Alvin A. Kucera

Inventor： Roger F. Bernards ,  Joseph Stanton Bowers, Jr. ,  Benjamin T. Carroll ,  Alvin A. Kucera

IPC: C09K1300

CPC classification number: B32B38/00 ,  B32B2038/0052 ,  B32B2311/12 ,  B32B2457/08 ,  C23C22/52 ,  C23F1/18 ,  H05K3/282 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract translation: 本发明涉及一种用于提供适于随后的多层层压的耐化学腐蚀的粗糙铜表面的方法和组合物。 在一个实施方案中，光滑的铜表面在有效提供粗糙的铜表面的条件下与促粘合组合物接触，该粘合促进组合物包含氧化剂，pH调节剂，形貌改性剂和含硫涂料稳定剂。 在另一个实施方案中，在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，所述粘合促进组合物包含氧化剂，pH调节剂和形貌改性剂。 然后，在随后的步骤中，将粗糙化的铜表面与耐酸性促进组合物接触。

公开(公告)号：US06666987B1

公开(公告)日：2003-12-23

申请号：US09327800

申请日：1999-06-08

Applicant: Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

Inventor： Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

IPC: C09K1306

CPC classification number: B41N3/03 ,  C23F1/18 ,  H05K3/383 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.

Abstract translation: 能够提供具有粗糙表面的铜的铜表面的粗糙化的液体蚀刻剂和粗糙化方法在短时间内与氯离子无关地增加耐酸性，从而确保铜导电图案和外层之间的牢固粘合 在制造印刷电路板期间的材料，导致制造被高度简化。 液体蚀刻剂包括含有氧酸如硫酸和过氧化氢如过氧化氢的主要成分。 此外，液体蚀刻剂包括含有四唑的辅助成分，例如5-氨基四唑等，或1,2,3,4-唑。 液体蚀刻剂允许铜表面以针状方式粗糙化。

公开(公告)号：US20030164466A1

公开(公告)日：2003-09-04

申请号：US10311395

申请日：2002-12-13

Inventor： Uwe Hauf ,  Harry Fuerhaupter ,  Alexey Stiop ,  Udo Grieser

IPC: A62D001/00 ,  A62C002/00

CPC classification number: H05K3/383 ,  C23C22/52 ,  C23F1/18 ,  H05K3/064 ,  H05K3/28 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: 1 wherein R1 and R2nullalkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R3nullR1, R1nullO, R1nullS, amino or substituted amino, wherein R1 and R2 may especially be phenyl or substituted phenyl.

Abstract translation: 本发明涉及一种处理铜表面的方法和方法，所述铜表面与含有过氧化氢和至少一种五元杂环化合物的酸性处理液接触，另外还包括至少一种微结构修饰 选自包括硫醇A，二硫化物B，硫化物C和硫代酰胺D的组分，其具有以下各自的通式：其中R1和R2是烷基，烯基，芳基，芳烷基，特别是苄基，环烷基及其衍生物，R3 = R1， R1-O，R1-S，氨基或取代的氨基，其中R1和R2可以特别是苯基或取代的苯基。

公开(公告)号：US06586526B1

公开(公告)日：2003-07-01

申请号：US08437382

申请日：1995-05-09

Applicant: Akio Sekimoto ,  Shinichi Yamada

Inventor： Akio Sekimoto ,  Shinichi Yamada

IPC: C08K326

CPC classification number: H05K3/4661 ,  C08G59/226 ,  C08G59/38 ,  C08L9/00 ,  C08L17/00 ,  C08L63/00 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796 ,  Y10S428/901 ,  Y10T156/1056 ,  C08L2666/08

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer. The curable resin composition comprises (A) epoxy resins and (B) an epoxy resin curing agent as essential components thereof and optionally contains a rubber component and a filler capable of being decomposed or dissolved by a coarsening agent. This composition contains in combination a bisphenol A epoxy resin having an epoxy equivalent of not less than 400 and an epoxy resin having an epoxy equivalent of less then 400.

Abstract translation: 公开了一种多层印刷电路板，其具有树脂绝缘层和导体层，交替地重叠在电路板上，具有足够的粘合强度，其制备方法和用于形成树脂绝缘层的固化树脂组合物。 多层印刷电路板的制造通过将可固化树脂组合物施加到电路板的导体层的表面上，热固化所施加的层，从而形成树脂绝缘层，然后在电路板中钻孔，处理 具有粗化剂的树脂绝缘层由此赋予波浪粗化表面，随后通过化学镀将导体层涂覆树脂绝缘层的表面和通孔的内表面，然后在其中形成规定的电路图案 导体层。 可固化树脂组合物包含（A）环氧树脂和（B）环氧树脂固化剂作为其主要组分，并且任选地包含能够被粗化剂分解或溶解的橡胶组分和填料。 该组合物组合含有环氧当量不小于400的双酚A环氧树脂和环氧当量小于400的环氧树脂。

公开(公告)号：US06544584B1

公开(公告)日：2003-04-08

申请号：US08813765

申请日：1997-03-07

Applicant: Edward Lee Arrington ,  John Christopher Camp ,  Robert Jeffrey Day ,  Edmond Otto Fey ,  Curtis Michael Gunther ,  Thomas Richard Miller

