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    Electrical component
    63.
    发明授权
    Electrical component 有权
    电气部件

    公开(公告)号：US07952197B2

    公开(公告)日：2011-05-31

    申请号：US12503651

    申请日：2009-07-15

    Applicant: Peter Stoehr ,  Patric Heide ,  Johann Heyen ,  Kostyantyn Markov

    Inventor： Peter Stoehr ,  Patric Heide ,  Johann Heyen ,  Kostyantyn Markov

    IPC: H01L23/34 ,  H01L23/48

    CPC classification number: H01L23/5386 ,  H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H03H9/0566 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/16 ,  H05K2201/0723 ,  H05K2201/09972 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: The invention discloses an electrical component with a carrier substrate, on which at least one semiconductor chip is mounted. Terminal areas are arranged on the underside of the carrier substrate and contact areas designed for the assembly with semiconductor chips are arranged on the upper side. The carrier substrate has a functional area that is divided into sections, wherein each section is assigned at least one function such as, e.g., as a filter, a frequency-separating filter, a balun, etc. A separate area of the carrier substrate is assigned to each section. The following applies to at least one of the sections: the contact area and/or the terminal area that is conductively connected to the section lies outside the base of this section. The connecting line that conductively connects the input or output of the respective section to the contact area and/or the terminal area is preferably shielded from the section by a ground area.

    Abstract translation: 本发明公开了一种具有载体基板的电气部件，其上安装有至少一个半导体芯片。 端子区域布置在载体基板的下侧，并且设计用于具有半导体芯片的组装的接触区域布置在上侧。 载体基板具有被划分为多个部分的功能区域，其中每个部分被分配至少一个功能，例如作为滤波器，频率分离滤波器，平衡 - 不平衡转换器等。载体基板的单独区域是 分配到每个部分。 以下内容适用于至少一个部分：与该部分导电连接的接触区域和/或终端区域位于本部分的基础之外。 将各部分的输入或输出导电地连接到接触区域和/或端子区域的连接线优选地通过接地区域与该部分屏蔽。

    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF
    64.
    发明申请
    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF 有权
    散热基板及其制造方法

    公开(公告)号：US20110061901A1

    公开(公告)日：2011-03-17

    申请号：US12614407

    申请日：2009-11-07

    Applicant: Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

    Inventor： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

    IPC: H05K1/00 ,  H05K3/00

    CPC classification number: H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

    Abstract: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

    Abstract translation: 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

    REDUCING CROSS-TALK IN HIGH SPEED CERAMIC PACKAGES USING SELECTIVELY-WIDENED MESH
    65.
    发明申请
    REDUCING CROSS-TALK IN HIGH SPEED CERAMIC PACKAGES USING SELECTIVELY-WIDENED MESH 审中-公开
    使用选择性更宽的MESH降低高速陶瓷包装中的交叉点

    公开(公告)号：US20110061898A1

    公开(公告)日：2011-03-17

    申请号：US12560133

    申请日：2009-09-15

    Applicant: Bhyrav Mutnury ,  Jinwoo Choi ,  Moises Cases ,  Nanju Na

    Inventor： Bhyrav Mutnury ,  Jinwoo Choi ,  Moises Cases ,  Nanju Na

    IPC: H05K1/00 ,  G06F17/50 ,  H05K3/00

    CPC classification number: H05K1/0224 ,  G06F17/5036 ,  G06F17/5081 ,  G06F2217/82 ,  H05K3/4629 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/09972 ,  Y10T29/49155

    Abstract: One embodiment of the invention provides a multi-layered ceramic package. The ceramic package includes a signal layer having a plurality of signal lines and a mesh reference layer parallel to the signal layer. The mesh reference layer includes a plurality of intersecting reference lines of varying reference-line width in the plane of the mesh layer. The mesh reference lines may be widened in locations of probable signal cross-talk. Other embodiments of the invention include software for optimizing a ceramic package design by selectively widening mesh lines in regions of probable cross-talk, and systems for designing and manufacturing such a ceramic package.

