Abstract:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
Abstract:
A semiconductor memory device of folded bit line structure includes a cross portion in at least one portion of each bit line pair so that values of coupling capacitance with adjacent bit line pairs are equal to each other with respect to the paired bit lines. Preferably, the respective bit line pairs are equally divided into 4N (N being an integer), although advantages of the invention may be obtained with division of the bit lines into 3N, and the cross parts are provided at dividing points so that bit line pairs having the cross parts at the same dividing points are arranged on alternate pairs of bit lines. In a preferred embodiment, the cross parts are provided in regions for forming restore circuits or sense amplifiers. In a further embodiment, a dummy word line for selecting dummy cells for providing a reference potential is selected according to the position of a selected word line.
Abstract:
A semiconductor memory device comprises a plurality of bit line pairs and an input/output line pair. Each bit line pair comprises first and second bit lines supplied with complementary data, and the input/output line pair comprises first and second input/output lines supplied with complementary data. A switching circuit is provided on each bit line pair. Each switching circuit, in response to a control signal according to an address signal, respectively couples the first and the second bit lines to the first and the second input/output lines, or inversely, respectively couples the first and the second bit lines to the second and the first input/output lines.
Abstract:
A semiconductor memory includes a memory cell array having a plurality of bit lines and a plurality of word lines arranged intersecting with the bit lines. A plurality of memory cells are arranged at intersections of the bit lines and the word lines, respectively. Word line selecting circuitry selects one of the word lines responsive to a row address and reads out to each of the bit lines information stored in the memory cell associated with the selected word line. A plurality of sense amplifiers are associated with corresponding rows of the memory for detecting and amplifying the information stored in respective memory cells. A first column selector circuit selects the sense amplifiers corresponding to a column address when the column address is applied and reads information held in the sense amplifier. Blocks are formed by dividing the memory cell array into groups of bit lines, each of the groups comprising a predetermined number of bit lines with block information transferred simultaneously from corresponding ones of the groups of bit lines of a selected block when the column address corresponding to the selected block is applied. Data registers hold information of an associated block. A second column selector reads data corresponding to the column address from the data register when the column address is applied.
Abstract:
A dynamic random access memory device having common signal lines to transmit row address signals and column address signals, uses change-over switches to transfer those signals to a row decoder. Voltage suppression circuitry limits high voltage applied to decoupling transistors provided at decoder outputs. An MOS transistor used as a voltage suppression device between the decoupling transistor and a word line activating transistor transfers word line activating signals.
Abstract:
A MOS dynamic type RAM comprises memory cells (10), dummy cells (11), bit line pairs (BL, BL), word lines (WL), dummy word lines (DWL) and sense amplifiers (12). In a non-active cycle, the potentials of each pair of bit lines (BL, BL) are precharged at 1/2 of a supply potential V.sub.CC. Each sense amplifier (12) operates in an active cycle following the non-active cycle, while each active pull-up circuit (13) pulls up the potential of a higher level one of the pair of bit lines to V.sub.CC. This active cycle is defined by an internal RAS internal signal, which is generated by a NAND circuit (27) in response to an external RAS signal and an RPW signal obtained by delaying the external RAS signal by a delay circuit (20) and having a trailing edge obtained by delaying the trailing edge of the external RAS signal by a prescribed period.
Abstract:
A dummy word line driving circuit for a MOS dynamic RAM comprises a dummy word line controller connected to each end of a pair of dummy word lines. A sub-decode signal which is opposite to the one inputted to a dummy word driver and a dummy set signal for writing a bit line information into a not-selected dummy cell are inputted to the dummy word line controller. Means for applying a dummy equalizing signal is connected to two full-sized dummy cells, for equalizing the two before the dummy word line is driven. The two full-sized dummy cells are equalized by the signal, resulting in a charge amount, which is to be a reference value, of a half of a full-sized memory cell.
Abstract:
A first precharging and equalizing circuit (7) precharges and equalizes I/O buses (10 and 10') in advance to selection of bit lines, and following thereto, a second precharging and equalizing circuit (12) precharges and equalizes the I/O buses (10 and 10') during driving operation of a sense amplifier (2). Thus, potential levels of the I/O Buses (10 and 10') are prevented from being changed by vibration of the output level of the sense amplifier (2) transmitted to the I/O buses (10 and 10') through parasitic capacitance (8) during driving operation of the sense amplifier (2).
Abstract:
A dynamic memory device including 1-transistor, 1-capacitor type dynamic memory cell, wherein a half voltage of the writing voltage is applied to a cell plate, and a constant voltage is applied to the substrate.
Abstract:
When any one of memory cells (MC.sub.1R, MC.sub.NR and MC.sub.1L, MC.sub.NL) connected with respective bit lines (3.sub.R, 4.sub.R and 3.sub.L, 4.sub.L) is addressed, the gate potential of a transfer transistor group (7.sub.R, 8.sub.R or 7.sub.L, 8.sub.L) connected with the bit lines on the non-selected side is clamped at bit line precharge voltage, whereby the said transfer transistor group (7.sub.R, 8.sub.R or 7.sub.L, 7.sub.L) is turned off. Thus, the bit lines on the non-selected side are cut off at a high speed from a sense amplifier.