公开(公告)号：US11165131B2

公开(公告)日：2021-11-02

申请号：US16838664

申请日：2020-04-02

申请人： Motorola Mobility LLC

发明人： Wei Xin ,  Martin Rabindra Pais ,  MD Rashidul Islam

IPC分类号： H03M1/48 ,  H01Q1/02 ,  F28F3/00 ,  F28F21/00 ,  H01Q1/48 ,  H05K5/02 ,  H01Q1/24 ,  H05K7/20

摘要： Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.

公开(公告)号：US20200165502A1

公开(公告)日：2020-05-28

申请号：US16304132

申请日：2017-06-05

申请人： IBIDEN CO., LTD.

发明人： Yoshihiro KOGA

IPC分类号： C09K5/14 ,  C04B38/00 ,  C04B35/565 ,  C04B35/515 ,  F28F21/00

摘要： A honeycomb structure includes a tubular circumferential wall and partition walls forming a honeycomb-shaped cross-section and defining a plurality of cells extending inside the circumferential wall in an axial direction of the circumferential wall. The partition walls are constructed by a frame portion, formed by a plurality of ceramic particles arranged in a shape corresponding to the partition walls, and a filling portion, formed by metal silicon filling a gap between ceramic particles in the frame portion. The frame portion is maintained in a shape corresponding to the partition walls by the filling portion.

公开(公告)号：US10352632B2

公开(公告)日：2019-07-16

申请号：US15166079

申请日：2016-05-26

申请人： Theresa H. Suloway ,  Sameh S. Wanis

发明人： Theresa H. Suloway ,  Sameh S. Wanis

IPC分类号： F28F13/16 ,  F28F21/00 ,  F28F7/00 ,  F28F13/10 ,  F28F27/00 ,  F28D21/00 ,  B64D33/04

摘要： A system includes a matrix material to remove heat from an object. The matrix material includes a plurality of vascular structures. Each of the vascular structures are filled with a fluid. At least one transducer generates field-induced forces into the fluid within the vascular structures of the matrix material. At least one controller pulses the transducer to generate the field-induced forces into the fluid within the vascular structures. The field-induced forces generate fluid flow within the vascular structures to remove the heat from the object.

公开(公告)号：US10234217B2

公开(公告)日：2019-03-19

申请号：US14895482

申请日：2014-01-28

申请人： LUO YANG RUICHANG PETRO-CHEMICAL EQUIPMENT CO., LTD.

发明人： Song Shao ,  Feng Lv ,  Juyuan Tang ,  Guohui Shao

IPC分类号： F28F19/00 ,  F28F19/02 ,  F28F21/04 ,  F28D9/00 ,  F28F21/00

摘要： Provided are a nonmetal corrosion-resistant heat exchange device (20) and a plate-type heat exchanger (100) having same. The heat exchange device (20) comprises a plurality of nonmetal corrosion-resistant heat exchange sheets (21), upper support ribs (22) and lower support ribs (23) installed on top and bottom surfaces of each heat exchange sheet (21), sealing strips (25) disposed at the upper and lower edges at each side of the heat exchange sheets (21), and spacers (26). The adjacent upper support ribs (22) and the lower support ribs (23) located between the adjacent heat exchange sheets (21) together define multiple sealing channels for cold fluid and hot fluid. The spacers (26) completely seal the upper support ribs (22), the lower support ribs (23) and the sealing strips (25) via a press force.

公开(公告)号：US10041747B2

公开(公告)日：2018-08-07

申请号：US12888306

申请日：2010-09-22

申请人： Robert C. Hon ,  Lowell A. Bellis

发明人： Robert C. Hon ,  Lowell A. Bellis

IPC分类号： F25J1/00 ,  F28F21/00 ,  F28F7/02 ,  F25B9/14

摘要： A heat exchanger includes a glass body having a first flat face and a second flat face on opposing ends, and defining a longitudinal axis therebetween. A plurality of holes in the glass body are elongated along the longitudinal axis by extending from said first flat face to said second flat face. The plurality of holes are configured to receive and direct a gas therethrough, to exchange heat between the gas and the glass body.

公开(公告)号：US09986663B2

公开(公告)日：2018-05-29

申请号：US14763993

申请日：2014-01-29

申请人： The United States of America, as represented by the Secretary of the Navy

发明人： David A. Broido ,  Thomas L. Reinecke ,  Lucas R. Lindsay

IPC分类号： H05K7/20 ,  F28F21/00 ,  H01L23/373 ,  F16D69/00 ,  F16D69/02 ,  F16D66/00

CPC分类号： H05K7/20481 ,  F16D69/00 ,  F16D69/02 ,  F16D2066/001 ,  F16D2200/0047 ,  F28F21/00 ,  H01L23/3731 ,  H01L23/3738 ,  H01L2924/0002 ,  H05K7/20509 ,  H01L2924/00

摘要： High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.

