Abstract:
A purge tube for protecting a boat(s) of wafers. This purge tube does not enter the furnace. A floating end cap within the tube moves to substantially seal the furance opening during processing. The floating end cap is withdrawn back to the closed end of the tube when the wafer boat(s) is withdrawn into the tube.
Abstract:
A controlled diffusion environment capsule system (10) is used with a conventional tubular high temperature furnace (12) as employed in semiconductor manufacturing. The system (10) includes a cantilever boat loading apparatus (14) and a quartz diffusion capsule (16). Wafer carriers (20) support semiconductor wafers (22) concentrically with capsule (16) in closely spaced relationship for processing in the furnace (12). The diffusion capsule (16) is supported on a pair of quartz rods (24). A quartz injector tube (28) extends the length of the diffusion capsule (16). The injector tube (28) has three rows of high aspect-ratio apertures (30) extending along its length to disperse nitrogen or other inert gas uniformly across the surfaces (32) of the wafers (22). A quartz extender (34) is connected to the distal end of the diffusion capsule (16), through which reactant gases are supplied to the capsule (16) for diffusion and/or oxidation, from an inlet source (35) of the reactant gases on the furnace tube near the extender (34). The extender (34) has two apertured baffle plates (36) and (38) which have holes (40) and (42) in patterns that are offset relative to one another. A third plate (44) has a larger hole (46) at its center. The hole (46) focuses reactant gases into the capsule and the holes (40) and (42) provide turbulence to the reactant gas stream prior to its entry into the capsule (16) to assure uniform mixing.
Abstract:
Method for doping semiconductor material, including a container into which doping material is led and aimed at the semiconductor material by means of an electrical field, which includes maintaining the doping material in a plasma in the container, and leading doping material ions into the semiconductor material by means of the electrical field, and an apparatus for carrying out the method.
Abstract:
A diffusion apparatus, particularly useful for diffusing aluminum into semiconductor wafers, comprises a quartz evaporation tube in combination with a restrictor plate which is inserted in an open end thereof. The restrictor plate preferably has substantially the same shape as, but a slightly smaller cross-section than, the evaporation tube. In practice, the relatively small gap between the restrictor plate and the evaporation tube results in a substantially negligible leak in the diffusion apparatus. As a result the apparatus effectively operates as if it were a sealed ampule while in fact it is open, i.e. not sealed.
Abstract:
Apparatus for effecting uniform and continuous mass transport reactions, such as oxidation, diffusion, etching, etc., between a gaseous phase reactant and semiconductor substrates. The apparatus comprises a longitudinal process tube, which includes a reaction zone flanked on either side by a combination entranceexhaust section and an exit-exhaust section. Reactant gas is provided to the reaction zone at a fixed flow rate and allowed to escape from the reaction zone axially through the two exhaust zones. Accurate isolation of the reaction zone is accomplished by passing additional gases into the entrance and exit zones at a rate sufficient to cause some gas to flow into the reaction zone where it is carried away through the exhaust zones by the axially flowing reacting gas.
Abstract:
A furnace for continuously processing elongated ribbons or webs of materials such as semiconductors, metals or glasses. Both ends of a tubular reaction chamber disposed in a heating system are provided with end caps which accommodate all gas inlet and outlet connections and which act as gas locks. A mixture of reactant and carrier gas enters the furnace through one end cap and leaves the furnace through the other. This furnace may be used for such chemical processes as diffusion, surface oxidation, etching, metallization and other pyrolytic processes.
Abstract:
A counter-flow of an inert, or a predominantly inert, gas is provided in a diffusion furnace to provide means for creating turbulence within the diffusion system thereby improving the uniformity of dopant along the length of the diffusion carrier contained therein.
Abstract:
A transition or isolation zone for accommodating continuous free flow of a tier of articles between two distinct and isolated atmospheres. The transition zone includes a series of alternate inlet and outlet compartments for a non-reactive gas wherein the compartments contain inlet and outlet openings interconnecting with each other and the indicated atmospheres. The cross sections of the openings are complementary to the cross section of the tier of articles to provide a restricted orifice-size clearance therebetween, whereby the orifice phenomena can be employed by correlation of pressures to control the flow of gas and conversely to substantially completely isolate the indicated atmospheres without any measurable cross-migration therebetween.
Abstract:
A diffusion tube is described which incorporates an internal seal to prevent the back diffusion of impurity material and the condensation thereof on the input portion of the tube. The tube is provided with an internal baffle plate which is urged into contact with a stop provided on the inner periphery of the tube. The baffle plate contains an aperture to permit the passage of gas therethrough from the input port of the tube. An impurity support is attached to the side of the baffle plate opposite the input port. The impurity source and the semiconductor wafers being processed are inserted in the same end of the diffusion tube. This end is relatively free from condensed impurity material at the completion of the diffusion process due to the combination of the shoulder and the baffle plate. As a result, the processed wafers can be withdrawn from the tube without significant surface contamination.
Abstract:
An atomic layer deposition apparatus includes a chamber including a plurality of regions; and a heating device respectively providing specific temperature ranges for the plurality of regions. By flowing precursor gases at different flow rates in the different regions, thin films can be simultaneously formed in the different regions having different film thicknesses.