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    Printed circuit board assemblies providing fault detection
    65.
    发明授权
    Printed circuit board assemblies providing fault detection 有权
    印刷电路板组件提供故障检测

    公开(公告)号：US09408294B2

    公开(公告)日：2016-08-02

    申请号：US14210759

    申请日：2014-03-14

    Applicant: General Electric Company

    Inventor： Davide Jonathan Leone

    IPC: H02H5/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34

    CPC classification number: H05K1/0201 ,  H05K1/0262 ,  H05K3/0064 ,  H05K3/3447 ,  H05K2201/0116 ,  H05K2201/10151 ,  H05K2203/0278 ,  H05K2203/1136

    Abstract: Printed circuit board assemblies providing fault detection are provided. One example printed circuit board assembly includes a substrate layer. One or more solder pins are located on a rear surface of the substrate layer. The printed circuit board assembly includes a non-conductive layer adjacent to the rear surface of the substrate layer. The printed circuit board assembly includes a conductive layer adjacent to the non-conductive layer. The conductive layer is electrically connected to a ground. The printed circuit board assembly includes a mounting surface. The printed circuit board assembly includes a support layer compressed between the conductive layer and the mounting surface. The support layer applies a mechanical force that presses the conductive layer towards the non-conductive layer.

    Abstract translation: 提供了提供故障检测的印刷电路板组件。 一个示例性印刷电路板组件包括基底层。 一个或多个焊针位于衬底层的后表面上。 印刷电路板组件包括与衬底层的后表面相邻的非导电层。 印刷电路板组件包括与非导电层相邻的导电层。 导电层电连接到地面。 印刷电路板组件包括安装表面。 印刷电路板组件包括在导电层和安装表面之间压缩的支撑层。 支撑层施加将导电层压向非导电层的机械力。

    LASER WELDING METHOD
    68.
    发明申请
    LASER WELDING METHOD 审中-公开
    激光焊接方法

    公开(公告)号：US20100224601A1

    公开(公告)日：2010-09-09

    申请号：US12429209

    申请日：2009-04-24

    Applicant: Yujiro Sugaya ,  Tomomitsu Saito

    Inventor： Yujiro Sugaya ,  Tomomitsu Saito

    IPC: B23K26/20

    CPC classification number: H01R43/0221 ,  H01R13/6585 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/328 ,  H05K2201/0112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2203/107 ,  H05K2203/1136

    Abstract: When a laser beam is incident on a thin film, carbide generated by the heat of the beam is not ejected between respective metallic thin plates. In each of second conductive sections of a metallic thin plate, a slit extends from a welding position to the end of the second conductive section. The second conductive sections are respectively welded to terminals by making the laser beam incident on the respective welding positions of a substrate for the thin film. Thereby, when the beam is incident on a resin, the resin is carbonized by the thermal energy of the laser beam and the resin carbide is ejected from the welded portion, and the carbide is discharged to the outside from the lower end of the second conductive section via the slit of the second conductive section. Thereby, the carbide is not ejected between the adjacent second conductive sections. Consequently, lowering of the insulation resistance between the respective second conductive sections due to the carbide is prevented.

    Abstract translation: 当激光束入射到薄膜上时，由光束的热量产生的碳化物不会在相应的金属薄板之间喷射。 在金属薄板的每个第二导电部分中，狭缝从焊接位置延伸到第二导电部分的端部。 通过使激光束入射到用于薄膜的基板的各个焊接位置上，将第二导电部分分别焊接到端子。 因此，当光束入射到树脂上时，树脂被激光束的热能碳化，并且树脂碳化物从焊接部分喷出，碳化物从第二导电体的下端排出到外部 通过第二导电部分的狭缝。 因此，碳化物不会在相邻的第二导电部分之间喷射。 因此，防止了由于碳化物导致的各个第二导电部分之间的绝缘电阻的降低。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    69.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    印刷线路板及其制造方法

    公开(公告)号：US20100044094A1

    公开(公告)日：2010-02-25

    申请号：US12518398

    申请日：2008-01-16

    Applicant: Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

    Inventor： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

    IPC: H05K1/11 ,  H05K3/10

    CPC classification number: H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

    Abstract: The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

    Abstract translation: 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。

    Surface Metallization Of Metal Oxide Pre-Ceramic
    70.
    发明申请
    Surface Metallization Of Metal Oxide Pre-Ceramic 审中-公开
    金属氧化物预陶瓷的表面金属化

    公开(公告)号：US20090102881A1

    公开(公告)日：2009-04-23

    申请号：US12251706

    申请日：2008-10-15

    Applicant: Henry Roskos ,  Fred Johnson

    Inventor： Henry Roskos ,  Fred Johnson

    IPC: H05K1/00 ,  B41J2/015

    CPC classification number: H05K3/105 ,  H05K1/0306 ,  H05K1/0373 ,  H05K3/244 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2203/095 ,  H05K2203/1136 ,  H05K2203/1157

    Abstract: Fine conductor lines (those having a width of ≦50 μM) are disposed on a flexible metal oxide containing substrate by masking portions of the substrate, and then surface metallizing unmasked portions of the substrate. Polymeric preceramic films are preferred, especially those having a glass temperature of at least 300° C. and those of the PZT family, or those containing BeO. All suitable reducing gasses are contemplated, including especially H2. All suitable masking materials are similarly contemplated, including especially titanium, titanium nitride, tungsten nitride, tantalum, and tantalum nitride. In especially preferred embodiments the conductor lines have a width of ≦25 μM, ≦15 μM, ≦5 μM, and even ≦1 μM. The lines can advantageously compose a circuit that is coupled to a piezoelectric or other mechanical actuator, which in turn can be fluidly coupled to a fluid reservoir.

    Abstract translation: 通过掩蔽基板的一部分，然后将基板的表面金属化未掩模的部分，将细导体线（宽度<=50μm的宽度）布置在含柔性金属氧化物的基板上。 优选聚合物前陶瓷膜，特别是具有至少300℃的玻璃温度和PZT族的那些，或含有BeO的那些。 预期所有合适的还原气体，特别是H2。 所有合适的掩蔽材料也同样考虑，特别包括钛，氮化钛，氮化钨，钽和氮化钽。 在特别优选的实施例中，导体线具有<=25μm，<=15μm，<=5μm，甚至<=1μm的宽度。 线可以有利地组成电路，其耦合到压电或其它机械致动器，其又可以流体地联接到流体储存器。

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