公开(公告)号：US09835390B2

公开(公告)日：2017-12-05

申请号：US13694791

申请日：2013-01-07

申请人： Aruna Zhamu ,  Mingchao Wang ,  Wei Xiong ,  Bor Z. Jang ,  Lin Yi-jun

发明人： Aruna Zhamu ,  Mingchao Wang ,  Wei Xiong ,  Bor Z. Jang ,  Lin Yi-jun

IPC分类号： F28F21/02 ,  C09K5/14 ,  F28F21/00 ,  F28D21/00

CPC分类号： F28F21/02 ,  C09K5/14 ,  F28D2021/0029 ,  F28F21/00

摘要： A unitary graphene-based integrated heat sink comprising a heat collection member (base) and at least one heat dissipation member (e.g. fins) integral to the baser, wherein the base is configured to be in thermal contact with a heat source, collects heat therefrom, and dissipates heat through the fins. The unitary graphene material is obtained from heat-treating a graphene oxide gel at a temperature higher than 100° C., 500° C., 1,250° C., or 2,000° C., and contains chemically bonded graphene molecules having inter-graphene distance of 0.3354-0.4 nm (preferably mm or cm), exhibiting a degree of graphitization preferably from 1% to 100% and a Mosaic spread value less than 0.7 (preferably no greater than 0.4). The finned heat sink may also be made from a filler-reinforced graphene matrix composite.

公开(公告)号：US09670622B2

公开(公告)日：2017-06-06

申请号：US15066933

申请日：2016-03-10

申请人： ASAHI KASEI FIBERS CORPORATION

发明人： Hirofumi Ono ,  Shuji Takasu ,  Atsushi Horii ,  Satoru Yoshida

IPC分类号： D21H27/38 ,  D21H27/30 ,  B32B29/02 ,  F28F3/00 ,  D21H11/18 ,  D21H13/08 ,  D21H13/14 ,  D21H13/24 ,  D21H13/26 ,  D21H15/02 ,  F28F21/00 ,  F24F12/00 ,  F28D9/00 ,  F28D21/00 ,  B32B5/02 ,  B32B5/22 ,  B32B5/24 ,  B32B5/26 ,  B32B29/00 ,  B32B37/24 ,  D21H11/12 ,  D21H21/16 ,  D21H21/34

CPC分类号： D21H27/38 ,  B32B5/022 ,  B32B5/22 ,  B32B5/24 ,  B32B5/26 ,  B32B29/002 ,  B32B29/02 ,  B32B37/24 ,  B32B2255/02 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2307/3065 ,  B32B2307/72 ,  B32B2307/7242 ,  B32B2307/728 ,  B32B2307/73 ,  B32B2419/00 ,  D21H11/12 ,  D21H11/18 ,  D21H13/08 ,  D21H13/14 ,  D21H13/24 ,  D21H13/26 ,  D21H15/02 ,  D21H21/16 ,  D21H21/34 ,  D21H27/30 ,  F24F12/006 ,  F28D9/00 ,  F28D21/0014 ,  F28D21/0015 ,  F28F3/00 ,  F28F21/00 ,  Y02B30/563 ,  Y02P70/24

摘要： Provided is a multilayered structure comprising at least one fine cellulose fiber nonwoven fabric layer made of a fine cellulose fiber, wherein the multilayered structure is characterized in that the mean fiber diameter of the fine cellulose fiber forming the fine cellulose fiber non-woven fabric layer is 0.005 to 0.5 μm, and the mean thickness of the multilayered structure is 10 to 200 μm, the density thereof is 0.10 to 0.90 g/cm3, and the permeability resistance thereof is 2000 s/100 ml or more. Also provided are an energy recovery ventilation sheet made of this multilayered structure, an energy recovery ventilation element using this energy recovery ventilation sheet as a partitioning material for partitioning two types of air flow of different temperature and/or humidity, and a energy recovery ventilator using this energy recovery ventilation element.

公开(公告)号：US20170141008A1

公开(公告)日：2017-05-18

申请号：US14942281

申请日：2015-11-16

申请人： Intel Corporation

发明人： Aravindha R. Antoniswamy ,  Thomas J. Fitzgerald

IPC分类号： H01L23/367 ,  H01L23/373 ,  B22D31/00 ,  F28F21/00 ,  B23K26/362 ,  B22D19/00 ,  H01L23/00 ,  H01L21/48

CPC分类号： H01L23/3675 ,  B22D19/00 ,  B22D19/04 ,  B22D31/00 ,  B23K26/362 ,  F28F3/02 ,  F28F21/00 ,  F28F21/08 ,  H01L21/4882 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3736 ,  H01L24/83

摘要： Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

公开(公告)号：US09329646B2

公开(公告)日：2016-05-03

申请号：US14221171

申请日：2014-03-20

申请人： QUALCOMM Incorporated

发明人： Victor Adrian Chiriac ,  Youmin Yu ,  Dexter Tamio Chun ,  Stephen Arthur Molloy

IPC分类号： G06F1/20 ,  F28F21/00 ,  H05K7/20

CPC分类号： G06F1/20 ,  F28F21/00 ,  H05K7/20445

摘要： Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

摘要翻译： 一些实施方案提供了一种多层散热装置，其包括第一散热器层，第一支撑结构和第二散热器层。 第一散热器层包括第一撒布机表面和第二撒布机表面。 第一支撑结构包括第一支撑表面和第二支撑表面。 第一支撑结构的第一支撑表面联接到第一散热器的第二扩张器表面。 第二散热器层包括第三扩散器表面和第四扩散器表面。 第二散热器层的第三扩散器表面联接到第一支撑结构的第二支撑表面。 在一些实施方案中，第一支撑结构是导热粘合剂层。 在一些实施方案中，第一散热器层具有第一导热性，并且第一支撑结构具有第二导热性。