公开(公告)号：US11953710B2

公开(公告)日：2024-04-09

申请号：US17032483

申请日：2020-09-25

申请人： DAI NIPPON PRINTING CO., LTD.

发明人： Satoshi Emori ,  Takashi Kuroda

IPC分类号： G02B5/30 ,  C09K19/34 ,  C09K19/38 ,  C09K19/54 ,  C09K19/58 ,  H10K50/11 ,  H10K50/84 ,  H10K50/858 ,  H10K50/86 ,  H10K85/00 ,  G02F1/13363 ,  H01L25/075

CPC分类号： G02B5/3083 ,  C09K19/3477 ,  C09K19/3491 ,  C09K19/3857 ,  C09K19/3861 ,  C09K19/544 ,  C09K19/586 ,  G02B5/3016 ,  H10K50/11 ,  H10K50/84 ,  H10K50/858 ,  H10K50/86 ,  H10K85/731 ,  G02F1/133633 ,  G02F1/133638 ,  H01L25/075

摘要： The present invention provides a display panel in which deterioration of color tone may be suppressed regardless of the reflectance of the display element.
A display panel including a display element (A), a retardation layer (B) positioned upon the light emission surface side of the display element, and a polarizer (C) positioned upon the light emission surface side of the retardation layer, in which the retardation layer (B) has a λ/4 retardation layer (B1), and the in-plane retardation of the λ/4 retardation layer (B1) satisfies the following Condition 1:

The spectral reflectance of the display element is measured by an SCI method, the average reflectance at wavelengths over the range of 400 nm or more and less than 550 nm is obtained as R1, the average reflectance at wavelengths over the range of 550 nm or more and less than 700 nm is obtained as R2, and when the value of R1/R2 is calculated and obtained as x, the in-plane retardation of the λ/4 retardation layer falls within the range of −4.6002x+119.24 nm or more and −4.6002x+129.24 nm or less.

公开(公告)号：US11942450B2

公开(公告)日：2024-03-26

申请号：US17529365

申请日：2021-11-18

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  Centre National de la Recherche Scientifique

发明人： Melina Haupt

IPC分类号： H01L23/00 ,  H01L25/075

CPC分类号： H01L24/75 ,  H01L24/95 ,  H01L25/075 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/1415 ,  H01L2224/75655 ,  H01L2224/7598 ,  H01L2224/81085 ,  H01L2224/95085 ,  H01L2224/95101

摘要： A cell of fluidic assembly of microchips on a substrate, including: a base having its upper surface intended to receive the substrate; a body laterally delimiting a fluidic chamber above the substrate; and a cover closing the fluidic chamber from its upper surface, wherein the body comprises first and second nozzles respectively emerging onto opposite first and second lateral edges of the fluidic chamber, each of the first and second nozzles being adapted to injecting and/or sucking in a liquid suspension of microchips into and/or from the fluidic chamber, in a direction parallel to the mean plane of the substrate.

公开(公告)号：US20230395585A1

公开(公告)日：2023-12-07

申请号：US18203916

申请日：2023-05-31

申请人： JADE BIRD DISPLAY (SHANGHAI) LIMITED

发明人： Yang YUE ,  Jing JU

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L23/31

CPC分类号： H01L25/167 ,  H01L24/48 ,  H01L2224/48225 ,  H01L23/3157 ,  H01L25/075

摘要： A micro package structure includes a micro LED panel comprising an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate, the IC substrate comprising a first connected area corresponding to the micro LED array area and a second connected area away from the first connected area, a plurality of signal metal pads are formed on the second connected area; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and one or more bonding wires to connect the signal metal pads with an external circuit.

公开(公告)号：US11705441B2

公开(公告)日：2023-07-18

申请号：US17359679

申请日：2021-06-28

申请人： PlayNitride Display Co., Ltd.

