公开(公告)号：US20030070837A1

公开(公告)日：2003-04-17

申请号：US10263185

申请日：2002-10-03

Inventor： Mitsutoshi Okami

IPC: H05K001/16

CPC classification number: H05K3/445 ,  H05K1/0219 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/043 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10371

Abstract: A transmitter includes an RF board having a circuit for processing high frequency signals, an IF board having a circuit for processing intermediate frequency signals, a shield plate formed of a conductive material arranged between the boards for shielding electromagnetic waves generated from the circuits, a board-to-board connecting wire inserted to a through hole based by a gap sufficient to avoid electric influence from an inner wall surface of the through hole provided in the shield plate, to be connected to through hole lands provided on the RF board and a IF board, respectively, and connectors formed of an insulating material and attached near opposite ends of the board-to-board connecting wire and sandwiching the shield plate, for fixing the board-to-board connecting wire to the shield plate. This provides a wiring connection structure that facilitates connection between circuit boards with each other and stably realizes normal signal transmission.

Abstract translation: 发射机包括具有用于处理高频信号的电路的RF板，具有用于处理中频信号的电路的IF板，由布置在板之间的导电材料形成的屏蔽板，用于屏蔽从电路产生的电磁波;板 基板连接线以足够的间隙插入到通孔中，该间隙足以避免来自设在屏蔽板上的通孔的内壁表面的电力影响，以连接到设置在RF板上的通孔焊盘和IF 以及由绝缘材料形成并且连接在板对板连接线的相对端并夹持屏蔽板的连接器，用于将板对板连接线固定到屏蔽板。 这提供了一种有助于电路板彼此连接并且稳定地实现正常信号传输的布线连接结构。

公开(公告)号：US3395318A

公开(公告)日：1968-07-30

申请号：US61572967

申请日：1967-02-13

Applicant: GEN PRECISION INC

Inventor： LOTHAR LAERMER ,  PRETTY ARTHUR J ,  PHILIP GRAY

IPC: H01L23/373 ,  H01L23/60 ,  H01L23/64 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/38

CPC classification number: H01L23/60 ,  H01L23/3735 ,  H01L23/642 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10553 ,  H05K2201/10689 ,  H01L2924/00

公开(公告)号：US09997504B2

公开(公告)日：2018-06-12

申请号：US15075824

申请日：2016-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Jong In Ryu ,  Sung Ho Kim ,  Jin Su Kim

IPC: H05K1/11 ,  H01L25/16 ,  H01L23/498 ,  H01L21/78 ,  H05K1/14 ,  H01L21/56 ,  H01R12/50 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01R23/68 ,  H01R23/6886 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/049 ,  H01L2924/014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099

Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

公开(公告)号：US20180107251A1

公开(公告)日：2018-04-19

申请号：US15794221

申请日：2017-10-26

Applicant: Google LLC

Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

IPC: G06F1/16 ,  H04M1/02 ,  H04W88/02 ,  H05K1/14

CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

公开(公告)号：US20170285666A1

公开(公告)日：2017-10-05

申请号：US15462417

申请日：2017-03-17

Applicant: HORIBA STEC, Co., Ltd.

Inventor： Katsuya Ohtani

IPC: G05D7/06 ,  H01R12/71 ,  H05K1/14 ,  H01R12/75 ,  H05K5/00 ,  H05K1/18

CPC classification number: H05K1/141 ,  H01R12/712 ,  H01R12/716 ,  H01R12/732 ,  H01R23/68 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/145 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K2201/10287 ,  Y02P70/611

Abstract: A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.

公开(公告)号：US20160174377A1

公开(公告)日：2016-06-16

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： SENG HUAN CHUAH ,  FRIEDRICH JOSEF BOLLMANN ,  KHAI JIN CHOO ,  WENG KONG HOR ,  SIH HAU TAN

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

Abstract translation: 用于本质安全的便携式设备的方法和电路板装置包括两个或更多个具有围绕电路板之间的空间形成连续边界的框架结构的电路板。 在这个空间中，有两个电路板上安装的电路元件和连接两个电路板的连接器。 密封剂材料填充由电路板之间的框架结构限定的空间，以排除空气传播材料与封装的电路部件接触。

