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公开(公告)号：US20210134689A1
公开(公告)日：2021-05-06
申请号：US17146304
申请日：2021-01-11
发明人： Shaowu Huang , Javier A. DeLaCruz , Liang Wang , Rajesh Katkar , Belgacem Haba
摘要： An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
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公开(公告)号：US20210098412A1
公开(公告)日：2021-04-01
申请号：US16874527
申请日：2020-05-14
发明人： Belgacem Haba , Laura Wills Mirkarimi , Javier A. DeLaCruz , Rajesh Katkar , Cyprian Emeka Uzoh , Guilian Gao , Thomas Workman
摘要： A bonded structure can comprise a first element and a second element. The first element has a first dielectric layer including a first bonding surface and at least one first side surface of the first element. The second element has a second dielectric layer including a second bonding surface and at least one second side surface of the second element. The second bonding surface of the second element is directly bonded to the first bonding surface of the first element without an adhesive.
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公开(公告)号：US10964664B2
公开(公告)日：2021-03-30
申请号：US16386261
申请日：2019-04-17
IPC分类号： H01L21/683 , H01L21/02 , H01L21/78 , H01L21/762 , H01L23/00
摘要： Devices and techniques include process steps for preparing various microelectronic components for bonding, such as for direct bonding without adhesive. The processes include providing a first bonding surface on a first surface of the microelectronic components, bonding a handle to the prepared first bonding surface, and processing a second surface of the microelectronic components while the microelectronic components are gripped at the handle. In some embodiments, the processes include removing the handle from the first bonding surface, and directly bonding the microelectronic components at the first bonding surface to other microelectronic components.
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公开(公告)号：US10796936B2
公开(公告)日：2020-10-06
申请号：US15806822
申请日：2017-11-08
发明人： Cyprian Emeka Uzoh
IPC分类号： H01L21/00 , H01L21/673 , H01L21/02 , H01L23/00 , H01L25/065 , H01L25/00
摘要： Representative implementations of devices and techniques provide a device and a technique for processing integrated circuit (IC) dies. The device comprises a die tray (such as a pick and place tray, for example) for holding the dies during processing. The die tray may include an array of pockets sized to hold individual dies. The technique can include loading dies on the die tray, cleaning the top and bottom surfaces of the dies, and ashing and activating both surfaces of the dies while on the die tray, eliminating the need to turn the dies over during processing.
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公开(公告)号：US10727219B2
公开(公告)日：2020-07-28
申请号：US16262489
申请日：2019-01-30
IPC分类号： H01L21/00 , H01L25/00 , H01L25/065 , H01L23/00 , H01L21/78 , H01L21/683 , H01L21/18
摘要： Representative techniques provide process steps for forming a microelectronic assembly, including preparing microelectronic components such as dies, wafers, substrates, and the like, for bonding. One or more surfaces of the microelectronic components are formed and prepared as bonding surfaces. The microelectronic components are stacked and bonded without adhesive at the prepared bonding surfaces.
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公开(公告)号：US10714449B2
公开(公告)日：2020-07-14
申请号：US16515588
申请日：2019-07-18
发明人： Cyprian Emeka Uzoh
IPC分类号： H01L23/00 , H01L21/67 , H01L23/48 , H01L25/065 , H01L21/683 , H01L21/78 , H01L25/00
摘要： Representative implementations provide techniques and systems for processing integrated circuit (IC) dies. Dies being prepared for intimate surface bonding (to other dies, to substrates, to another surface, etc.) may be processed with a minimum of handling, to prevent contamination of the surfaces or the edges of the dies. The techniques include processing dies while the dies are on a dicing sheet or other device processing film or surface. Systems include integrated cleaning components arranged to perform multiple cleaning processes simultaneously.
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87.发明申请公开(公告)号：US20200075520A1
公开(公告)日：2020-03-05
申请号：US16553535
申请日：2019-08-28
发明人： Guilian GAO , Javier A. DELACRUZ , Shaowu HUANG , Liang WANG , Gaius Gillman FOUNTAIN, JR. , Rajesh KATKAR , Cyprian Emeka UZOH
IPC分类号： H01L23/00
摘要： Structures and techniques provide bond enhancement in microelectronics by trapping contaminants and byproducts during bonding processes, and arresting cracks. Example bonding surfaces are provided with recesses, sinks, traps, or cavities to capture small particles and gaseous byproducts of bonding that would otherwise create detrimental voids between microscale surfaces being joined, and to arrest cracks. Such random voids would compromise bond integrity and electrical conductivity of interconnects being bonded. In example systems, a predesigned recess space or predesigned pattern of recesses placed in the bonding interface captures particles and gases, reducing the formation of random voids, thereby improving and protecting the bond as it forms. The recess space or pattern of recesses may be placed where particles collect on the bonding surface, through example methods of determining where mobilized particles move during bond wave propagation. A recess may be repeated in a stepped reticule pattern at the wafer level, for example, or placed by an aligner or alignment process.
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公开(公告)号：US20200043910A1
公开(公告)日：2020-02-06
申请号：US16599744
申请日：2019-10-11
摘要： Systems and methods for efficient transfer of elements are disclosed. A film which supports a plurality of diced integrated device dies can be provided. The plurality of diced integrated device dies can be disposed adjacent one another along a surface of the film. The film can be positioned adjacent the support structure such that the surface of the film faces a support surface of the support structure. The film can be selectively positioned laterally relative to the support structure such that a selected first die is aligned with a first location of the support structure. A force can be applied in a direction nonparallel to the surface of the film to cause the selected first die to be directly transferred from the film to the support structure.
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公开(公告)号：US20200013754A1
公开(公告)日：2020-01-09
申请号：US16460068
申请日：2019-07-02
IPC分类号： H01L25/065 , H01L21/768 , H01L23/00 , H01L23/538
摘要： Dies and/or wafers are stacked and bonded in various arrangements including stacks, and may be covered with a molding to facilitate handling, packaging, and the like. In various examples, the molding may cover more or less of a stack, to facilitate connectivity with the devices of the stack, to enhance thermal management, and so forth.
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公开(公告)号：US10508030B2
公开(公告)日：2019-12-17
申请号：US15920759
申请日：2018-03-14
发明人： Rajesh Katkar , Liang Wang , Cyprian Emeka Uzoh , Shaowu Huang , Guilian Gao , Ilyas Mohammed
摘要： Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
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