公开(公告)号：US07189336B2

公开(公告)日：2007-03-13

申请号：US10393874

申请日：2003-03-21

Applicant: Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

Inventor： Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

IPC: C23F1/34

CPC classification number: H05K3/383 ,  C23F1/18 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/124

Abstract: An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.

Abstract translation: 一种蚀刻剂和一种使铜表面粗糙化的方法，每个铜表面能够允许具有耐酸性的粗糙表面的铜，并且允许铜导电图案和外层材料在制造印刷线路板中彼此牢固地结合以简化 制造业。 蚀刻剂可以含有一种含氧酸如硫酸，过氧化物如过氧化氢和辅助成分如唑和氯。 唑可以包括苯并三唑（BTA）。 氯可以是氯化钠（NaCl）的形式。 蚀刻剂允许铜表面以针状方式粗糙化。

公开(公告)号：US06544436B2

公开(公告)日：2003-04-08

申请号：US08901700

申请日：1997-07-28

Applicant: Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

Inventor： Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

IPC: C09K1306

CPC classification number: H05K3/383 ,  C23F1/18 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/124

Abstract: An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.

公开(公告)号：US06902626B2

公开(公告)日：2005-06-07

申请号：US10696486

申请日：2003-10-29

Applicant: Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

Inventor： Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

IPC: H05K3/06 ,  A62C2/00 ,  A62D1/00 ,  B41N3/03 ,  C23F1/14 ,  C23F1/18 ,  C23G1/00 ,  H05K3/38 ,  H05K3/46

CPC classification number: B41N3/03 ,  C23F1/18 ,  H05K3/383 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.

Abstract translation: 能够提供具有粗糙表面的铜的铜表面的粗糙化的液体蚀刻剂和粗糙化方法在短时间内与氯离子无关地增加耐酸性，从而确保铜导电图案和外层之间的牢固粘合 在制造印刷电路板期间的材料，导致制造被高度简化。 液体蚀刻剂包括含有氧酸如硫酸和过氧化氢如过氧化氢的主要成分。 此外，液体蚀刻剂包括含有四唑的辅助成分，例如5-氨基四唑等，或1,2,3,4-唑。 液体蚀刻剂允许铜表面以针状方式粗糙化。

公开(公告)号：US06666987B1

公开(公告)日：2003-12-23

申请号：US09327800

申请日：1999-06-08

Applicant: Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

Inventor： Yoshihiko Morikawa ,  Kazunori Senbiki ,  Nobuhiro Yamazaki

IPC: C09K1306

CPC classification number: B41N3/03 ,  C23F1/18 ,  H05K3/383 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.

Abstract translation: 能够提供具有粗糙表面的铜的铜表面的粗糙化的液体蚀刻剂和粗糙化方法在短时间内与氯离子无关地增加耐酸性，从而确保铜导电图案和外层之间的牢固粘合 在制造印刷电路板期间的材料，导致制造被高度简化。 液体蚀刻剂包括含有氧酸如硫酸和过氧化氢如过氧化氢的主要成分。 此外，液体蚀刻剂包括含有四唑的辅助成分，例如5-氨基四唑等，或1,2,3,4-唑。 液体蚀刻剂允许铜表面以针状方式粗糙化。