公开(公告)号：US20150288390A1

公开(公告)日：2015-10-08

申请号：US14664954

申请日：2015-03-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MAKI NAKAMURA ,  SUGURU FUJITA

IPC: H04B1/03

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/043 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10098 ,  H05K2201/10734 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/4913

Abstract: There is provided a radio module including: a first substrate; a second substrate that has a side which is opposed to the first substrate and on which an electronic component is mounted; a conductive member that connects the first substrate and the second substrate and that transmits a signal between the first substrate and the second; at least one first pad that is disposed in the first substrate and connected to the conductive member; and at least one second pad that is disposed in the second substrate and connected to the conductive member, each of the at least one second pad being opposed to each of the at least one first pad and each of larger than the at least one first pad in area.

Abstract translation: 提供了一种无线电模块，包括：第一基板; 第二基板，其具有与第一基板相对的一侧，并且安装有电子部件; 导电构件，其连接所述第一基板和所述第二基板，并且在所述第一基板和所述第二基板之间传递信号; 至少一个第一衬垫，其设置在所述第一衬底中并连接到所述导电构件; 以及至少一个第二垫，其设置在所述第二基板中并连接到所述导电构件，所述至少一个第二垫中的每一个与所述至少一个第一垫中的每一个相对，并且每个第二垫大于所述至少一个第一垫 在区域。

公开(公告)号：US20150237733A1

公开(公告)日：2015-08-20

申请号：US14700204

申请日：2015-04-30

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

Abstract translation: 一种印刷电路板，具有由多个相互连接的层或层构成的两个完整的印刷电路板元件，其中至少一个印刷电路板元件具有切口或凹陷，所述切口或凹陷包含待集成在其中一个印刷电路板元件上的部件或 在所述至少一个印刷电路板元件的切口中，并且所述印刷电路板元件与容纳在所述切口中的所述部件连接，由此可以获得所述部件在所述印刷电路板元件中的可靠和可靠的容纳 电路板。 此外，这种印刷电路板还包含集成在其中的电子部件。

公开(公告)号：US20120006478A1

公开(公告)日：2012-01-12

申请号：US12878586

申请日：2010-09-09

Applicant: SHANG-LIN SUNG ,  SHIH-CHIEHMR CHANG ,  CHAO-SHENG CHIU ,  CHIN-CHENG LEE

Inventor： SHANG-LIN SUNG ,  SHIH-CHIEHMR CHANG ,  CHAO-SHENG CHIU ,  CHIN-CHENG LEE

IPC: B32B38/10 ,  B32B38/04

CPC classification number: B32B37/02 ,  B32B38/06 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/427 ,  H05K2201/043 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A fabricating method of a circuit board including the following steps. First, a liquid material is adhered between a first substrate and a second substrate by using an atmospheric pressure difference. Then, a plurality of conductive columns are formed in the first substrate and the second substrate. Next, a patterning process is performed, so as to form two circuit layers. Next, two lamination structures are formed respectively on the circuit layers. Then, the first substrate and the second substrate are separated. Finally, another patterning process is performed, so as to finish the fabrication of the circuit board.

Abstract translation: 一种电路板的制造方法，包括以下步骤。 首先，通过使用大气压力差，将液体材料粘附在第一基板和第二基板之间。 然后，在第一基板和第二基板中形成多个导电柱。 接下来，进行图案化处理，以形成两个电路层。 接下来，在电路层上分别形成两层叠结构。 然后，分离第一基板和第二基板。 最后，进行另一图案化处理，以完成电路板的制造。

公开(公告)号：US20110139329A1

公开(公告)日：2011-06-16

申请号：US12931015

申请日：2011-01-21

Applicant: James E. Clayton ,  Zekeryae Fethi

Inventor： James E. Clayton ,  Zekeryae Fethi

IPC: H01B13/00

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

Abstract translation: 柔性电路包括在其表面上具有导电图案的折叠电介质片，微电子器件连接到该表面上。 电介质片材围绕所选择的轴线折叠180°，并且接合层将它们的相应表面区域的一部分连接在一半上，使得其区域的剩余部分保持未粘合，并由此形成分叉结构。 电触点设置在柔性片的未粘合或分叉部分上。 柔性件可以附接到刚性框架并设置有保护性散热盖。 折叠的柔性设计特别适用于卷对卷制造。