公开(公告)号：US20180226530A1

公开(公告)日：2018-08-09

申请号：US15939636

申请日：2018-03-29

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16 ,  H01L31/167 ,  G01J1/02 ,  G01J1/04 ,  G01J1/06 ,  H01L31/0232 ,  H01L27/146 ,  H01L25/16 ,  G02B13/00 ,  G02B3/00 ,  G01J5/20 ,  G01J5/08 ,  G01J5/04 ,  G01J5/02 ,  G01J5/00 ,  G01J1/42 ,  B29D11/00

CPC classification number: H01L31/16 ,  B29D11/00298 ,  B29D11/00307 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/022 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/20 ,  G01J2001/061 ,  G02B3/0031 ,  G02B3/0056 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US09976894B2

公开(公告)日：2018-05-22

申请号：US15353397

申请日：2016-11-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/02 ,  G01J1/02 ,  H01L31/173

CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US20180073924A1

公开(公告)日：2018-03-15

申请号：US15558209

申请日：2016-02-12

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Lukas Steinmann ,  Hartmut Rudmann

IPC: G01J3/10 ,  G01J3/50

CPC classification number: G01J3/108 ,  G01J1/0204 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/0488 ,  G01J1/4204 ,  G01J1/4228 ,  G01J3/0208 ,  G01J3/0256 ,  G01J3/0291 ,  G01J3/36 ,  G01J3/50 ,  G01J3/505 ,  G01J3/513 ,  G01J2001/4247 ,  G01J2001/4266 ,  G01J2003/1213 ,  G01S7/4811 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/026

Abstract: Optoelectronic modules for proximity determination and ambient light sensing include hybrid optical assemblies configured with multiple field-of-views. The field of view in a region of the hybrid optical assembly can be dedicated to a first detector, while the field of views in another region of the hybrid optical assembly can be dedicated to both the emission of light and ambient light sensing. Embodiments relate particularly to implementation in a mobile phone or other portable electronic devices.

公开(公告)号：US20170309605A1

公开(公告)日：2017-10-26

申请号：US15626699

申请日：2017-06-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L25/16 ,  H01L25/075 ,  H01L27/146 ,  H01L33/58 ,  H01L23/544

CPC classification number: H01L25/167 ,  H01L23/544 ,  H01L25/0753 ,  H01L25/162 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L33/58 ,  H01L2223/54426 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

公开(公告)号：US09786820B2

公开(公告)日：2017-10-10

申请号：US14945505

申请日：2015-11-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Michel Barge

IPC: H01L29/18 ,  H01L33/48 ,  H01L25/16 ,  H01L27/146 ,  H01L31/0232 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/02327 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing a device (1) is suggested. The device comprises at least one opto-electronic module (1), and the method comprises creating a wafer stack (2) comprising a substrate wafer (PW), and an optics wafer (OW); wherein a multitude of active optical components (E) is mounted on the substrate wafer (PW), and the optics wafer (OW) comprises a multitude of passive optical components (L). Each of the opto-electronic modules (1) comprises at least one of the active optical components (E) and at least one of the passive optical components (L). The optics wafer (OW) can comprise at least one portion, referred to as blocking portion, which is at least substantially non-transparent for at least a specific wavelength range, and at least one other portion, referred to as transparent portion, which is at least substantially non-transparent for at least said specific wavelength range. 11. The opto-electronic module comprises a substrate member; an optics member; at least one active optical component mounted on said substrate member; and at least one passive optical component comprised in said optics member. The optics member (OW) is directly or indirectly fixed to said substrate member (PW). The opto-electronic modules (1) can have an excellent manufacturability while being small in dimension and having a high alignment accuracy.

公开(公告)号：US20170244490A1

公开(公告)日：2017-08-24

申请号：US15504613

申请日：2015-08-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Bassam Hallal ,  Hartmut Rudmann ,  Mario Cesana ,  Nicole Ebentheuer

IPC: H04B10/40 ,  H04B10/112 ,  H04L5/16 ,  H04B10/114 ,  H04M1/737

Abstract: An optoelectronic module includes a transceiver operable to transmit data optically. The transceiver includes a light emitter to emit light from the module, and a light detector to detect light entering the module. The light detector is disposed at a rotationally symmetric position with respect to a central axis of the module. Such modules can help facilitate the exchange of data optically between two devices.

