公开(公告)号：US09648742B2

公开(公告)日：2017-05-09

申请号：US15105723

申请日：2014-10-14

Applicant: Auto-Kabel Management GmbH

Inventor： Wacim Tazarine ,  Simon Betscher ,  Frank Gronwald

IPC: H05K7/10 ,  H05K1/14 ,  H05K1/05 ,  H05K3/36 ,  H05K7/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/28 ,  H01L23/14 ,  C23C14/04 ,  H01L23/367 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/145 ,  C23C14/042 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/056 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K1/181 ,  H05K1/182 ,  H05K3/28 ,  H05K3/282 ,  H05K3/368 ,  H05K2201/09372 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1377 ,  H01L2924/00

Abstract: Circuit having a first printed circuit board and a second printed circuit board. In the circuit, the printed circuit boards spaced apart from one another by means of an air gap are mechanically connected together by at least one power semiconductor.

公开(公告)号：US20170122502A1

公开(公告)日：2017-05-04

申请号：US14930363

申请日：2015-11-02

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl

IPC: F21K99/00 ,  H01L33/58 ,  F21V9/08

CPC classification number: H01L33/385 ,  F21K9/60 ,  F21V9/08 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: A color-conversion structure includes an article comprising a color-conversion material disposed within a color-conversion layer. At least a portion of a tether is within or extends from the article. The color-conversion structure can be disposed over a sacrificial portion of a substrate to form a micro-transfer printable device and micro-transfer printed to a display substrate. The color-conversion structure can include an light-emitting diode or laser diode that is over or under the article. Alternatively, the article is located on a side of a display substrate opposite an inorganic light-emitting diode. A display includes an array of color-conversion structures disposed on a display substrate.

公开(公告)号：US09642258B2

公开(公告)日：2017-05-02

申请号：US13865841

申请日：2013-04-18

Applicant: Brewer Science Inc.

Inventor： Liyong Diao ,  Wu-Sheng Shih ,  James E. Lamb, III ,  Christopher Landorf

IPC: H01F27/28 ,  H01F5/00 ,  H05K1/16 ,  H01G4/008 ,  H01G4/14 ,  H01G4/40 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/162 ,  H01F5/003 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/14 ,  H01G4/40 ,  H05K1/0313 ,  H05K1/097 ,  H05K1/165 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: The present invention provides novel tank circuits that are totally passive, and they are made of conductive-grade carbon nanotubes (CNTs) on substrates, and preferably flexible substrates. These components and structures contain no traditional electronic materials such as silicon, metal oxides, or ceramics, and they are totally organic. They may be used in applications where the resonant frequency and amplitude of the sensor can be modulated by a thermal, mechanical, or chemical signal, such as temperature, strain, pressure, vibration, or humidity. All-organic, and consequently combustible, passive RF sensors have unique applications for defense and consumer industries.

公开(公告)号：US09642256B2

公开(公告)日：2017-05-02

申请号：US14503451

申请日：2014-10-01

Applicant: Deere & Company

Inventor： Pablo G. Olivieri ,  Sushil Khandelwal ,  Stephen Piltingsrud ,  Mark D. Schmaltz

IPC: H05K1/00 ,  H05K7/20 ,  H05K1/14

CPC classification number: H05K1/144 ,  H05K7/20445 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/2018

Abstract: An electronic assembly comprises a first circuit board with a first substrate having an inner side and an outer side opposite the inner side. A plurality of primary components are mounted on the inner side of the first circuit board. A frame (e.g., or heat-sinking spacer) is secured to the first circuit board. A second circuit board comprises a second substrate having an inner side and an outer side opposite the first side. The second circuit board is secured to the frame and separated from the first circuit board in at least one spatial dimension. At least one secondary component is mounted on the second circuit board. A first housing section is adapted for mating with a second housing section. The first housing section and the second housing section collectively enclose the first circuit board and the second circuit board.

公开(公告)号：US09622341B2

公开(公告)日：2017-04-11

申请号：US14809714

申请日：2015-07-27

Applicant: Infineon Technologies AG

Inventor： Reinhold Bayerer

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H01L23/04

CPC classification number: H05K1/0256 ,  H01L23/04 ,  H01L2924/0002 ,  H05K1/18 ,  H05K1/181 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/0761 ,  H05K2201/09036 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A power semiconductor module includes a module housing having a top side, a first terminal group, and a second terminal group. A circuit board, which has a first electrode and a second electrode, is mountable on the power semiconductor module in such a way that in the mounted state each terminal of the first group is electrically conductively connected to the first electrode and each terminal of the second group is electrically conductively connected to the second electrode. A first isolation web and/or a second isolation web is provided. Each isolation web is fixed to the circuit board even in the unmounted state, and arranged between the first terminal group and the second terminal group in the mounted state.