    Abstract translation: 本发明的一个实施例提供一种多层陶瓷封装。 陶瓷封装包括具有多个信号线的信号层和与信号层平行的网格参考层。 网格参考层包括在网格层的平面中改变参考线宽度的多个相交参考线。 网格参考线可能在可能的信号串扰的位置加宽。 本发明的其它实施例包括通过在可能的串扰区域中选择性地加宽网格线来优化陶瓷封装设计的软件，以及用于设计和制造这种陶瓷封装的系统。

    CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
    67.
    发明申请
    CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE 审中-公开
    电路板模块和电子设备

    公开(公告)号：US20110013368A1

    公开(公告)日：2011-01-20

    申请号：US12863175

    申请日：2008-03-03

    Applicant: Shotaro Nagaike

    Inventor： Shotaro Nagaike

    IPC: H05K7/00

    CPC classification number: H05K9/0032 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018

    Abstract: There are provided a circuit board module that can ease adverse effect due to radiation developing between a fragile circuit vulnerable to unwanted radiation and other circuits and that can diminish overall radiation to the outside of the module and an electronic device having the circuit board module.The circuit board module includes a board 1 having a mount surface; a first electronic component and a second electronic component 3 respectively mounted on the mount surface; a first frame element 4 that surrounds the first electronic component 2 and the second electronic component 3, that is mounted on the mount surface, and that exhibits conductivity; a second frame element 5 that surrounds the second electronic component 3, that is mounted on an inside of the first frame element 4 and on the mount surface, and that exhibits conductivity; a first resin portion 6 that is situated between the first frame element 4 and the second frame element 5 and that closely contacts the first electronic component, the mount surface, the first frame element 4, and the second frame element 5; a second resin portion 7 that is situated on an inside of the second frame element 5 and that closely contacts the mount surface of the second electronic component 3 and the second frame element 5; a first cover portion 8 that covers the first electronic component, the second electronic component 3, and the second frame element 5, that exhibits conductivity, and that is connected to the first frame element 4; and a second cover portion 9 that is connected by means of contact points of the second frame element 5 and that covers the second frame element 5.

    Abstract translation: 提供了一种电路板模块，其可以减轻由于易受不想要的辐射的脆弱的电路之间的辐射的不利影响和其他电路，并且可以减少到模块的外部的整体辐射以及具有电路板模块的电子设备。 电路板模块包括具有安装表面的板1; 分别安装在安装表面上的第一电子部件和第二电子部件3; 围绕安装在安装表面上并且显示导电性的第一电子部件2和第二电子部件3的第一框架元件4; 围绕第二电子部件3的第二框架元件5，其安装在第一框架元件4的内部和安装表面上并且显示导电性; 第一树脂部分6，其位于第一框架元件4和第二框架元件5之间，并且紧密接触第一电子部件，安装表面，第一框架元件4和第二框架元件5; 第二树脂部分7，其位于第二框架元件5的内侧并且紧密接触第二电子部件3和第二框架元件5的安装表面; 覆盖第一电子部件的第一盖部8，显示导电性的第二电子部件3和第二框架元件5，并且连接到第一框架元件4; 以及通过第二框架元件5的接触点连接并覆盖第二框架元件5的第二盖部分9。

    Novel Metal Core Multi-LED SMD Package and Method of Producing the Same
    68.
    发明申请
    Novel Metal Core Multi-LED SMD Package and Method of Producing the Same 失效
    新型金属芯多LED SMD封装及其制造方法

    公开(公告)号：US20100230689A1

    公开(公告)日：2010-09-16

    申请号：US12404309

    申请日：2009-03-15

    Applicant: Lijun Cui

    Inventor： Lijun Cui

    IPC: H01L33/00

    CPC classification number: H05K3/202 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/06 ,  H05K2201/09118 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00

    Abstract: A new SMD (surface mount devices) package design for efficiently removing heat from LED Chip(s) is involved in this invention. Different from the regular SMD package, which electrical isolated materials like Alumina or AlN are used, the substrate material here is metal like Copper, Aluminum and so on. Also, different from regular design, which most time only has one LED chip inside, current design will at least have two or more LED chips (or chip groups) in one package. All chips are electrical connected via metal blocks, traces or wire-bond. This type of structure is generally fabricated via chemical etching and then filled with dielectric material inside to form a strong package. Because the thermal conductivity of the metal is much higher than the ceramics, the package thermal resistance is much lower than the ceramics based package. Also, the cost of the package is much lower than ceramics package. Moreover, emitting area in one package is much larger than the current arts.

    Abstract translation: 本发明涉及用于有效地从LED芯片去除热量的新的SMD（表面贴装器件）封装设计。 与常规SMD封装不同，使用了诸如氧化铝或AlN的电隔离材料，这里的基板材料是金属如铜，铝等。 此外，与常规设计不同的是，大多数时间内只有一个LED芯片，目前的设计将至少在一个封装中有两个或更多个LED芯片（或芯片组）。 所有芯片通过金属块，迹线或线接电连接。 这种类型的结构通常通过化学蚀刻制造，然后在其内填充介电材料以形成强封装。 由于金属的导热率远高于陶瓷，所以封装的热阻远低于陶瓷封装。 此外，封装的成本远低于陶瓷封装。 此外，一个封装中的发光面积远远大于当前的技术。

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