Inventor： Edward Lee Arrington ,  John Christopher Camp ,  Robert Jeffrey Day ,  Edmond Otto Fey ,  Curtis Michael Gunther ,  Thomas Richard Miller

IPC: B05D512

CPC classification number: H05K3/26 ,  H05K3/184 ,  H05K2201/0761 ,  H05K2203/0796 ,  Y10S428/901 ,  Y10T428/12396 ,  Y10T428/12715 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g., with chlorite, permanganate, hydrogen peroxide, or air at a temperature elevated above ambient conditions); and d) removing the undesirable portions of the catalyst layer and the undesirable portions of the circuit pattern (e.g., with a cyanide submersion). The resultant circuitized substrate includes a circuit pattern on a catalyst layer wherein undesirable portions of the catalyst layer and circuit pattern are completely removed between the circuit features of the circuit pattern so that electrical leakage between the circuit features does not occur.

Abstract translation: 用于去除电路化基板上的不期望的导电材料（例如催化剂材料和渗出的电路材料）的方法以及公开的所得的电路化基板。 这种工艺和结果电路有效地解决了残余催化剂材料和残余催化剂材料下渗出的电路材料的非破坏所引起的电短路问题。 该方法包括以下步骤：a）在其上提供具有电路图案（例如铜）的催化剂层（例如钯和锡） b）预处理催化剂层和电路图案（例如，用氰化物浸渍），以除去在电路图案的电路线之间引起漏电的各部分的不希望的部分; c）氧化催化剂层和电路图案（例如，在高于环境条件的温度下使用亚氯酸盐，高锰酸盐，过氧化氢或空气）; 以及d）去除催化剂层的不期望的部分和电路图案的不希望的部分（例如，氰化物浸没）。 所得到的电路化衬底包括在催化剂层上的电路图案，其中在电路图案的电路特征之间催化剂层和电路图案的不期望部分被完全去除，使得电路特征之间的电泄漏不会发生。

公开(公告)号：US06454954B1

公开(公告)日：2002-09-24

申请号：US09575515

申请日：2000-05-22

Applicant: Wanda Darlene Brewster ,  Tuan Hoang Ho

Inventor： Wanda Darlene Brewster ,  Tuan Hoang Ho

IPC: B44C122

CPC classification number: C23F1/34 ,  B44C1/227 ,  H05K3/0055 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.

Abstract translation: 公开了从不稳定状态补充粘附促进浴的方法，而不排除浴液。 还公开了使用补充浴的粘附促进基材例如印刷线路板的方法。

公开(公告)号：US06372699B1

公开(公告)日：2002-04-16

申请号：US09215872

申请日：1998-12-18

Applicant: Hiroshi Morita ,  Tetsuo Mizuniwa ,  Junichi Ida

Inventor： Hiroshi Morita ,  Tetsuo Mizuniwa ,  Junichi Ida

IPC: C11D1310

CPC classification number: H01L21/02052 ,  C11D3/0042 ,  C11D3/3947 ,  C11D7/06 ,  C11D11/0047 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: A cleaning solution for electronic materials contains dissolved oxygen gas at a concentration greater than atmospheric saturation concentration, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. Alternatively, the cleaning solution contains dissolved reducing agents, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. A method for making the cleaning solution of the present invention is provided. A method for cleaning electronic materials using the cleaning solution of the present invention is also provided.

Abstract translation: 用于电子材料的清洁溶液含有浓度大于大气饱和浓度的溶解氧气，0.1-10,000mg /升氨和0.1-10,000mg /升过氧化氢水溶液。 或者，清洁溶液含有溶解的还原剂，0.1-10,000mg /升氨和0.1-10,000mg /升过氧化氢在水中。 提供了制造本发明的清洗溶液的方法。 还提供了使用本发明的清洁溶液清洁电子材料的方法。

公开(公告)号：US06359035B1

公开(公告)日：2002-03-19

申请号：US09509554

申请日：2000-04-13

Applicant: Yoshitaka Ono ,  Taki Adachi

Inventor： Yoshitaka Ono ,  Taki Adachi

IPC: C08K311

CPC classification number: C09J181/02 ,  C09J171/12 ,  C09J181/06 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0796

Abstract: This adhesive for electroless plating can be produced without causing dust explosion and is excellent as an interlaminar resin insulating layer and is obtained by mixing an organic solvent dispersion of cured particles of heat resistant resin soluble or decomposable in an acid or an oxidizing agent with an uncured resin. The dispersion of the cured particles of the heat resistant resin in the organic solvent is obtained by dispersing cured particles formed in the production of heat resistant resin cured particles into the organic solvent without drying, and the uncured resin is a resin becoming hardly soluble in an acid or an oxidizing agent through curing treatment and capable of forming a heat resistant cured resin.

Abstract translation: 可以制造无电镀用粘合剂，而不会引起粉尘爆炸，作为层间树脂绝缘层是优异的，并且通过将在酸或氧化剂中可溶或可分解的耐热树脂的固化颗粒的有机溶剂分散体与未固化的 树脂。 耐热树脂的固化颗粒在有机溶剂中的分散是通过将生产耐热树脂固化颗粒中形成的固化颗粒分散在有机溶剂中而不干燥而获得的，未固化树脂是难溶于 酸或氧化剂通过固化处理并能够形成耐热固化树脂。