-
公开(公告)号：US12021171B2
公开(公告)日：2024-06-25
申请号：US17211845
申请日：2021-03-25
发明人： Tzu-Yang Lin , Yen-Chun Tseng , Yun-Syuan Chou , Fei-Hong Chen , Pai-Yang Tsai , Jian-Zhi Chen
CPC分类号： H01L33/382 , H01L27/156 , H01L33/62
摘要： A micro light emitting diode including an epitaxy layer, a first pad, a second pad, a first ohmic contact metal, a second ohmic contact metal and at least one etch protection conductive layer is provided. The first pad and the second pad are electrically connected to a first type semiconductor layer and a second type semiconductor layer of the epitaxy layer, respectively. The first ohmic contact metal is disposed between the first type semiconductor layer and the first pad. The second ohmic contact metal is disposed between the second type semiconductor layer and the second pad. The at least one etch protection conductive layer is disposed between the first ohmic contact metal and the first pad and/or between the second ohmic contact metal and the second pad. A display panel is also provided.
-
公开(公告)号：US20240097067A1
公开(公告)日：2024-03-21
申请号：US18527387
申请日：2023-12-04
发明人： Bo-Wei Wu , Yu-Yun Lo , Chien-Chen Kuo , Chang-Feng Tsai , Tzu-Yang Lin
IPC分类号： H01L33/00 , H01L21/66 , H01L21/683 , H01L25/075 , H01L33/62
CPC分类号： H01L33/0095 , H01L21/6835 , H01L22/22 , H01L25/0753 , H01L33/62 , G09G3/32 , H01L2933/0066
摘要： A manufacturing method of an electronic element module is provided. The method includes: disposing a plurality of first micro-light-emitting diodes on a first temporary substrate; and replacing at least one defective micro-light-emitting diode of the first micro-light-emitting diodes with at least one second micro-light-emitting diode. The first micro-light-emitting diodes and at least one second micro-light-emitting diode are distributed on the first temporary substrate. The first micro-light-emitting diodes and at least one second micro-light-emitting diode have same properties, and at least one of the appearance difference, the height difference and the orientation difference exists between the first micro-light-emitting diodes and at least one second micro-light-emitting diode. A semiconductor structure and a display panel are also provided.
-
公开(公告)号：US20230343897A1
公开(公告)日：2023-10-26
申请号：US17748049
申请日：2022-05-19
发明人： You-Lin Peng , Wan-Jung Peng , Fei-Hong Chen , Pai-Yang Tsai , Tzu-Yang Lin
CPC分类号： H01L33/382 , H01L33/62
摘要： A micro light emitting diode structure including an epitaxial structure, an electrode layer and a barrier layer is provided. The epitaxial structure has a surface. The electrode layer is disposed on the surface of the epitaxial structure. The barrier layer is disposed on the electrode layer. An orthogonal projection area of the barrier layer on the epitaxial structure is greater than and covers an orthogonal projection area of the electrode layer on the epitaxial structure.
-
公开(公告)号：US11705441B2
公开(公告)日：2023-07-18
申请号：US17359679
申请日：2021-06-28
发明人： Sheng-Yuan Sun , Ying-Tsang Liu , Yi-Ching Chen , Pei-Hsin Chen , Yi-Chun Shih , Tzu-Yang Lin , Yu-Hung Lai
IPC分类号： H01L25/075 , H01L27/15
CPC分类号： H01L25/0753 , H01L25/075 , H01L27/153 , H01L27/156
摘要： A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.
-
公开(公告)号：US11387387B2
公开(公告)日：2022-07-12
申请号：US16862582
申请日：2020-04-30
发明人： Chih-Ling Wu , Yen-Yeh Chen , Yi-Min Su , Yi-Chun Shih , Bo-Wei Wu , Yu-Yun Lo , Ying-Ting Lin , Tzu-Yang Lin
IPC分类号： H01L33/38 , H01L25/075 , H01L33/40
摘要： A micro light emitting device display apparatus including a circuit substrate, a plurality of micro light emitting devices, a first common electrode layer, and a second common electrode layer is provided. The micro light emitting devices are disposed on the circuit substrate and individually include an epitaxial structure and a first-type electrode and a second-type electrode respectively disposed on two side surfaces of the epitaxial structure opposite to each other. The first common electrode layer is disposed on the circuit substrate and directly covers the plurality of first-type electrodes of the micro light emitting devices. The second common electrode layer is disposed between the micro light emitting devices. The first common electrode layer is electrically connected to the second common electrode layer.
-
公开(公告)号：US11094677B2
公开(公告)日：2021-08-17
申请号：US16677672
申请日：2019-11-08
发明人： Sheng-Yuan Sun , Ying-Tsang Liu , Yi-Ching Chen , Pei-Hsin Chen , Yi-Chun Shih , Tzu-Yang Lin , Yu-Hung Lai
IPC分类号： H01L25/075 , H01L27/15
摘要： A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.
-
公开(公告)号：US10937826B2
公开(公告)日：2021-03-02
申请号：US16436333
申请日：2019-06-10
发明人： Ying-Tsang Liu , Pei-Hsin Chen , Yi-Chun Shih , Yi-Ching Chen , Yu-Chu Li , Huan-Pu Chang , Tzu-Yang Lin , Yu-Hung Lai
摘要： A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L1 of the upper portion in the first direction is greater than the length L2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.
-
公开(公告)号：US20200176509A1
公开(公告)日：2020-06-04
申请号：US16436333
申请日：2019-06-10
发明人： Ying-Tsang Liu , Pei-Hsin Chen , Yi-Chun Shih , Yi-Ching Chen , Yu-Chu Li , Huan-Pu Chang , Tzu-Yang Lin , Yu-Hung Lai
摘要： A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L1 of the upper portion in the first direction is greater than the length L2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.
-
公开(公告)号：US20220246798A1
公开(公告)日：2022-08-04
申请号：US17211845
申请日：2021-03-25
发明人： Tzu-Yang Lin , Yen-Chun Tseng , Yun-Syuan Chou , Fei-Hong Chen , Pai-Yang Tsai , Jian-Zhi Chen
摘要： A micro light emitting diode including an epitaxy layer, a first pad, a second pad, a first ohmic contact metal, a second ohmic contact metal and at least one etch protection conductive layer is provided. The first pad and the second pad are electrically connected to a first type semiconductor layer and a second type semiconductor layer of the epitaxy layer, respectively. The first ohmic contact metal is disposed between the first type semiconductor layer and the first pad. The second ohmic contact metal is disposed between the second type semiconductor layer and the second pad. The at least one etch protection conductive layer is disposed between the first ohmic contact metal and the first pad and/or between the second ohmic contact metal and the second pad. A display panel is also provided.
-
公开(公告)号：US20210327858A1
公开(公告)日：2021-10-21
申请号：US17359679
申请日：2021-06-28
发明人： Sheng-Yuan Sun , Ying-Tsang Liu , Yi-Ching Chen , Pei-Hsin Chen , Yi-Chun Shih , Tzu-Yang Lin , Yu-Hung Lai
IPC分类号： H01L25/075 , H01L27/15
摘要： A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.
-
-
-
-
-
-
-
-
-
搜索结果
47 条记录 (耗时 0.021 秒)