公开(公告)号：US20170048971A1

公开(公告)日：2017-02-16

申请号：US15339037

申请日：2016-10-31

Applicant: Ellenberger & Poensgen GmbH

Inventor： Wolfgang ULLERMANN ,  Peter MECKLER ,  Manuel ENGEWALD ,  Matthias SCHWARZ ,  Ewald SCHNEIDER ,  Markus MIKLIS

IPC: H05K1/02 ,  H01L25/07 ,  H01L23/00

CPC classification number: H05K1/0263 ,  F02N11/087 ,  F02N2011/0874 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/00014 ,  H01L2924/13091 ,  H02M7/00 ,  H05K3/3421 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.

Abstract translation: 除了具有控制连接和第一传输连接以及第二传输连接的第一半导体开关之外，具有第一母线，第二母线的大电流开关，特别是用于机动车辆的高电流开关。 第一传输连接被放置成与第一母线直接接触，并且第二传输连接被放置成与第二母线直接电接触。

公开(公告)号：US20170034913A1

公开(公告)日：2017-02-02

申请号：US14811325

申请日：2015-07-28

Applicant: Infineon Technologies AG

Inventor： Qianli Mu ,  Cristian Gozzi ,  Michael Simcoe ,  Guillaume Bigny

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01L23/142 ,  H01L23/64 ,  H01L2224/49175 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/182 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09327 ,  H05K2201/09336 ,  H05K2201/09481 ,  H05K2201/0959 ,  H05K2201/10166 ,  H05K2203/049

Abstract: A semiconductor package includes a metal baseplate, a semiconductor die having a reference terminal attached to the baseplate and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the baseplate and a second side facing away from the baseplate. The multilayer circuit board includes a plurality of interleaved signal and ground layers. One of the signal layers is at the second side of the multilayer circuit board and electrically connected to the RF terminal of the semiconductor die. One of the ground layers is at the first side of the multilayer circuit board and attached to the metal baseplate. Power distribution structures are formed in the signal layer at the second side of the multilayer circuit board. RF matching structures are formed in a different one of the signal layers than the power distribution structures.

Abstract translation: 半导体封装包括金属基板，具有附接到基板的参考端子的半导体管芯和远离基板的RF端子，以及多层电路板，其具有附接到基板的第一侧和远离基板的第二侧 底盘。 多层电路板包括多个交错信号和接地层。 信号层中的一个位于多层电路板的第二侧并电连接到半导体管芯的RF端子。 其中一个接地层位于多层电路板的第一侧并附着在金属底板上。 功率分配结构形成在多层电路板的第二侧的信号层中。 RF匹配结构形成在与功率分配结构不同的信号层中。

公开(公告)号：US09554470B2

公开(公告)日：2017-01-24

申请号：US14572348

申请日：2014-12-16

Applicant: Coilcraft, Incorporated

Inventor： Stephen Michael Sedio

IPC: H05K1/18 ,  H01L21/00 ,  H05K1/11 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H05K3/34

CPC classification number: H05K1/183 ,  H01F5/04 ,  H05K1/181 ,  H05K3/341 ,  H05K5/0095 ,  H05K7/005 ,  H05K7/20127 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49105 ,  Y10T29/4913

Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

Abstract translation: 一种集成电子组件，包括限定插座的第一电子部件和至少第二电子部件，其中第二电子部件的至少一部分设置在第一电子部件的插座中，以及用于节省电路中的空间的方法或 通过集成多个电子部件，使得多个电子部件在多个电子部件未集成的情况下，在多个电子部件上共同地占用比基板多的空间的印刷电路板。

公开(公告)号：US09520537B2

公开(公告)日：2016-12-13

申请号：US14743981

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L29/20 ,  H01L33/00 ,  H01L33/38 ,  G09G3/32 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  H01L33/62 ,  H01L33/20 ,  H01L33/40

CPC classification number: H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US20160345424A1

公开(公告)日：2016-11-24

申请号：US15159393

申请日：2016-05-19

Applicant: Tomoyoshi Kobayashi ,  Masato Kasashima

Inventor： Tomoyoshi Kobayashi ,  Masato Kasashima

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/05 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09854 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/063

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract translation: 印刷电路板包括：基底构件; 设置在所述基座部件中的凹部; 安装在所述凹部中的散热构件; 以及经由绝缘体设置在基座构件的上侧和散热构件上的布线图案。 形成有凹部的内周面和散热构件的外周面彼此接触的接触部以及彼此接触的分离部。 凹部与散热构件之间的间隙填充有通过加热熔化的基底构件的热固性树脂。 布线图案的宽度方向的至少一部分通过与分离部垂直重叠的位置，其整个部分未穿过与接触部分垂直重叠的位置。