公开(公告)号：US06359035B1

公开(公告)日：2002-03-19

申请号：US09509554

申请日：2000-04-13

Applicant: Yoshitaka Ono ,  Taki Adachi

Inventor： Yoshitaka Ono ,  Taki Adachi

IPC: C08K311

CPC classification number: C09J181/02 ,  C09J171/12 ,  C09J181/06 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0796

Abstract: This adhesive for electroless plating can be produced without causing dust explosion and is excellent as an interlaminar resin insulating layer and is obtained by mixing an organic solvent dispersion of cured particles of heat resistant resin soluble or decomposable in an acid or an oxidizing agent with an uncured resin. The dispersion of the cured particles of the heat resistant resin in the organic solvent is obtained by dispersing cured particles formed in the production of heat resistant resin cured particles into the organic solvent without drying, and the uncured resin is a resin becoming hardly soluble in an acid or an oxidizing agent through curing treatment and capable of forming a heat resistant cured resin.

Abstract translation: 可以制造无电镀用粘合剂，而不会引起粉尘爆炸，作为层间树脂绝缘层是优异的，并且通过将在酸或氧化剂中可溶或可分解的耐热树脂的固化颗粒的有机溶剂分散体与未固化的 树脂。 耐热树脂的固化颗粒在有机溶剂中的分散是通过将生产耐热树脂固化颗粒中形成的固化颗粒分散在有机溶剂中而不干燥而获得的，未固化树脂是难溶于 酸或氧化剂通过固化处理并能够形成耐热固化树脂。