发明人： Sheng-Yuan Sun ,  Ying-Tsang Liu ,  Yi-Ching Chen ,  Pei-Hsin Chen ,  Yi-Chun Shih ,  Tzu-Yang Lin ,  Yu-Hung Lai

IPC分类号： H01L25/075 ,  H01L27/15

CPC分类号： H01L25/0753 ,  H01L25/075 ,  H01L27/153 ,  H01L27/156

摘要： A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

公开(公告)号：US20230145241A1

公开(公告)日：2023-05-11

申请号：US18149380

申请日：2023-01-03

申请人： InnoLux Corporation

发明人： Kuan-Feng LEE ,  Yuan-Lin WU ,  Yu-Hsien WU

IPC分类号： G06F3/041 ,  H10K59/40 ,  G06F3/044 ,  H05K1/18 ,  H01L25/075

CPC分类号： G06F3/0416 ,  H01L27/323 ,  G06F3/044 ,  G06F3/0412 ,  H05K1/189 ,  H01L25/075

摘要： A display device is provided. The display device includes a substrate having a first edge and a second edge opposite to the first edge. There is a first distance between the first edge and the second edge. The display device also includes a plurality of light-emitting units disposed on the substrate, and a conductive line disposed on the substrate and electrically connected to at least one of the plurality of light-emitting units. The conductive line includes an undulating edge and has an extending length which is greater than or equal to half of the first distance and is less than or equal to the first distance.

公开(公告)号：US20180358335A1

公开(公告)日：2018-12-13

申请号：US16059019

申请日：2018-08-08

申请人： LUMENS CO., LTD.

发明人： Taekyung YOO ,  Daewon KIM ,  Jinmo KIM ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Sol HAN ,  Kyujin LEE

IPC分类号： H01L25/075 ,  H01L23/00 ,  H01L21/67 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L25/0753 ,  H01L21/67144 ,  H01L21/677 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/60 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2221/68395 ,  H01L2224/1403 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/95001 ,  H01L2224/9511 ,  H01L2224/95115 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2933/0066 ,  H05K999/99

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US20180350783A1

公开(公告)日：2018-12-06

申请号：US16059017

申请日：2018-08-08

申请人： LUMENS CO., LTD.

发明人： Taekyung YOO ,  Daewon KIM ,  Jinmo KIM ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Sol HAN ,  Kyujin LEE

IPC分类号： H01L25/075 ,  H01L23/00 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L25/0753 ,  H01L21/67144 ,  H01L21/677 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/60 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2221/68395 ,  H01L2224/1403 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/95001 ,  H01L2224/9511 ,  H01L2224/95115 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2933/0066 ,  H05K999/99

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US20180175237A1

公开(公告)日：2018-06-21

申请号：US15820930

申请日：2017-11-22

申请人： OSRAM Opto Semiconductor GmbH

发明人： Alexander Linkov ,  Frank Singer ,  Matthias Bruckschloegl ,  Siegfried Herrmann ,  Jürgen Moosburger ,  Thomas Schwarz

IPC分类号： H01L33/00 ,  H01L25/075

CPC分类号： H01L33/0008 ,  H01L25/075 ,  H01L33/38 ,  H01L33/486 ,  H01L33/62 ,  H01L2933/005

摘要： A component includes a light emitting semiconductor chip, wherein the semiconductor chip includes a layer arrangement including a plurality of layers, the p-conducting layer and the n-conducting layer adjoin one another in an active zone, a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the semiconductor chip, a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, the second side being situated opposite the first side of the semiconductor chip, the first side of the semiconductor chip transitions into the second side via an end side, the semiconductor chip is secured by the end side on a substrate, the substrate includes a first and second further electrical contact, and the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.

公开(公告)号：US09978728B2

公开(公告)日：2018-05-22

申请号：US15603482

申请日：2017-05-24

申请人： Innolux Corporation ,  Advanced Optoelectronic Technology Inc.

发明人： Chun-Hsien Lin ,  Tsau-Hua Hsieh ,  Po-Min Tu ,  Tzu-Chien Hung ,  Chien-Chung Peng ,  Shih-Cheng Huang

IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L27/15 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L25/075 ,  H01L25/0756 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/15 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

摘要： A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.

公开(公告)号：US20180068986A1

公开(公告)日：2018-03-08

申请号：US15793030

申请日：2017-10-25

申请人： LUMENS CO., LTD.

发明人： Taekyung YOO ,  Daewon KIM ,  Jinmo KIM ,  Jinwon CHOI ,  Jimin HER ,  Younghwan SHIN ,  Sol HAN ,  Kyujin LEE

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L21/683

CPC分类号： H01L25/0753 ,  H01L21/67144 ,  H01L21/677 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/60 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2221/68395 ,  H01L2224/1403 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/95001 ,  H01L2224/9511 ,  H01L2224/95115 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2933/0066

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.