公开(公告)号：US09634051B2

公开(公告)日：2017-04-25

申请号：US14413866

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Hartmut Rudmann ,  Markus Rossi ,  Simon Gubser

IPC: H04N5/225 ,  H01L31/0232 ,  H01L27/146 ,  G02B13/00 ,  H01L31/0203 ,  G02B21/36 ,  H01L31/054

CPC classification number: H01L27/14687 ,  G01J3/0208 ,  G01J3/0256 ,  G02B13/0085 ,  G02B21/367 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  H01L2924/00

Abstract: Then optical device comprises a first member (P) and a second member (O) and, arranged between said first and second members, a third member (S) referred to as spacer. The spacer (S) comprises —one or more portions referred to as distancing portions (Sd) in which the spacer has a vertical extension referred to as maximum vertical extension; —at least two separate portions referred to as open portions (4) in which no material of the spacer is present; and —one or more portions referred to as structured portions (Sb) in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension. Such optical devices can be used in or as multi-aperture cameras.

公开(公告)号：US09634050B2

公开(公告)日：2017-04-25

申请号：US14420010

申请日：2013-08-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L33/00 ,  H01L27/146 ,  B29D11/00 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58

CPC classification number: H01L25/165 ,  B29D11/00307 ,  B29D11/00375 ,  H01L25/167 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L31/18 ,  H01L31/1876 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Fabricating an optics wafer includes providing a wafer including a core region composed of a glass-reinforced epoxy. The wafer further includes a first resin layer on a top surface of the core region and a second resin layer on a bottom surface of the core region. The core region and first and second resin layers are substantially non-transparent for a specific range of the electromagnetic spectrum. The wafer further includes vertical transparent regions that extend through the core region and the first and second resin layers and are composed of a solid material that is substantially transparent for the specific range of the electromagnetic spectrum. The wafer is thinned, and optical structures are provided on one or more exposed surfaces of at least some of the transparent regions.

公开(公告)号：US09516152B2

公开(公告)日：2016-12-06

申请号：US14715201

申请日：2015-05-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch

IPC: H04M1/725 ,  G01J1/04 ,  B32B38/00 ,  G01V8/12 ,  H01L25/16 ,  G01S17/02 ,  G01S7/481 ,  H03K17/94 ,  H01L25/00 ,  H01L31/12 ,  H01L27/146 ,  G01J1/02 ,  H03K17/945

CPC classification number: H04M1/72527 ,  B32B38/0004 ,  G01J1/0271 ,  G01J1/0407 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L25/167 ,  H01L25/50 ,  H01L27/14643 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/12 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94108 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member, wherein the separation member is disposed between the substrate and the optics member. Multiple modules can be fabricated in a wafer-level process and can be composed of reflowable materials so that the modules can be incorporated more easily into devices whose manufacture occurs, at least in part, at elevated temperatures when the module is integrated into the device or during subsequent manufacturing processes.

公开(公告)号：US20160295133A1

公开(公告)日：2016-10-06

申请号：US15082776

申请日：2016-03-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Peter Roentgen

IPC: H04N5/33 ,  G06K9/00 ,  H04N5/238 ,  H04N9/07

CPC classification number: H04N5/332 ,  G01S17/89 ,  G03B33/04 ,  G03B33/16 ,  G03B42/00 ,  G06K9/00255 ,  G06K9/00604 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14645 ,  H01L27/14649 ,  H04N5/2256 ,  H04N5/2257 ,  H04N9/045 ,  H04N9/07

Abstract: The present disclosure describes various RGB-IR cameras, as well as new applications and methods of using such cameras. An apparatus includes an image sensor module including an image sensor. The image sensor has an active region including pixels operable to sense radiation in the visible and IR parts of the spectrum. The module can include, in some cases, a switchable IR filter disposed between the active region of the image sensor and an optical assembly. In various implementations, the module can be used in conjunction with one or more of the following: generating color images, generating IR images, performing iris recognition, performing facial recognition, and performing eye tracking/eye gazing.

Abstract translation: 本公开描述了各种RGB-IR相机，以及使用这种相机的新应用和方法。 一种装置包括包括图像传感器的图像传感器模块。 图像传感器具有活动区域，其包括可操作以感测光谱的可见光和IR部分中的辐射的像素。 在一些情况下，模块可以包括设置在图像传感器的有源区域和光学组件之间的可切换IR滤光器。 在各种实现中，该模块可以与以下一个或多个结合使用：产生彩色图像，产生IR图像，执行虹膜识别，执行面部识别和执行眼睛跟踪/眼睛注视。