公开(公告)号：US20150145384A1

公开(公告)日：2015-05-28

申请号：US14089035

申请日：2013-11-25

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： KIOK YUNG LEE ,  CHEE KIT CHAN ,  BOON AIK EEO ,  WENG KONG HOR ,  BAN HIN OOI ,  CLEMENT TOBIAS XAVIER PAKIAM

IPC: H04M1/02 ,  B29C45/14

CPC classification number: B29C45/14336 ,  B29C45/1418 ,  B29C45/16 ,  B29C2045/14459 ,  B29K2995/0012 ,  B29L2031/3437

Abstract: An enclosure includes a seal co-molded to a first material to form a sub-assembly in which the first material is securely adhered to the seal. The seal is designed to collapse in a specific direction during an injection molding process. The enclosure also includes a second material over-molded on the sub-assembly during the injection molding process. The seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming the bi-material enclosure. The first material and the second material are dissimilar materials with different thermal expansion qualities.

Abstract translation: 外壳包括与第一材料共模成型以形成子组件的密封件，其中第一材料牢固地粘附到密封件上。 密封件设计成在注射成型过程中沿特定方向塌缩。 外壳还包括在注射成型过程中在子组件上过模制的第二材料。 密封件在注射成型过程中沿特定方向被压缩，以至少在密封件和过模制的第二材料之间的一个期望的周边接头处产生一致的润湿，从而形成双材料外壳。 第一材料和第二材料是具有不同热膨胀性质的不同材料。