发明申请
- 专利标题： CAVITY PACKAGES
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申请号： US17146304申请日： 2021-01-11
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公开(公告)号： US20210134689A1公开(公告)日： 2021-05-06
- 发明人: Shaowu Huang , Javier A. DeLaCruz , Liang Wang , Rajesh Katkar , Belgacem Haba
- 申请人： Invensas Bonding Technologies, Inc.
- 申请人地址： US CA San Jose
- 专利权人： Invensas Bonding Technologies, Inc.
- 当前专利权人： Invensas Bonding Technologies, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/66 ; H01L23/04
摘要：
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
公开/授权文献
- US11600542B2 Cavity packages 公开/授权日：2023-03-07
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