公开(公告)号：US20160040870A1

公开(公告)日：2016-02-11

申请号：US14455053

申请日：2014-08-08

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： WOOI PING TEOH ,  PENG KHOON CHEAH ,  WENG KONG HOR ,  SOH PENG LIM ,  LEE SUN OOI ,  WEI LING THAM

IPC: F21V33/00 ,  F21V23/04 ,  F21V11/14 ,  F21V15/01 ,  F21K99/00

CPC classification number: F21V33/0056 ,  F21K9/65 ,  F21V11/14 ,  F21V15/01 ,  F21V23/0464 ,  F21W2111/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H04B17/23 ,  H04M1/0266

Abstract: A light emitting diode (LED) display assembly is formed of a translucent plastic housing, a light diffuser film coupled to the translucent plastic housing, a light barrier gasket coupled to the diffuser film, and an LED module coupled to the light barrier gasket. The LED module comprises a plurality LEDs individually controlled for generating a light source to form a graphic on the surface of the translucent plastic housing.

Abstract translation: 发光二极管（LED）显示组件由半透明塑料壳体，耦合到半透明塑料壳体的光漫射膜，耦合到漫射膜的光阻垫圈和耦合到光阻挡垫圈的LED模块形成。 LED模块包括单独控制的多个LED，用于产生光源以在半透明塑料外壳的表面上形成图形。

公开(公告)号：US20160174377A1

公开(公告)日：2016-06-16

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： SENG HUAN CHUAH ,  FRIEDRICH JOSEF BOLLMANN ,  KHAI JIN CHOO ,  WENG KONG HOR ,  SIH HAU TAN

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

Abstract translation: 用于本质安全的便携式设备的方法和电路板装置包括两个或更多个具有围绕电路板之间的空间形成连续边界的框架结构的电路板。 在这个空间中，有两个电路板上安装的电路元件和连接两个电路板的连接器。 密封剂材料填充由电路板之间的框架结构限定的空间，以排除空气传播材料与封装的电路部件接触。

公开(公告)号：US20160111233A1

公开(公告)日：2016-04-21

申请号：US14519828

申请日：2014-10-21

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： WOOI PING TEOH ,  WENG KONG HOR ,  WENG WAI KOH ,  LEE SUN OOI

IPC: H01H15/10 ,  H01H15/04 ,  H01H15/00

CPC classification number: H01H15/04 ,  H01H15/005 ,  H01H15/102

Abstract: A slide actuation apparatus includes a bezel configured to maintain a configuration of the slide actuation apparatus. The bezel also includes an opening on an external surface. The slide actuation apparatus also includes an actuator configured to move within a compartment formed by the opening and a sliding rail configured to guide movements of the actuator along a surface of the sliding rail. The sliding rail is compressible downward in response to movement of the actuator along the surface of the sliding rail. The slide actuation apparatus further includes a slide contact configured to make an electrical connection to a flexible circuit and configured to provide a signal of a change to a circuit board of an attached computing device in response to downward compression of the sliding rail.

Abstract translation: 滑动致动装置包括被配置为保持滑动致动装置的构造的挡板。 表圈还包括外表面上的开口。 滑动致动装置还包括构造成在由开口形成的隔室内移动的致动器和被构造成引导致动器沿着滑轨的表面的运动的滑轨。 响应于致动器沿着滑轨的表面的移动，滑轨可向下压缩。 滑动致动装置还包括滑动接触件，其构造成与柔性电路形成电连接并且被配置为响应于滑轨的向下压缩而向连接的计算设备的电路板提供改变的信号。

公开(公告)号：US20150145384A1

公开(公告)日：2015-05-28

申请号：US14089035

申请日：2013-11-25

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： KIOK YUNG LEE ,  CHEE KIT CHAN ,  BOON AIK EEO ,  WENG KONG HOR ,  BAN HIN OOI ,  CLEMENT TOBIAS XAVIER PAKIAM

IPC: H04M1/02 ,  B29C45/14

CPC classification number: B29C45/14336 ,  B29C45/1418 ,  B29C45/16 ,  B29C2045/14459 ,  B29K2995/0012 ,  B29L2031/3437

Abstract: An enclosure includes a seal co-molded to a first material to form a sub-assembly in which the first material is securely adhered to the seal. The seal is designed to collapse in a specific direction during an injection molding process. The enclosure also includes a second material over-molded on the sub-assembly during the injection molding process. The seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming the bi-material enclosure. The first material and the second material are dissimilar materials with different thermal expansion qualities.

Abstract translation: 外壳包括与第一材料共模成型以形成子组件的密封件，其中第一材料牢固地粘附到密封件上。 密封件设计成在注射成型过程中沿特定方向塌缩。 外壳还包括在注射成型过程中在子组件上过模制的第二材料。 密封件在注射成型过程中沿特定方向被压缩，以至少在密封件和过模制的第二材料之间的一个期望的周边接头处产生一致的润湿，从而形成双材料外壳。 第一材料和第二材料是具有不同热膨胀性质的不同材料。