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公开(公告)号：US20230395585A1
公开(公告)日：2023-12-07
申请号：US18203916
申请日：2023-05-31
IPC分类号： H01L25/16 , H01L23/00 , H01L25/075 , H01L23/31
CPC分类号： H01L25/167 , H01L24/48 , H01L2224/48225 , H01L23/3157 , H01L25/075
摘要： A micro package structure includes a micro LED panel comprising an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate, the IC substrate comprising a first connected area corresponding to the micro LED array area and a second connected area away from the first connected area, a plurality of signal metal pads are formed on the second connected area; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and one or more bonding wires to connect the signal metal pads with an external circuit.
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公开(公告)号：US20230395584A1
公开(公告)日：2023-12-07
申请号：US18203906
申请日：2023-05-31
发明人： Yang YUE
CPC分类号： H01L25/167 , H01L25/165 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/06051 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2224/49175
摘要： A micro package structure includes a micro LED panel including an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and a seal structure formed between an edge of the micro LED panel and an edge of the top cover plane around the micro LED array area.
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